



Post Sourcing Request

Shenzhen Ponda Grinding Technology Co.,Ltd.

Guangdong, China

Business Type:

Manufacturer/Factory & Trading Company

Main Products:

Lapping Machine , Polishing Machine , Grinding Machine , Wafer Grinder , Single Plate Lapping & ...

Year of Establishment:

2007-03-10

Number of Employees:

60

Address:

Fangda Industrial Park, Guangming, Shenzhen, Guangdong, China

OEM/ODM Service

Sample Available

Visit My Factory

Secured Trading Service

Lapping Machine, Polishing Machine, Lathe Machine manufacturer / supplier in China, offering The Fonda Precision CMP Polishing Machine Is Suitable for 4.6.8 "Wafer Film Four-Axis Processing Polishing Equipment, Precision CMP Polishing Machine CMP Chemical Mechanical Polishing Machine Wafer Processing and Polishing Equipment, Precision Equipment Wafer Grinding Machine Thinning Machine Fast Thinning Grinding Incoming Material Processing and so on.

Diamond Member Since 2021

Suppliers with verified business licenses

Audited Supplier

Supplier Homepage Products Wafer Grinder

Contact Supplier

Ms. Katherine

Wafer Grinder

Total 116 Wafer Grinder Products

5/5

Custom Vacuum Sucker Precision High Speed 320 Vertical Thinning Machine

Custom Vacuum Sucker Precision High Speed 320 Vertical Thinning Machine

FOB Price: US $20,000-60,000 / Piece

Min. Order: 1 Piece

Contact Now

Pangda High Precision Silicon Wafer Single-Side Grinding and Thinning Equipment

Pangda High Precision Silicon Wafer Single-Side Grinding and Thinning Equipment

FOB Price: US $8,000-20,000 / Piece

Min. Order: 1 Piece

Contact Now

Specializes in The Production of Wafer Grinding Machines Silicon Wafer Thinning Machines

Specializes in The Production of Wafer Grinding Machines Silicon Wafer Thinning Machines

FOB Price: US $8,000-20,000 / Piece

Min. Order: 1 Piece

Contact Now

Ponda High Precision Crystal Speed Vertical Thinning Equipment

Ponda High Precision Crystal Speed Vertical Thinning Equipment

FOB Price: US $20,000-60,000 / Piece

Min. Order: 1 Piece

Contact Now

Automatic High Speed Silicon Wafer High Speed Transverse Thinning Machine

Automatic High Speed Silicon Wafer High Speed Transverse Thinning Machine

FOB Price: US $20,000-60,000 / Piece

Min. Order: 1 Piece

Contact Now

The New Vertical High-Speed Transverse Thinning Equipment Is Suitable for Wafer Thinning

The New Vertical High-Speed Transverse Thinning Equipment Is Suitable for Wafer Thinning

FOB Price: US $20,000-60,000 / Piece

Min. Order: 1 Piece

Contact Now

Wafer Thinning Ceramic Silicon Carbide Precision Thinning Machine

Wafer Thinning Ceramic Silicon Carbide Precision Thinning Machine

FOB Price: US $20,000-60,000 / Piece

Min. Order: 1 Piece

Contact Now

Wafer Grinding, Polishing and Thinning New Technologies

Wafer Grinding, Polishing and Thinning New Technologies

FOB Price: US $20,000-60,000 / Piece

Min. Order: 1 Piece

Contact Now

Vertical High-Precision Sapphire Thinning Grinding Machine for Plane Processing

Vertical High-Precision Sapphire Thinning Grinding Machine for Plane Processing

FOB Price: US $20,000-60,000 / Piece

Min. Order: 1 Piece

Contact Now

Shenzhen Fangda High Precision Silicon Wafer Single Side Grinding/Thinning Equipment Processing Sample

Shenzhen Fangda High Precision Silicon Wafer Single Side Grinding/Thinning Equipment Processing Sample

FOB Price: US $20,000-60,000 / Piece

Min. Order: 1 Piece

Contact Now

Sapphire Thinning Machine, According to Different Process Requirements of Frequency Conversion Speed Regulation Drive Mode

Sapphire Thinning Machine, According to Different Process Requirements of Frequency Conversion Speed Regulation Drive Mode

FOB Price: US $20,000-60,000 / Piece

Min. Order: 1 Piece

Contact Now

Fonda Fd200A Reducer with Point Measuring System Reducer for Silicon Carbide

Fonda Fd200A Reducer with Point Measuring System Reducer for Silicon Carbide

FOB Price: US $20,000-60,000 / Piece

Min. Order: 1 Piece

Contact Now

China Fangda Manufacturing Wafer Grinding Machine Thinning Machine Precision Single-Axis Grinding Thinning Equipment Machine

China Fangda Manufacturing Wafer Grinding Machine Thinning Machine Precision Single-Axis Grinding Thinning Equipment Machine

FOB Price: US $20,000-60,000 / Piece

Min. Order: 1 Piece

Contact Now

China Fangda Precision Equipment Wafer Grinding Machine Thinning Machine Fast Thinning Grinding Incoming Material Processing

China Fangda Precision Equipment Wafer Grinding Machine Thinning Machine Fast Thinning Grinding Incoming Material Processing

FOB Price: US $20,000-60,000 / Piece

Min. Order: 1 Piece

Contact Now

China Fangda Manufacturing Various Materials Grinding Machine Transverse Machine Grinding Machine

China Fangda Manufacturing Various Materials Grinding Machine Transverse Machine Grinding Machine

FOB Price: US $20,000-60,000 / Piece

Min. Order: 1 Piece

Contact Now

Fanda Manufacturer Fd300QA Precision Single-Axis Thinning Machine High Efficiency Grinding Machine Thinning Equipment

Fanda Manufacturer Fd300QA Precision Single-Axis Thinning Machine High Efficiency Grinding Machine Thinning Equipment

FOB Price: US $20,000-60,000 / Piece

Min. Order: 1 Piece

Contact Now

China Fangda Manufacturing Silicon Wafer Sapphire Substrate Material Thinning Machine Grinding Machine

China Fangda Manufacturing Silicon Wafer Sapphire Substrate Material Thinning Machine Grinding Machine

FOB Price: US $20,000-60,000 / Piece

Min. Order: 1 Piece

Contact Now

Automatic Fd-3005A Wafer Thinning Machine Automatic Grinding Machine Thinning Grinding Equipment

Automatic Fd-3005A Wafer Thinning Machine Automatic Grinding Machine Thinning Grinding Equipment

FOB Price: US $8,000-20,000 / Piece

Min. Order: 1 Piece

Contact Now

China Fangda Manufacturing Silicon Wafer Sapphire Substrate Material Thinning Machine Grinding Machine

China Fangda Manufacturing Silicon Wafer Sapphire Substrate Material Thinning Machine Grinding Machine

FOB Price: US $20,000-60,000 / Piece

Min. Order: 1 Piece

Contact Now

Precision Equipment Wafer Grinding Machine Thinning Machine Fast Thinning Grinding Incoming Material Processing

Precision Equipment Wafer Grinding Machine Thinning Machine Fast Thinning Grinding Incoming Material Processing

FOB Price: US $20,000-60,000 / Piece

Min. Order: 1 Piece

Contact Now

Show: 24 36 48