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Shenzhen Ponda Grinding Technology Co.,Ltd.
Guangdong, China
Business Type:
Manufacturer/Factory & Trading Company
Main Products:
Lapping Machine , Polishing Machine , Grinding Machine , Wafer Grinder , Single Plate Lapping & ...
Year of Establishment:
2007-03-10
Number of Employees:
60
Address:
Fangda Industrial Park, Guangming, Shenzhen, Guangdong, China
OEM/ODM Service
Sample Available
Visit My Factory
Secured Trading Service

Lapping Machine, Polishing Machine, Lathe Machine manufacturer / supplier in China, offering Fangda Is a Professional Manufacturer of General-Purpose Surface Grinding Machines for Grinding Stainless Steel, Sapphire, Ceramics, etc, Ponda High-Precision Mirror Polishing Machine, Flat Polishing Machine and Silicon Wafer Polishing Equipment, Fangda Equipment′s Wafer Grinding Machines and Precision Single-Axis Thinning Machines Are Suitable for Various Generations of Semiconductor Optical Component M and so on.

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Wafer Grinder

Total 117 Wafer Grinder Products
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Video
Custom Vacuum Sucker Precision High Speed 320 Vertical Thinning Machine
Custom Vacuum Sucker Precision High Speed 320 Vertical Thinning Machine
FOB Price: US $20,000-60,000 / Piece
Min. Order: 1 Piece
Contact Now
Video
Pangda High Precision Silicon Wafer Single-Side Grinding and Thinning Equipment
Pangda High Precision Silicon Wafer Single-Side Grinding and Thinning Equipment
FOB Price: US $8,000-20,000 / Piece
Min. Order: 1 Piece
Contact Now
Video
Specializes in The Production of Wafer Grinding Machines Silicon Wafer Thinning Machines
Specializes in The Production of Wafer Grinding Machines Silicon Wafer Thinning Machines
FOB Price: US $8,000-20,000 / Piece
Min. Order: 1 Piece
Contact Now
Ponda High Precision Crystal Speed Vertical Thinning Equipment
Ponda High Precision Crystal Speed Vertical Thinning Equipment
FOB Price: US $20,000-60,000 / Piece
Min. Order: 1 Piece
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Automatic High Speed Silicon Wafer High Speed Transverse Thinning Machine
Automatic High Speed Silicon Wafer High Speed Transverse Thinning Machine
FOB Price: US $20,000-60,000 / Piece
Min. Order: 1 Piece
Contact Now
Video
The New Vertical High-Speed Transverse Thinning Equipment Is Suitable for Wafer Thinning
The New Vertical High-Speed Transverse Thinning Equipment Is Suitable for Wafer Thinning
FOB Price: US $20,000-60,000 / Piece
Min. Order: 1 Piece
Contact Now
Video
Wafer Thinning Ceramic Silicon Carbide Precision Thinning Machine
Wafer Thinning Ceramic Silicon Carbide Precision Thinning Machine
FOB Price: US $20,000-60,000 / Piece
Min. Order: 1 Piece
Contact Now
Video
Wafer Grinding, Polishing and Thinning New Technologies
Wafer Grinding, Polishing and Thinning New Technologies
FOB Price: US $20,000-60,000 / Piece
Min. Order: 1 Piece
Contact Now
Video
Vertical High-Precision Sapphire Thinning Grinding Machine for Plane Processing
Vertical High-Precision Sapphire Thinning Grinding Machine for Plane Processing
FOB Price: US $20,000-60,000 / Piece
Min. Order: 1 Piece
Contact Now
Video
Shenzhen Fangda High Precision Silicon Wafer Single Side Grinding/Thinning Equipment Processing Sample
Shenzhen Fangda High Precision Silicon Wafer Single Side Grinding/Thinning Equipment Processing Sample
FOB Price: US $20,000-60,000 / Piece
Min. Order: 1 Piece
Contact Now
Video
Sapphire Thinning Machine, According to Different Process Requirements of Frequency Conversion Speed Regulation Drive Mode
Sapphire Thinning Machine, According to Different Process Requirements of Frequency Conversion Speed Regulation Drive Mode
FOB Price: US $20,000-60,000 / Piece
Min. Order: 1 Piece
Contact Now
Video
Fonda Fd200A Reducer with Point Measuring System Reducer for Silicon Carbide
Fonda Fd200A Reducer with Point Measuring System Reducer for Silicon Carbide
FOB Price: US $20,000-60,000 / Piece
Min. Order: 1 Piece
Contact Now
Video
China Fangda Manufacturing Wafer Grinding Machine Thinning Machine Precision Single-Axis Grinding Thinning Equipment Machine
China Fangda Manufacturing Wafer Grinding Machine Thinning Machine Precision Single-Axis Grinding Thinning Equipment Machine
FOB Price: US $20,000-60,000 / Piece
Min. Order: 1 Piece
Contact Now
Video
China Fangda Precision Equipment Wafer Grinding Machine Thinning Machine Fast Thinning Grinding Incoming Material Processing
China Fangda Precision Equipment Wafer Grinding Machine Thinning Machine Fast Thinning Grinding Incoming Material Processing
FOB Price: US $20,000-60,000 / Piece
Min. Order: 1 Piece
Contact Now
Video
China Fangda Manufacturing Various Materials Grinding Machine Transverse Machine Grinding Machine
China Fangda Manufacturing Various Materials Grinding Machine Transverse Machine Grinding Machine
FOB Price: US $20,000-60,000 / Piece
Min. Order: 1 Piece
Contact Now
Video
Fanda Manufacturer Fd300QA Precision Single-Axis Thinning Machine High Efficiency Grinding Machine Thinning Equipment
Fanda Manufacturer Fd300QA Precision Single-Axis Thinning Machine High Efficiency Grinding Machine Thinning Equipment
FOB Price: US $20,000-60,000 / Piece
Min. Order: 1 Piece
Contact Now
Video
China Fangda Manufacturing Silicon Wafer Sapphire Substrate Material Thinning Machine Grinding Machine
China Fangda Manufacturing Silicon Wafer Sapphire Substrate Material Thinning Machine Grinding Machine
FOB Price: US $20,000-60,000 / Piece
Min. Order: 1 Piece
Contact Now
Video
Automatic Fd-3005A Wafer Thinning Machine Automatic Grinding Machine Thinning Grinding Equipment
Automatic Fd-3005A Wafer Thinning Machine Automatic Grinding Machine Thinning Grinding Equipment
FOB Price: US $8,000-20,000 / Piece
Min. Order: 1 Piece
Contact Now
Video
China Fangda Manufacturing Silicon Wafer Sapphire Substrate Material Thinning Machine Grinding Machine
China Fangda Manufacturing Silicon Wafer Sapphire Substrate Material Thinning Machine Grinding Machine
FOB Price: US $20,000-60,000 / Piece
Min. Order: 1 Piece
Contact Now
Video
Precision Equipment Wafer Grinding Machine Thinning Machine Fast Thinning Grinding Incoming Material Processing
Precision Equipment Wafer Grinding Machine Thinning Machine Fast Thinning Grinding Incoming Material Processing
FOB Price: US $20,000-60,000 / Piece
Min. Order: 1 Piece
Contact Now
Video
Fangda Equipment′s Wafer Grinding Machines and Precision Single-Axis Thinning Machines Are Suitable for Various Generations of Semiconductor Optical Component M
Fangda Equipment′s Wafer Grinding Machines and Precision Single-Axis Thinning Machines Are Suitable for Various Generations of Semiconductor Optical Component M
FOB Price: US $20,000-100,000 / Piece
Min. Order: 1 Piece
Contact Now

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