Automatic Fd-3005A Wafer Thinning Machine Automatic Grinding Machine Thinning Grinding Equipment

• Customization: Available
• After-sales Service: 12months
• Warranty: 12months
• Model NO.: FD-3005A
• Type: Surface Grinding Machine
• Processing Object: Flat Workpieces
• Abrasives: Grinding Wheel
• Controlling Mode: PLC
• Automatic Grade: Semiautomatic
• Cylindrical Grinder Type: Surface Grinding Machine
• Precision: High Precision
• Certification: ISO 9001
• Condition: New
• Power Source: Electricity
• Disc(Wheel) Type: Grinding Disc
• Variable Speed: with Variable Speed
• Application: Grinding Industry
• Material: Metal and Non-Metal
• Working Style: Reduction
• Disc Diameter: Φ910 mm
• Service: Oversea Setup & After-Sale Avalaible
• Class: Single Plate
• Process Station: 3
• Pressure Source: Pneumatic or Weight Block
• Plate Material: Metal & Non-Metal
• Abrasive: Slurry
• Weight: 1000kg
• Transport Package: Wood Crate
• Trademark: PONDA
• Origin: China
• Production Capacity: 500 Unit/Year

Product Description

Why Ponda?
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ceramics, glass, industrial sapphire, plastics, and any other composites.
Products Show


High precision grinding machine equipment principle:
1. This series of transverse thinning grinding machine is a fully automatic precision grinding equipment. The workpiece is rotated in the opposite direction by the vacuum suction cup or electromagnetic suction cup, and the grinding wheel swings back and forth. The grinding resistance is small, the workpiece will not be damaged, and the grinding efficiency is high.
2. The equipment can automatically set the tool, actually detect the grinding torque, and automatically adjust the workpiece grinding speed, so as to prevent the workpiece from deformation and damage due to excessive pressure in the grinding process, and automatically compensate the grinding wheel wear thickness.
APPLICATION

Single Plate Lapping & Polishing	Metal And Alloy Ceramic Oxide Carbide Glass Plastic Nature Stone	Sealing	valve and sealing ring(liquid, oil, gas)
		Semiconductor	LED substrate(Al2O3, Si, SiC) wafer substrate(Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, ZnO, AlN)
		Plastic	PE, E/VAC, SBS, SBR, NBR, SR, BR, PR
		Phone Frame(flat)	back plate
		PCB	adhesive, coating, circuit
		Optics(flat)	optical lens, optical reflector, scintillator cube, holographic glass, HUD glass, screen glass
		Radar	oxide coating plate
		Gemstone	jade, sapphire, agate, etc.
		Others	graphite block, gauge block, micrometer gauge, diamond, friction plate, knife, bearing, metal components, and any other precise hardware.
*NOTE: lapping can only remove slight thickness of workpiece. If need ultra thinning (≤100μm), thinner machine are needed.

SPECIFICATION 

Standard Specification
Machine Model	FD3803		FD4603		FD6103		FD9104
Plate Diameter	Φ380 mm / 15 inches		Φ460mm / 18 inches		Φ610mm / 24 inches		Φ910mm / 36 inches
Max. Workpiece Diameter (without conditioning ring)	Φ180 mm		Φ220 mm		Φ270 mm		Φ420 mm
Conditioning Ring Diameter	Φ180 mm		Φ220 mm		Φ270 mm		Φ420 mm
Number of Station	3		3		3		4
Plate Rotate Speed	0-140 rpm		0-140 rpm		0-120 rpm		0-90 rpm
Facing & Grooving Speed (Not include in Polishing)	0-120 mm/m		0-120 mm/m		0-120 mm/m		0-120 mm/m
Total Weight	450 kg		780 kg		1000 kg		1600 kg
Total Floor Space	670×940 mm		1030×730 mm		1920×840 mm		2100×1300 mm
Built-In Optional Kits
Grade		Standard		Upgraded		Advanced
Controls		Digital		Digital		Touch-Screen PLC
Pressure Source		Hand Weight Block		Pneumatic Weight Block Manual		Pneumatic Press Integrated with PLC
Slurry Supply System		-		Manual		Digital, Manual
Cylinder Bar Drive System		-		Manual		Integrated with PLC
Conditioning Ring Drive System		-		Manual		Integrated with PLC
Machine Enclosure		-		Framed by Aluminum Alloy		Framed by Metal Plate
*NOTE: the optional kits based on the production requirements, making samples can confirm if they are necessary.

SAMPLE DEMONSTRATION (SINGLE PLATE)



About the Company

Factory front desk
Ponda is a high-tech enterprise specializing in all kinds of high precision grinding equipment, polishing equipment and its
supporting products and consumable materials

Production and assembly shop

We have a production workshop and testing equipment, assembly workers and mechanical design engineers
45 people

Patent

Delivery & Packing

Packing Details  : Packing, 1 pcs/carton.


FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.
Q2: Does Ponda charge for making samples?
A: No, it's free to make samples.
Q3: Is Ponda trader or manufacturer?
A: We are manufacturer, certified National High-Tech Enterprise.
Q4: How long does it take machine to deliver?
A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we provide oversea service and online tutorial.
Q6: How many type of machine does Ponda manufacture?
A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries.