Ponda High-Precision Mirror Polishing Machine, Flat Polishing Machine and Silicon Wafer Polishing Equipment

• Customization: Available
• After-sales Service: 12months
• Warranty: 12months
• Model NO.: FD-7104PA
• Type: Surface Grinding Machine
• Processing Object: Flat Workpieces
• Abrasives: Grinding Wheel
• Controlling Mode: PLC
• Automatic Grade: Semiautomatic
• Cylindrical Grinder Type: Surface Grinding Machine
• Precision: High Precision
• Certification: ISO 9001
• Condition: New
• Power Source: Electricity
• Disc(Wheel) Type: Grinding Disc
• Working Style: Grain
• Variable Speed: with Variable Speed
• Application: Grinding Industry
• Material: Metal and Non-Metal
• Disc Diameter: Φ700 mm
• Service: Oversea Setup & After-Sale Avalaible
• Class: Single Plate
• Process Station: 3
• Pressure Source: Pneumatic or Weight Block
• Plate Material: Metal & Non-Metal
• Abrasive: Slurry
• Weight: 2100kg
• Transport Package: Wood Crate
• Trademark: PONDA
• Origin: China
• Production Capacity: 500 Unit/Year
• Package Size: 1200.00cm * 1700.00cm * 2300.00cm
• Package Gross Weight: 2120.000kg

Product Description

Why Ponda?
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ceramics, glass, industrial sapphire, plastics, and any other composites.

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Equipment features:
This equipment is single-sided precision grinding equipment, using advanced machinery, structure and a variety of advanced control aspects, grinding processing efficiency is high, stable operation.
The whole machine adopts PLC+ touch screen control system, the equipment parameter setting, and the operation is simple and convenient, and the system runs stably.
The main motor adopts frequency conversion speed control to achieve soft start and soft stop of the main machine, reduce the impact of equipment operation and reduce workpiece damage.

The grinding pressure of the workpiece adopts the cylinder pressure mode, and realizes the closed-loop control of the pressure through the electric proportional valve control to ensure the high pressure accuracy and stability.
The upper press plate adopts the main drive mode (optional) to ensure the uniformity of grinding processing at each station under the premise of ensuring the grinding rate of the product.
The grinding plate and the upper pressure plate are equipped with cooling water cooling function to ensure the maximum efficiency of the grinding fluid to reduce the deformation of the grinding plate surface.
The equipment comes with a disk surface trimming machine, which can ensure the flatness of 0.01mm after the disk surface is trimmed.
APPLICATION

Single Plate Lapping & Polishing	Metal And Alloy Ceramic Oxide Carbide Glass Plastic Nature Stone	Sealing	valve and sealing ring(liquid, oil, gas)
		Semiconductor	LED substrate(Al2O3, Si, SiC) wafer substrate(Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, ZnO, AlN)
		Plastic	PE, E/VAC, SBS, SBR, NBR, SR, BR, PR
		Phone Frame(flat)	back plate
		PCB	adhesive, coating, circuit
		Optics(flat)	optical lens, optical reflector, scintillator cube, holographic glass, HUD glass, screen glass
		Radar	oxide coating plate
		Gemstone	jade, sapphire, agate, etc.
		Others	graphite block, gauge block, micrometer gauge, diamond, friction plate, knife, bearing, metal components, and any other precise hardware.
*NOTE: lapping can only remove slight thickness of workpiece. If need ultra thinning (≤100μm), thinner machine are needed.

SPECIFICATION 

SAMPLE DEMONSTRATION (SINGLE PLATE)




Patent

About the Company

Ponda is a high-tech enterprise specializing in all kinds of high precision grinding equipment, polishing equipment and itssupporting products and consumable materials
We have a production workshop and testing equipment, assembly workers and mechanical design engineers45 people

Delivery & Packing

Packing Details  : Packing, 1 pcs/carton.



FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.
Q2: Does Ponda charge for making samples?
A: No, it's free to make samples.
Q3: Is Ponda trader or manufacturer?
A: We are manufacturer, certified National High-Tech Enterprise.
Q4: How long does it take machine to deliver?
A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we provide oversea service and online tutorial.
Q6: How many type of machine does Ponda manufacture?
A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries.