Lapping Machine, Polishing Machine, Lathe Machine manufacturer / supplier in China, offering Precision Equipment Wafer Grinding Machine Thinning Machine Fast Thinning Grinding Incoming Material Processing, High Precision Fonda Thinning Machine Silicon Wafer Wafer Material Thinning Equipment, Fd-9bl Double-Sided Grinding Machine Pneumatic Grinding Disc Lifting Mechanism Grinding Equipment and so on.
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Business Type: | Manufacturer/Factory & Trading Company | |
Main Products: | Lapping Machine , Polishing Machine , Grinding Machine , Wafer Grinder , Single Plate Lapping & ... | |
Year of Establishment: | 2007-03-10 | |
Number of Employees: | 60 | |
Address: | Fangda Industrial Park, Guangming, Shenzhen, Guangdong, China |
Shenzhen Ponda Grinding Technology Co., Ltd. Was founded in 2007, is located in the Gongming Shangcun Yuanshan Industrial Zone B, is a professional engaged in a variety of high precision grinding equipment, polishing equipment and supporting products and consumption of materials of high-tech enterprises. The company integrates research and development, design, manufacturing, sales and after-sales service. Its products are widely used in optical glass lenses, mobile phone parts, LED sapphire, molds, parts of ...