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Shenzhen Ponda Grinding Technology Co.,Ltd.

Guangdong, China
Business Type:
Manufacturer/Factory & Trading Company
Main Products:
Lapping Machine , Polishing Machine , Grinding Machine , Wafer Grinder , Single Plate Lapping & ...
Year of Establishment:
2007-03-10
Number of Employees:
60
Address:
Fangda Industrial Park, Guangming, Shenzhen, Guangdong, China
OEM/ODM Service
Sample Available
Visit My Factory
Secured Trading Service

Lapping Machine, Polishing Machine, Lathe Machine manufacturer / supplier in China, offering The Fonda Precision CMP Polishing Machine Is Suitable for 4.6.8 "Wafer Film Four-Axis Processing Polishing Equipment, Precision CMP Polishing Machine CMP Chemical Mechanical Polishing Machine Wafer Processing and Polishing Equipment, Precision Equipment Wafer Grinding Machine Thinning Machine Fast Thinning Grinding Incoming Material Processing and so on.

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Shenzhen Ponda Grinding Technology Co.,Ltd.
Shenzhen Ponda Grinding Technology Co.,Ltd.
Shenzhen Ponda Grinding Technology Co.,Ltd.

Wafer thinning machine series

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China Precision Thinning Machine for Silicon Aafers and Other Crystal Materials
China Precision Thinning Machine for Silicon Aafers and Other Crystal Materials
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Sapphire Thinning Machine Different Process Frequency Control Grinding
Sapphire Thinning Machine Different Process Frequency Control Grinding
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Ultra-Precision Wafer High Speed Grinding and Thinning Equipment
Ultra-Precision Wafer High Speed Grinding and Thinning Equipment
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Crystal and Other Non-Metallic Materials Thinning Equipment
Crystal and Other Non-Metallic Materials Thinning Equipment
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Single Plate Lapping & Polishing Machine

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All-Round Safety Consideration of Single-Side Grinding and Polishing Equipment
All-Round Safety Consideration of Single-Side Grinding and Polishing Equipment
FOB Price: US $8,000-240,000 / Piece
Min. Order: 1 Piece
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Stainless Steel Surface Polishing High Precision Grinding and Polishing Equipment
Stainless Steel Surface Polishing High Precision Grinding and Polishing Equipment
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Min. Order: 1 Piece
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Light Guide Plate Silicon Wafer Grinding and Polishing Processing Equipment
Light Guide Plate Silicon Wafer Grinding and Polishing Processing Equipment
FOB Price: US $8,000-20,000 / Piece
Min. Order: 1 Piece
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New-Type Customized China High Precision Planar Single Sided Grinding and Polishing Machine
New-Type Customized China High Precision Planar Single Sided Grinding and Polishing Machine
FOB Price: US $8,000-20,000 / Piece
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Manufacturer′s Direct Selling High-Precision Single-Sided Grinding and Polishing Equipment for Silicon Wafers
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High Precision Grinding and Polishing Equipment for Stainless Steel Mirror Surface Polishing
High Precision Grinding and Polishing Equipment for Stainless Steel Mirror Surface Polishing
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Supply High - Function Precision Plane Polishing Machine Speed Adjustable Plane Equipment Easy Operation
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Domestic Light Guide Plate Polishing Machine
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double sided lapping&polishing machine

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Fully Automatic Ceramic Fine and High Density Double-Sided Grinding Machine
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The Millstone Lifting Mechanism of Double-Sided Grinding Equipment
The Millstone Lifting Mechanism of Double-Sided Grinding Equipment
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Professional Production of High-Precision CNC Double-Sided Grinding and Polishing Equipment
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Double-Sided Grinding Equipment for Quartz Crystals
Double-Sided Grinding Equipment for Quartz Crystals
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Multiple Process Parameter Selection for Non-Metallic Material Double-Sided Grinding and Polishing Equipment
Multiple Process Parameter Selection for Non-Metallic Material Double-Sided Grinding and Polishing Equipment
FOB Price: US $30,000-50,000 / Piece
Min. Order: 1 Piece
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Lapping CMP Systm&Buffing Polishing

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Semiconductor Material Thinning and Precision Grinding Machine
Semiconductor Material Thinning and Precision Grinding Machine
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High Precision Ceramic Plane Polishing Machine Made in China
High Precision Ceramic Plane Polishing Machine Made in China
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Polishing Machines for Semiconductor Materials Such as Silicon Wafers and Sapphire Substrates
Polishing Machines for Semiconductor Materials Such as Silicon Wafers and Sapphire Substrates
FOB Price: US $4,000-10,000 / Piece
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Polishing Equipment for 2.5D and 3D Screens and Smartphone Backplanes
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CNC High Precision Ceramic Mobile Phone Back Cover Sweeping Machine Plane Polishing Machine
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Suitable for Various Materials, Curved Mirror Glass Ceramic Polishing Machines
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Company Profile

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Shenzhen Ponda Grinding Technology Co.,Ltd.
Shenzhen Ponda Grinding Technology Co.,Ltd.
Shenzhen Ponda Grinding Technology Co.,Ltd.
Shenzhen Ponda Grinding Technology Co.,Ltd.
360° Virtual Tour Book a Factory Tour
Business Type: Manufacturer/Factory & Trading Company
Main Products: ‪Lapping Machine‬ , ‪Polishing Machine‬ , ‪Grinding Machine‬ , ‪Wafer Grinder‬ , ‪Single Plate Lapping & ...‬
Year of Establishment: 2007-03-10
Number of Employees: 60
Address: Fangda Industrial Park, Guangming, Shenzhen, Guangdong, China
Info marked by is verified by CTI

Shenzhen Ponda Grinding Technology Co., Ltd. Was founded in 2007, is located in the Gongming Shangcun Yuanshan Industrial Zone B, is a professional engaged in a variety of high precision grinding equipment, polishing equipment and supporting products and consumption of materials of high-tech enterprises. The company integrates research and development, design, manufacturing, sales and after-sales service. Its products are widely used in optical glass lenses, mobile phone parts, LED sapphire, molds, parts of ...

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