High Effective Precision Thinning Machine for Silicon Wafer, Gallium Arsenide, Ceramic

Product Description

Why Ponda?
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ceramics, glass, industrial sapphire, plastics, and any other composites.
Products Show

 Structure:
This machine is mainly composed of vacuum sucker, sucker spindle, sucker drive mechanism, grinding wheel, grinding wheel and servo drive motor, grinding wheel feed mechanism, system full closed-loop control system, etc.
1, the diameter of the grinding wheel is 312mm, the grinding wheel uses diamond grinding wheel, the selection of the particle size of the grinding wheel is customized according to the requirements of the customer.
2, the grinding wheel spindle adopts precision rotating spindle, the driving mode is frequency conversion speed regulation, and the speed can be changed according to different process requirements by the PLC control system supported by the drive mode.
3, the machine adopts high precision screw and guide rail components, driving mode is servo full closed-loop control system drive, according to different materials of the workpiece and process requirements by the PLC controlled drive mode and the corresponding change of screw speed, that is, the grinding wheel feed speed, control feed accuracy by high resolution grating ruler detection.

Control mode:
1. the machine adopts advanced international famous brand PLC and touch screen, high degree of automation, human-machine interface, simple operation at a glance.
2. the air pressure pressure detection sensor, when the air pressure is less than the minimum pressure required for normal processing set by the equipment, the equipment alarms to prevent the workpiece from sucking fast.
3. grinding wheel torque control, when the torque is higher than the equipment set by the normal processing of the torque generated by the equipment alarm, to prevent equipment abnormal or misoperation when the knife damage machine accessories.
4. grinding wheel current monitoring, when the cold grinding wheel higher than the equipment set the maximum current generated by normal processing of the grinding wheel rebound, rebound distance can be adjusted to prevent the grinding wheel extrusion workpiece damage.
5. the automatic compensation of the grinding wheel loss, to prevent the consumption of the grinding wheel in the grinding product at the same time affecting the processing accuracy of the workpiece.
6. the equipment can be selected according to customer needs to install the grinding wheel online dressing function.
7. the equipment can be selected according to customer needs to install online thickness measurement function.
8.The equipment is mainly used for the thinning of silicon wafers, ceramics, sheets, gallium arsenide, silicon carbide, lithium tantalate, lithium niobate, special glass and other crystal materials


 SPECIFICATION

Model	FD-150A	FD-200A	FD-300A	FD-550A
Processing Product Size	≤Ø150mm	≤Ø200mm	≤Ø300mm	≤Ø550mm
Vacuum Chuck Speed	0-300rpm/min	0-300rpm/min	0-300rpm/min	0-300rpm/min
Chuck Motor Power	2.2KW 380V 3-phase	2.2KW 380V 3-phase	2.2KW 380V 3-phase	2.2KW 380V 3-phase
Grating Control System	Resolution 0.0005mm	Resolution 0.0005mm	Resolution 0.0005mm	Resolution 0.0005mm
Grinding Wheel Speed	0-3000rpm/min	0-3000rpm/min	0-3000rpm/min	0-3000rpm/min
Grinding Wheel Motor Power	5.5kw	5.5kw	5.5kw	5.5kw
TTV after Product Thinning	≤2um (6-inch product as an example)	≤2um (8-inch product as an example)	≤3um (12-inch product as an example)	≤3um (12-inch product as an example)
Minimum Thinning Thickness	≥60um	≥80um	≥100um	≥100um
Grinding Wheel Repeat Positioning Accuracy	1um	1um	1um	1um
Minimum Setting Step of Grinding Wheel	0.1um/s	0.1um/s	0.1um/s	0.1um/s
Water Tank Size	780*480*550mm	780*480*550mm	780*480*550mm	780*480*550mm
Equipment Size	1200*1250*2050mm	1200*1250*2050mm	1200*1250*2050mm	1300*1350*2150mm
weight	1700kg	1700kg	1850kg	1850kg

Motor power 1.5KW.  380V 3 phase This machine adopts advanced international famous brand PLC and touch screen, automation process High degree, man-machine interface, simple operation at a glance.

Processing Cases

Type of equipment

About the Company

Ponda is a high-tech enterprise specializing in all kinds of high precision grinding equipment, polishing equipment and itssupporting products and consumable materials.
We have a production workshop and testing equipment, assembly workers and mechanical design engineers45 people.

Delivery & Packing

Packing Details  : Packing, 1 pcs/wooden box.

Patent

FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.
Q2: Does Ponda charge for making samples?
A: No, it's free to make samples.
Q3: Is Ponda trader or manufacturer?
A: We are manufacturer, certified National High-Tech Enterprise.
Q4: How long does it take machine to deliver?
A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we provide oversea service and online tutorial.
Q6: How many type of machine does Ponda manufacture?
A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries.