Automatic High Speed Silicon Wafer High Speed Transverse Thinning Machine

• After-sales Service: 12months
• Warranty: 12months
• Type: Surface Grinding Machine, Surface Grinding Machine
• Processing Object: Flat Workpieces
• Abrasives: Grinding Wheel
• Controlling Mode: PLC
• Model NO.: YM-150WH
• Automatic Grade: Semiautomatic
• Cylindrical Grinder Type: Surface Grinding Machine
• Precision: High Precision
• Certification: ISO 9001
• Condition: New
• Power Source: Electricity
• Disc(Wheel) Type: Grinding Disc
• Variable Speed: with Variable Speed
• Application: Grinding Industry
• Working Style: Reduction
• Service: Oversea Setup & After-Sale Avalaible
• Class: Thinner
• Process Station: 1
• Abrasive: Recyclable Water & Grinding Wheel
• Wheel Rotate Speed: 0-3000 Rpm
• Workpiece Accuracy Control(Parallelism): 1um
• Power of Grinding Wheel Motor: 5.5kw
• Transport Package: Wood Crate
• Trademark: PONDA
• Origin: China
• Production Capacity: 500 Unit/Year

Product Description

Why Ponda?
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ceramics, glass, industrial sapphire, plastics, and any other composites.
Products Show
It is very suitable for the workpiece hardness is relatively high, the thickness is ultra-thin, and the processing precision is high. Such as: LED sapphire substrate, quartz wafers, silicon wafers, sheets, ceramic sheets, tungsten steel sheets and various metal materials rapid thinning.
High precision transverse grinding machine equipment principle:
1. This series of transverse thinning grinding machine is a fully automatic precision grinding equipment. The workpiece is rotated in the opposite direction by the vacuum suction cup or electromagnetic suction cup, and the grinding wheel swings back and forth. The grinding resistance is small, the workpiece will not be damaged, and the grinding efficiency is high.
2. The equipment can automatically set the tool, actually detect the grinding torque, and automatically adjust the workpiece grinding speed, so as to prevent the workpiece from deformation and damage due to excessive pressure in the grinding process, and automatically compensate the grinding wheel wear thickness.

APPLICATION

Process	Industry by Substance	Industry by Applicability
High Speed Grinding & Thinning	Metal And Alloy Ceramic Oxide Carbide Glass Plastic Nature Stone	Sealing	sealing ring(liquid, oil, gas)
		Semiconductor	substrate(Al2O3, Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, ZnO, AlN) used in Wafer, LED., etc
		Plastic	Hard Plastic
		Optics(flat)	optical lens, optical reflector, holographic glass, HUD glass, screen glass
		Gemstone	jade, sapphire, agate, etc.
		Others	gauge block, micrometer gauge, friction plate, metal components, and any other precise hardware.
*NOTE: spiral stripe appears after high speed grinding and thinning. To dispel it, lap or polish are needed.

SPECIFICATION

Standard Specification
Model number	YM-150WH	YM-180WH	YM-200WH	YM-230WH	YM-300WH
Diamond grinding wheel dimensions	Diameter 150*H25	Diameter 180*H25	The diameter is 200*H30	The diameter is 230*H30	The diameter is 300*H30
Maximum size of workpiece	Diameter 150mm	Diameter 180mm	Diameter 200mm	Diameter 230mm	Diameter 300mm
Workpiece speed (adjustable)	0---1000rpm	0---1000rpm	0---800rpm	0---800rpm	0---800rpm
Grinding wheel speed (adjustable)	0---2000rpm	0---2000rpm	0---1800rpm	0---1800rpm	0---1800rpm
Motor power of grinding wheel	1.5kw.380 V,3 phase.	1.5kw.380 V,3 phase.	2.2kw.380v,3 phases	2.2kw.380v,3 phases	2.2kw.380v,3 phases
Sucker spindle motor power	0.75kw.380v.3 phase	0.75kw.380v.3 phase	0.75kw.380v.3 phase	0.75kw.380v.3 phase	1.1kw.380v,3 phases
Control accuracy (parallelism)	1um(diameter 100mm)	1um(diameter 100mm)	1um(diameter 100mm)	1um(diameter 100mm)	1um(diameter 100mm)
Overall dimension	1200*550*1550	1200*550*1550	1350*600*1600	1350*600*1600	1500*700*1650

Built-In Optional Kits
Grade		Standard			Advanced
Slurry Recycle System		-			Integrated with PLC
Dressing System		-			Integrated with PLC
Station Fixing		Mechanical Fixture			Pneumatic Vacuum Fixing
Spindle		Mechanical			Pneumatic
*NOTE: the optional kits based on the production requirements, making samples can confirm if they are necessary.

SAMPLE DEMONSTRATION (THINNING)


Patent

About the Company

Ponda is a high-tech enterprise specializing in all kinds of high precision grinding equipment, polishing equipment and itssupporting products and consumable materials
We have a production workshop and testing equipment, assembly workers and mechanical design engineers45 people

Delivery & Packing

Packing Details  : Packing, 1 pcs/carton.

FAQs
Q1: Which machine is best for my product?
A: It usually depends on 5 requirements and parameters of the product: flatness, roughness, thickness, size, productivity.
1. If you need better flatness and roughness, you may need a grinder and a polisher.
2. If you want to thin the product to a large range, such as 500μm, you may need additional thinner machines.
3. If productivity is too high, you may need bigger machines or an expanded production line.
In addition, we can confirm the production line when we make the sample for you.
Q2: Does Ponda charge for making samples?
A: No, the proofing is free.
Q3: Is Ponda a trader or a manufacturer?
A: We are a manufacturer and a national high-tech enterprise.
Q4: How long does it take for the machine to be delivered?
A: Delivery in about 15 days. If the machine is out of stock, we need another 15 days to produce it.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we offer overseas services and online tutorials.
Q6: How many kinds of machines does Ponda produce?
A: We have 21 series of machines, 5 different principles of operation, more than 15 kinds of plates, more than 100 kinds of paste.