• Custom Vacuum Sucker Precision High Speed 320 Vertical Thinning Machine
  • Custom Vacuum Sucker Precision High Speed 320 Vertical Thinning Machine
  • Custom Vacuum Sucker Precision High Speed 320 Vertical Thinning Machine
  • Custom Vacuum Sucker Precision High Speed 320 Vertical Thinning Machine
  • Custom Vacuum Sucker Precision High Speed 320 Vertical Thinning Machine
  • Custom Vacuum Sucker Precision High Speed 320 Vertical Thinning Machine

Custom Vacuum Sucker Precision High Speed 320 Vertical Thinning Machine

After-sales Service: 12months
Warranty: 12months
Type: Surface Grinding Machine, Thinning Machine
Processing Object: Flat Workpieces
Abrasives: Grinding Wheel
Controlling Mode: PLC
Samples:
US$ 0/Piece 1 Piece(Min.Order)
| Request Sample
Customization:
Manufacturer/Factory & Trading Company

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Diamond Member Since 2021

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Guangdong, China
Cooperated with Fortune 500
This supplier has Cooperated with Fortune 500 companies
Years of Export Experience
The export experience of the supplier is more than 10 years
Experienced Team
The supplier has 15 foreign trading staff(s) and 13 staff(s) with over 6 years of overseas trading experience
R&D Capabilities
The supplier has 10 R&D engineers, you can check the Audit Report for more information
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Basic Info.

Model NO.
320
Automatic Grade
Semiautomatic
Cylindrical Grinder Type
Surface Grinding Machine
Precision
High Precision
Certification
ISO 9001
Condition
New
Power Source
Electricity
Disc(Wheel) Type
Grinding Disc
Variable Speed
with Variable Speed
Application
Semiconductor Industry
Material
Hard Brittle Material
Working Style
Thinning
Service
Oversea Setup & After-Sale Avalaible
Class
Thinner
Process Station
1
Abrasive
Recyclable Water & Grinding Wheel
Wheel Rotate Speed
0-3000 Rpm
Workpiece Accuracy Control(Parallelism)
1um
Power of Grinding Wheel Motor
5.5kw
Transport Package
Wood Crate
Trademark
PONDA
Origin
China
Production Capacity
500 Unit/Year

Product Description

Why Ponda?
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ceramics, glass, industrial sapphire, plastics, and any other composites.
Products Show
Custom Vacuum Sucker Precision High Speed 320 Vertical Thinning Machine
Vertical thinning machine main features:
1, sucker according to customer process requirements can be divided into electromagnetic sucker and vacuum sucker, sucker size can be customized according to customer needs, diameter 320-600mm.
2. The grinding wheel spindle adopts precision high-speed rotating motorized spindle, and the driving mode is frequency conversion speed regulation. The speed can be adjusted according to different process requirements and the driving mode supported by PLC control system.
3. The grinding wheel feed mode is set in three sections, which can more conveniently set the effective thinning scheme and improve the precision and surface effect after thinning.
4, the tool in the case of not changing the grinding wheel and sucker, for different thickness of the workpiece only need one tool can work continuously, do not need to set the tool every time.
5, the machine adopts high precision screw and guide rail components, the driving mode is servo drive, according to different materials of the workpiece and process requirements by PLC control of the driving mode and the corresponding change of screw speed, that is, the grinding wheel feed speed, speed 0.001-5mm/min adjustable, control feed precision by high resolution grating ruler detection.
6. The equipment can detect the grinding torque and automatically adjust the grinding speed of the workpiece, so as to prevent the workpiece from deformation and damage due to excessive pressure in the grinding process, and automatically compensate the thickness of the grinding wheel wear, so that the thickness of the 150 wafer can be reduced to 0.08mm without breaking. And the parallelism and flatness can be controlled within the range of ±0.002mm.
7. High thinning efficiency, LED sapphire substrate grinding speed can be reduced by up to 48 microns per minute. Silicon wafers can be thinned up to 250 microns per minute.


APPLICATION
Process Industry by Substance Industry by Applicability
High
Speed
Grinding
& Thinning
Metal And Alloy
Ceramic
Oxide
Carbide
Glass
Plastic
Nature Stone
Sealing sealing ring(liquid, oil, gas)
Semiconductor substrate(Al2O3, Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, ZnO, AlN) used in Wafer, LED., etc
Plastic Hard Plastic
Optics(flat) optical lens, optical reflector, holographic glass, HUD glass, screen glass
Gemstone jade, sapphire, agate, etc.
Others gauge block, micrometer gauge, friction plate, metal components, and any other precise hardware.
*NOTE: spiral stripe appears after high speed grinding and thinning. To dispel it, lap or polish are needed.


SPECIFICATION
Standard Specification
Machine Model FD170T FD220T FD320T FD450T
Station Diameter Φ150 mm / 6 inches Φ220 mm / 8 inches Φ320 mm / 12 inches Φ460 mm / 18 inches
Max. Workpiece Dimension Φ150×30 mm Φ220×50 mm Φ320×50 mm Φ460×50 mm
Process Thickness 50μm≤N 75μm≤N 95μm≤N 120μm≤N
Grating Resolution 0.5 μm 0.5 μm 0.5 μm 0.5 μm
Number of Station 1 1 1 1
Wheel Rotate Speed 0-3000 rpm 0-3000 rpm 0-3000 rpm 0-3000 rpm
Station Rotate Speed 0-300 rpm 0-300 rpm 0-300 rpm 0-300 rpm
Total Weight 650 kg 850 kg 900 kg 920 kg
Total Floor Space 1200×550 mm 1150×1200 mm 1150×1200 mm 1150×1200 mm
Built-In Optional Kits
Grade Standard Advanced
Slurry Recycle System - Integrated with PLC
Dressing System - Integrated with PLC
Station Fixing Mechanical Fixture Pneumatic Vacuum Fixing
Spindle Mechanical Pneumatic
*NOTE: the optional kits based on the production requirements, making samples can confirm if they are necessary.


SAMPLE DEMONSTRATION (THINNING)
Custom Vacuum Sucker Precision High Speed 320 Vertical Thinning Machine

Custom Vacuum Sucker Precision High Speed 320 Vertical Thinning Machine
Patent
Custom Vacuum Sucker Precision High Speed 320 Vertical Thinning Machine

About the Company

Custom Vacuum Sucker Precision High Speed 320 Vertical Thinning Machine

Ponda is a high-tech enterprise specializing in all kinds of high precision grinding equipment, polishing equipment and itssupporting products and consumable materials
We have a production workshop and testing equipment, assembly workers and mechanical design engineers45 people

Delivery and packing
Packing Instructions: Packing, 1 PCS/wooden case.
Custom Vacuum Sucker Precision High Speed 320 Vertical Thinning MachineCustom Vacuum Sucker Precision High Speed 320 Vertical Thinning Machine
FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.

Q2: Does Ponda charge for making samples?
A: No, it's free to make samples.
Q3: Is Ponda trader or manufacturer?
A: We are manufacturer, certified National High-Tech Enterprise.
Q4: How long does it take machine to deliver?
A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we provide oversea service and online tutorial.
Q6: How many type of machine does Ponda manufacture?
A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries. 

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Diamond Member Since 2021

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Manufacturer/Factory & Trading Company
Registered Capital
1.48 Million USD
Plant Area
11500 square meters