China Fangda Manufacturing Silicon Wafer Sapphire Substrate Material Thinning Machine Grinding Machine

Product Details
Customization: Available
After-sales Service: 12months
Warranty: 12months
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  • China Fangda Manufacturing Silicon Wafer Sapphire Substrate Material Thinning Machine Grinding Machine
  • China Fangda Manufacturing Silicon Wafer Sapphire Substrate Material Thinning Machine Grinding Machine
  • China Fangda Manufacturing Silicon Wafer Sapphire Substrate Material Thinning Machine Grinding Machine
  • China Fangda Manufacturing Silicon Wafer Sapphire Substrate Material Thinning Machine Grinding Machine
  • China Fangda Manufacturing Silicon Wafer Sapphire Substrate Material Thinning Machine Grinding Machine
  • China Fangda Manufacturing Silicon Wafer Sapphire Substrate Material Thinning Machine Grinding Machine
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Basic Info.

Model NO.
FD-150
Type
Surface Grinding Machine
Processing Object
Flat Workpieces
Abrasives
Grinding Wheel
Controlling Mode
PLC
Automatic Grade
Semiautomatic
Cylindrical Grinder Type
Surface Grinding Machine
Precision
High Precision
Certification
ISO 9001
Condition
New
Power Source
Electricity
Disc(Wheel) Type
Grinding Disc
Variable Speed
with Variable Speed
Application
Grinding Industry
Material
Semiconductor Material
Working Style
Reduction
Service
Oversea Setup & After-Sale Avalaible
Class
Thinner
Process Station
1
Abrasive
Recyclable Water & Grinding Wheel
Wheel Rotate Speed
0-3000 Rpm
Workpiece Accuracy Control(Parallelism)
1um
Power of Grinding Wheel Motor
5.5kw
Transport Package
Wood Crate
Trademark
PONDA
Origin
China
Production Capacity
500 Unit/Year

Product Description

Why Ponda?
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ceramics, glass, industrial sapphire, plastics, and any other composites.
Scope of application:
Very suitable for workpiece hardness is relatively high, ultra-thin thickness, and high precision processing products. Such as: LED sapphire substrate, quartz wafers, silicon wafers, sheets, ceramic sheets, tungsten steel sheets and various metal materials rapid thinning.
Products Show
China Fangda Manufacturing Silicon Wafer Sapphire Substrate Material Thinning Machine Grinding Machine
Principle of high precision transverse grinding machine equipment:
1. This series of transverse thinning grinding machine is full-automatic precision grinding equipment, which is rotated in the opposite direction by the vacuum sucker or electromagnetic sucker and the grinding wheel. The grinding wheel swings back and forth. The grinding resistance is small, the workpiece will not be damaged, and the grinding efficiency is high.
2. The equipment can automatically check the grinding torque, and automatically adjust the workpiece grinding speed, so as to prevent the workpiece from deformation and damage due to excessive pressure in the grinding process, and automatically compensate the grinding wheel wear thickness.


High precision transverse grinding machine equipment features:
1. The thickness of 150 wafer can be reduced to 0.08mm thick without breaking. And the parallelism and flatness can be controlled within the range of ±0.002mm.
2. High thinning efficiency, LED sapphire substrate grinding speed can be reduced by up to 48 microns per minute. Silicon wafers can be thinned up to 250 microns per minute.
3. Series grinding machine adopts CNC program control system, touch screen operation panel.


APPLICATION
Process Industry by Substance Industry by Applicability
High
Speed
Grinding
& Thinning
Metal And Alloy
Ceramic
Oxide
Carbide
Glass
Plastic
Nature Stone
Sealing sealing ring(liquid, oil, gas)
Semiconductor substrate(Al2O3, Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, ZnO, AlN) used in Wafer, LED., etc
Plastic Hard Plastic
Optics(flat) optical lens, optical reflector, holographic glass, HUD glass, screen glass
Gemstone jade, sapphire, agate, etc.
Others gauge block, micrometer gauge, friction plate, metal components, and any other precise hardware.
*NOTE: spiral stripe appears after high speed grinding and thinning. To dispel it, lap or polish are needed.


SPECIFICATION
Standard Specification
Model number YM-150WH YM-180WH YM-200WH YM-230WH YM-300WH
Diamond grinding wheel dimensions Diameter 150*H25 Diameter 180*H25 The diameter is 200*H30 The diameter is 230*H30 The diameter is 300*H30
Maximum size of workpiece Diameter 150mm Diameter 180mm Diameter 200mm Diameter 230mm Diameter 300mm
Workpiece speed (adjustable) 0---1000rpm 0---1000rpm 0---800rpm 0---800rpm 0---800rpm
Grinding wheel speed (adjustable) 0---2000rpm 0---2000rpm 0---1800rpm 0---1800rpm 0---1800rpm
Motor power of grinding wheel 1.5kw.380 V,3 phase. 1.5kw.380 V,3 phase. 2.2kw.380v,3 phases 2.2kw.380v,3 phases 2.2kw.380v,3 phases
Sucker spindle motor power 0.75kw.380v.3 phase 0.75kw.380v.3 phase 0.75kw.380v.3 phase 0.75kw.380v.3 phase 1.1kw.380v,3 phases
Control accuracy (parallelism) 1um(diameter 100mm) 1um(diameter 100mm) 1um(diameter 100mm) 1um(diameter 100mm) 1um(diameter 100mm)
Overall dimension 1200*550*1550 1200*550*1550 1350*600*1600 1350*600*1600 1500*700*1650
Built-In Optional Kits
Grade Standard Advanced
Slurry Recycle System - Integrated with PLC
Dressing System - Integrated with PLC
Station Fixing Mechanical Fixture Pneumatic Vacuum Fixing
Spindle Mechanical Pneumatic
*NOTE: the optional kits based on the production requirements, making samples can confirm if they are necessary.


SAMPLE DEMONSTRATION (THINNING)
China Fangda Manufacturing Silicon Wafer Sapphire Substrate Material Thinning Machine Grinding Machine

China Fangda Manufacturing Silicon Wafer Sapphire Substrate Material Thinning Machine Grinding Machine

Patent
China Fangda Manufacturing Silicon Wafer Sapphire Substrate Material Thinning Machine Grinding Machine

About the Company

China Fangda Manufacturing Silicon Wafer Sapphire Substrate Material Thinning Machine Grinding Machine

Ponda is a high-tech enterprise specializing in all kinds of high precision grinding equipment, polishing equipment and itssupporting products and consumable materials
We have a production workshop and testing equipment, assembly workers and mechanical design engineers45 people

Delivery & Packing
Packing Details  : Packing, 1 pcs/carton.
China Fangda Manufacturing Silicon Wafer Sapphire Substrate Material Thinning Machine Grinding Machine

FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.

Q2: Does Ponda charge for making samples?
A: No, it's free to make samples.
Q3: Is Ponda trader or manufacturer?
A: We are manufacturer, certified National High-Tech Enterprise.
Q4: How long does it take machine to deliver?
A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we provide oversea service and online tutorial.
Q6: How many type of machine does Ponda manufacture?
A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries. 

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