Customization: | Available |
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After-sales Service: | 12months |
Warranty: | 12months |
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Single Plate Lapping & Polishing |
Metal And Alloy Ceramic Oxide Carbide Glass Plastic Nature Stone |
Sealing | valve and sealing ring(liquid, oil, gas) |
Semiconductor | LED substrate(Al2O3, Si, SiC) wafer substrate(Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, ZnO, AlN) |
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Plastic | PE, E/VAC, SBS, SBR, NBR, SR, BR, PR | ||
Phone Frame(flat) | back plate | ||
PCB | adhesive, coating, circuit | ||
Optics(flat) | optical lens, optical reflector, scintillator cube, holographic glass, HUD glass, screen glass | ||
Radar | oxide coating plate | ||
Gemstone | jade, sapphire, agate, etc. | ||
Others | graphite block, gauge block, micrometer gauge, diamond, friction plate, knife, bearing, metal components, and any other precise hardware. | ||
*NOTE: lapping can only remove slight thickness of workpiece. If need ultra thinning (≤100μm), thinner machine are needed. |
Standard Specification | |||||||
Machine Model | FD3803 | FD4603 | FD6103 | FD9104 | |||
Plate Diameter | Φ380 mm / 15 inches | Φ460mm / 18 inches | Φ610mm / 24 inches | Φ910mm / 36 inches | |||
Max. Workpiece Diameter (without conditioning ring) |
Φ180 mm | Φ220 mm | Φ270 mm | Φ420 mm | |||
Conditioning Ring Diameter | Φ180 mm | Φ220 mm | Φ270 mm | Φ420 mm | |||
Number of Station | 3 | 3 | 3 | 4 | |||
Plate Rotate Speed | 0-140 rpm | 0-140 rpm | 0-120 rpm | 0-90 rpm | |||
Facing & Grooving Speed (Not include in Polishing) |
0-120 mm/m | 0-120 mm/m | 0-120 mm/m | 0-120 mm/m | |||
Total Weight | 450 kg | 780 kg | 1000 kg | 1600 kg | |||
Total Floor Space | 670×940 mm | 1030×730 mm | 1920×840 mm | 2100×1300 mm | |||
Built-In Optional Kits | |||||||
Grade | Standard | Upgraded | Advanced | ||||
Controls | Digital | Digital | Touch-Screen PLC | ||||
Pressure Source | Hand Weight Block | Pneumatic Weight Block Manual |
Pneumatic Press Integrated with PLC |
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Slurry Supply System | - | Manual | Digital, Manual | ||||
Cylinder Bar Drive System | - | Manual | Integrated with PLC | ||||
Conditioning Ring Drive System | - | Manual | Integrated with PLC | ||||
Machine Enclosure | - | Framed by Aluminum Alloy | Framed by Metal Plate | ||||
*NOTE: the optional kits based on the production requirements, making samples can confirm if they are necessary. |
Applicability & Substance | Diameter | process | Flatness | Roughness | Parallel | Thickness | Others |
Vacuum Pad 316 stainless steel |
φ460mm | Lapping Polishaing |
1μm±0.1μm | ≤Ra0.02 μm | 10μm±2μm | 38mm | N |
Valve Plate 304 stainless steel |
φ160mm | Lapping | 2μm±0.1μm | ≤Ra0.3 μm | Not Required | 20mm | N |
Liquid Sealing 204 stainless steel |
φ12 mm | Lapping Polishaing |
0.05μm±0.01μm | ≤Ra0.04 μm | Not Required | 16mm | N |
Wafer Substrate silicon |
φ156 mm | Lapping Polishaing |
2μm±1μm | ≤Ra0.02 μm | 5μm±1μm | 0.2 mm | N |
Valve Plate 304 stainless steel |
φ245 mm | Lapping Polishaing |
2μm±0.5μm | Ra0.1 μm | 5μm±1μm | Not Required | N |
Valve Bonnet ceramic Al2O3 |
φ9 mm | Lapping | 0.5μm±0.1μm | Not Required | 2μm±0.5μm | Not Required | N |
Phone Frame aluminum alloy |
various size | Lapping Polishaing |
2μm±1μm | ≤Ra0.3 μm | 5μm±1μm | various | N |
Phone Scieen glass |
various size | Lapping Polishaing |
2μm±1μm | ≤Ra0.1 μm | 3μm±1μm | various | N |