Silicon Wafer Sapphire Gallium Arsenide High Precision Surface Mirror Polishing Machine Manufacturers

• After-sales Service: 12months
• Warranty: 12months
• Type: Surface Grinding Machine
• Processing Object: Flat Workpieces
• Abrasives: Grinding Wheel
• Controlling Mode: PLC
• Model NO.: 9104PA
• Automatic Grade: Semiautomatic
• Cylindrical Grinder Type: Surface Grinding Machine
• Precision: High Precision
• Certification: ISO 9001
• Condition: New
• Power Source: Electricity
• Disc(Wheel) Type: Grinding Disc
• Variable Speed: with Variable Speed
• Service: Oversea Setup & After-Sale Avalaible
• Class: Single Plate
• Process Station: 3
• Pressure Source: Pneumatic or Weight Block
• Transport Package: Wood Crate
• Trademark: PONDA
• Origin: China
• Production Capacity: 500 Unit/Year

Product Description

Why Ponda?
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ceramics, glass, industrial sapphire, plastics, and any other composites.

Products Show

Mainly applicable to ceramics, sapphire, silicon, various crystal materials, aluminum alloy, stainless steel and so on 3D surface workpiece.
 

Silicon grinding and polishing
8-inch silicon wafer thinning + polishing two processes, flatness 2um, parallelism 2um, thickness 0.1±2um, roughness Ra0.0003

Sapphire polishing
3-6 inch sapphire after grinding high flatness, high parallelism, roughness can reach 0.08, using this equipment polishing can be increased to 0.0003um

SPECIFICATION

Standard Specification
Machine Model	FD3803		FD4603		FD6103		FD9104
Plate Diameter	Φ380 mm / 15 inches		Φ460mm / 18 inches		Φ610mm / 24 inches		Φ910mm / 36 inches
Max. Workpiece Diameter(without conditioning ring)	Φ180 mm		Φ220 mm		Φ270 mm		Φ420 mm
Conditioning Ring Diameter	Φ180 mm		Φ220 mm		Φ270 mm		Φ420 mm
Number of Station	3		3		3		4
Plate Rotate Speed	0-140 rpm		0-140 rpm		0-120 rpm		0-90 rpm
Facing & Grooving Speed (Not include in Polishing)	0-120 mm/m		0-120 mm/m		0-120 mm/m		0-120 mm/m
Total Weight	450 kg		780 kg		1000 kg		1600 kg
Total Floor Space	670×940 mm		1030×730 mm		1920×840 mm		2100×1300 mm
*NOTE: the optional kits based on the production requirements, making samples can confirm if they are necessary.

SAMPLE DEMONSTRATION (SINGLE PLATE

Patent
About the company

Wooden case packing


FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.
Q2: Does Ponda charge for making samples?
A: No, it's free to make samples.
Q3: Is Ponda trader or manufacturer?
A: We are manufacturer, certified National High-Tech Enterprise.
Q4: How long does it take machine to deliver?
A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we provide oversea service and online tutorial.
Q6: How many type of machine does Ponda manufacture?
A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries.