Grinding and Thinning Machine for Ceramic Sheet Semiconductor Materials and Non-Metallic Materials

• Customization: Available
• After-sales Service: 12months
• Warranty: 12months
• Model NO.: FD-300
• Type: Surface Grinding Machine, Surface Grinding Machine
• Processing Object: Flat Workpieces
• Abrasives: Grinding Wheel
• Controlling Mode: PLC
• Automatic Grade: Semiautomatic
• Cylindrical Grinder Type: Surface Grinding Machine
• Precision: High Precision
• Certification: ISO 9001
• Condition: New
• Power Source: Electricity
• Disc(Wheel) Type: Grinding Disc
• Variable Speed: with Variable Speed
• Application: Semiconductor Industry
• Material: Non-Metallic Material Thinning
• Working Style: Reduction
• Service: Oversea Setup & After-Sale Avalaible
• Class: Thinner
• Process Station: 1
• Abrasive: Recyclable Water & Grinding Wheel
• Wheel Rotate Speed: 0-3000 Rpm
• Workpiece Accuracy Control(Parallelism): 1um
• Power of Grinding Wheel Motor: 5.5kw
• Transport Package: Wood Crate
• Trademark: PONDA
• Origin: China
• Production Capacity: 500 Unit/Year

Product Description

Why Ponda?
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ceramics, glass, industrial sapphire, plastics, and any other composites.
Main uses:
The equipment is mainly used for high speed thinning of thin precision parts of hard brittle materials such as sapphire substrate, silicon wafer, ceramic sheet, optical glass, quartz crystal and other semiconductor materials.

Products Show

Vertical thinning machine main features:
1. Suction cups can be divided into electromagnetic suction cups and vacuum suction cups according to customer process requirements, and the size of suction cups can be customized according to customer needs, with a diameter of 320-600mm.
2, the grinding wheel spindle adopts precision high-speed rotating electric spindle, the driving mode is frequency conversion speed regulation, the speed can be changed according to different process requirements by the PLC control system supported by the drive mode and the corresponding speed 3000-8000 turn adjustable.

3, the grinding wheel feed mode is set in three sections, which can more conveniently set an effective thinning program and improve the precision and surface effect after thinning.
4, In the case of not changing the grinding wheel and suction cup, for different thickness of the workpiece only need to set the knife can work continuously, do not need to set the knife every time.
5, the machine adopts high precision screw and guide rail components, the driving mode is servo drive, according to different materials of the workpiece and process requirements by the PLC controlled drive mode and the corresponding change of screw speed, that is, the grinding wheel feed speed, the speed is adjustable from 0.001-5mm/min, the control feed accuracy is detected by high resolution grating ruler.
6, the machine adopts advanced PLC and touch screen, high degree of automation, man-machine dialogue, simple operation at a glance.
7, the equipment can detect the grinding torque, automatically adjust the workpiece grinding speed, so as to prevent the workpiece grinding process due to excessive pressure deformation and damage, automatic compensation grinding wheel wear thickness, can make the diameter of 150 chip thickness reduced to 0.08mm thick without breaking. And parallelism and flatness can be controlled within the range of ±0.002mm.
8. High thinning efficiency, LED sapphire substrate grinding speed can be reduced by up to 48 microns per minute. The wafer can be reduced by up to 250 microns per minute.

APPLICATION

Process	Industry by Substance	Industry by Applicability
High Speed Grinding & Thinning	Metal And Alloy Ceramic Oxide Carbide Glass Plastic Nature Stone	Sealing	sealing ring(liquid, oil, gas)
		Semiconductor	substrate(Al2O3, Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, ZnO, AlN) used in Wafer, LED., etc
		Plastic	Hard Plastic
		Optics(flat)	optical lens, optical reflector, holographic glass, HUD glass, screen glass
		Gemstone	jade, sapphire, agate, etc.
		Others	gauge block, micrometer gauge, friction plate, metal components, and any other precise hardware.
*NOTE: spiral stripe appears after high speed grinding and thinning. To dispel it, lap or polish are needed.

SPECIFICATION

Standard Specification
Machine Model	FD170T		FD220T	FD320T		FD450T
Station Diameter	Φ150 mm / 6 inches		Φ220 mm / 8 inches	Φ320 mm / 12 inches		Φ460 mm / 18 inches
Max. Workpiece Dimension	Φ150×30 mm		Φ220×50 mm	Φ320×50 mm		Φ460×50 mm
Process Thickness	50μm≤N		75μm≤N	95μm≤N		120μm≤N
Grating Resolution	0.5 μm		0.5 μm	0.5 μm		0.5 μm
Number of Station	1		1	1		1
Wheel Rotate Speed	0-3000 rpm		0-3000 rpm	0-3000 rpm		0-3000 rpm
Station Rotate Speed	0-300 rpm		0-300 rpm	0-300 rpm		0-300 rpm
Total Weight	650 kg		850 kg	900 kg		920 kg
Total Floor Space	1200×550 mm		1150×1200 mm	1150×1200 mm		1150×1200 mm
Built-In Optional Kits
Grade		Standard			Advanced
Slurry Recycle System		-			Integrated with PLC
Dressing System		-			Integrated with PLC
Station Fixing		Mechanical Fixture			Pneumatic Vacuum Fixing
Spindle		Mechanical			Pneumatic
*NOTE: the optional kits based on the production requirements, making samples can confirm if they are necessary.

SAMPLE DEMONSTRATION (THINNING)


Patent

About the Company

Ponda is a high-tech enterprise specializing in all kinds of high precision grinding equipment, polishing equipment and itssupporting products and consumable materials
We have a production workshop and testing equipment, assembly workers and mechanical design engineers45 people

Delivery & Packing

Packing Details  : Packing, 1 pcs/carton.

FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.
Q2: Does Ponda charge for making samples?
A: No, it's free to make samples.
Q3: Is Ponda trader or manufacturer?
A: We are manufacturer, certified National High-Tech Enterprise.
Q4: How long does it take machine to deliver?
A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we provide oversea service and online tutorial.
Q6: How many type of machine does Ponda manufacture?
A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries.