Price Concessions Professional High-Precision Single-Sided Silicon Wafer Grinding and Polishing Equipment

Product Details
Customization: Available
After-sales Service: 12months
Warranty: 12months
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  • Price Concessions Professional High-Precision Single-Sided Silicon Wafer Grinding and Polishing Equipment
  • Price Concessions Professional High-Precision Single-Sided Silicon Wafer Grinding and Polishing Equipment
  • Price Concessions Professional High-Precision Single-Sided Silicon Wafer Grinding and Polishing Equipment
  • Price Concessions Professional High-Precision Single-Sided Silicon Wafer Grinding and Polishing Equipment
  • Price Concessions Professional High-Precision Single-Sided Silicon Wafer Grinding and Polishing Equipment
  • Price Concessions Professional High-Precision Single-Sided Silicon Wafer Grinding and Polishing Equipment
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Basic Info.

Model NO.
FD- 610
Type
Surface Grinding Machine
Processing Object
Flat Workpieces
Abrasives
Grinding Wheel
Controlling Mode
PLC
Automatic Grade
Semiautomatic
Cylindrical Grinder Type
Surface Grinding Machine
Precision
High Precision
Certification
ISO 9001
Condition
New
Power Source
Electricity
Disc(Wheel) Type
Grinding Disc
Variable Speed
with Variable Speed
Material
Metal and Non-Metal
Service
Oversea Setup & After-Sale Avalaible
Class
Single Plate
Process Station
3
Pressure Source
Pneumatic or Weight Block
Abrasive
Slurry
Transport Package
Wood Crate
Trademark
PONDA
Origin
China
Production Capacity
500 Unit/Year

Product Description

Why Ponda?
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ceramics, glass, industrial sapphire, plastics, and any other composites.

Products Show
Price Concessions Professional High-Precision Single-Sided Silicon Wafer Grinding and Polishing Equipment
Main features:
1, the use of AC inverter motor drive, soft start, soft stop, stable and reliable.
2, grinding machine adopts four stages of pressure, that is, light pressure, medium pressure, heavy pressure, repair operation process
3, the column grinding machine adopts PLC program control system and twist series, frequency conversion speed regulation, touch screen and operation panel, motor speed and running time can be directly set input.
4, the equipment adopts a grinding disk lifting mechanism, not a gear ring lifting, belongs to the pneumatic
5, the upper plate is separately set with a slow drop cylinder, not only effectively prevent the fragile workpiece from breaking, but also independent pressure control.
6, through the use of electronic preset counter, the number of grinding cycles, requirements can be accurately controlled.
7,Diamond dressing wheel can be used to repair the disc.
This machine is mainly used for grinding or polishing quartz chips, optical crystal, glass, sapphire on both sides.



SPECIFICATION 
Standard Specification
Model number FD-4B FD-5B FD-5B FD-6B FD-9B
Grinding disc specifications φ200xo100x12t  φ300xo120x12t  φ380xo140x12t  φ510xo200x12t φ635xo240x12t
Maximum workpiece size for processing Phi 60 mm Phi 100 mm Phi 130 mm Phi 165 mm Phi 200 mm
Grinding speed of upper grinding disc 0~60rpm 0~60rpm 0~60rpm 0~60rpm 0~60rpm
Motor power of upper grinding disc 0.2kw3 phase 380V 0.2kw3 phase 380V 0.4kw 3 phase 380V 0.75kw 3 phase 380V 1.5kw 3 phase 380V
Speed of the shaving machine 200mm/ min 200mm/ min 200mm/ min 200mm/ min 200mm/ min
Overall dimension (mm) 680x1000x2100 740x1100x2200 800x1200x2300 1000x1450x2400 1200x16150x2400
Weight 760kg 850kg 1100kg 1600kg 2300kg

SAMPLE DEMONSTRATION (SINGLE PLATE)
Price Concessions Professional High-Precision Single-Sided Silicon Wafer Grinding and Polishing Equipment
Price Concessions Professional High-Precision Single-Sided Silicon Wafer Grinding and Polishing Equipment

About the Company

Price Concessions Professional High-Precision Single-Sided Silicon Wafer Grinding and Polishing Equipment

Ponda is a high-tech enterprise specializing in all kinds of high precision grinding equipment, polishing equipment and itssupporting products and consumable materials.
We have a production workshop and testing equipment, assembly workers and mechanical design engineers45 people.

Patent
Price Concessions Professional High-Precision Single-Sided Silicon Wafer Grinding and Polishing Equipment

Delivery & Packing

Packing Details  : Packing, 1 pcs/wooden box.
Price Concessions Professional High-Precision Single-Sided Silicon Wafer Grinding and Polishing Equipment



FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.
Q2: Does Ponda charge for making samples?
A: No, it's free to make samples.
Q3: Is Ponda trader or manufacturer?
A: We are manufacturer, certified National High-Tech Enterprise.
Q4: How long does it take machine to deliver?
A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we provide oversea service and online tutorial.
Q6: How many type of machine does Ponda manufacture?
A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries.

 

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