a Multi-Purpose 3D Surface Ceramic Cover Sweeping Machine Equipped with Computer Setting Frequency Conversion

• After-sales Service: 12months
• Warranty: 12months
• Type: Surface Grinding Machine, Lapping Machine
• Processing Object: Flat Workpieces
• Abrasives: Grinding Wheel
• Controlling Mode: PLC
• Model NO.: FD42010A-3D
• Automatic Grade: Semiautomatic
• Cylindrical Grinder Type: Surface Grinding Machine
• Precision: High Precision
• Certification: ISO 9001, ISO 9001
• Condition: New
• Power Source: Electricity
• Disc(Wheel) Type: Grinding Disc
• Variable Speed: with Variable Speed
• Application: Grinding Industry
• Material: Metal and Non-Metal
• Disc Diameter: Φ910mm
• Service: Oversea Setup & After-Sale Avalaible
• Class: Single Plate
• Process Station: 3
• Pressure Source: Pneumatic or Weight Block
• Plate Material: Metal & Non-Metal
• Abrasive: Slurry
• Transport Package: Wood Crate
• Specification: 1200*1800*2300mm
• Trademark: PONDA
• Origin: China
• Production Capacity: 500 Unit/Year

Product Description

Why Ponda?
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ceramics, glass, industrial sapphire, plastics, and any other composites.
Scope of application:
Widely used in 3D ceramic surface, LED sapphire substrate, optical glass wafer, wafer, mold, stainless steel, zinc alloy and other materials 3D surface, 2.5D surface polishing.
 Products Show

Equipment advantages:
1. The rotation of the grinding disc can ensure the uniformity and symmetry of the swept products, effectively reduce scratches and repair scratches.
2. With dual structure of A and B disks, when A disks work, B disks can be loaded and unloaded, and A and B disks can set parameters independently, which can effectively improve work efficiency.
3. The upper plate can be accurately polished for 2.5D, 3D ceramic cover plate and key hole with carpet or brush, and it is multi-purpose (with computer setting frequency conversion).

APPLICATION

Process	Industry by Substance	Industry by Applicability
Single Plate Lapping & Polishing	Metal And Alloy Ceramic Oxide Carbide Glass Plastic Nature Stone	Sealing	valve and sealing ring(liquid, oil, gas)
		Semiconductor	LED substrate(Al2O3, Si, SiC) wafer substrate(Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, ZnO, AlN)
		Plastic	PE, E/VAC, SBS, SBR, NBR, SR, BR, PR
		Phone Frame(flat)	back plate
		PCB	adhesive, coating, circuit
		Optics(flat)	optical lens, optical reflector, scintillator cube, holographic glass, HUD glass, screen glass
		Radar	oxide coating plate
		Gemstone	jade, sapphire, agate, etc.
		Others	graphite block, gauge block, micrometer gauge, diamond, friction plate, knife, bearing, metal components, and any other precise hardware.
*NOTE: lapping can only remove slight thickness of workpiece. If need ultra thinning (≤100μm), thinner machine are needed.

SPECIFICATION 

Standard Specification
Workpiece disc diameter	Φ 420 mm
Number of workpieces	10 (2 digits)
Brush disc diameter	Φ 460 mm
Number of brush trays	10
Workpiece disk speed	0-60RPM
Brush disk speed	0-300RPM
Work disk power	Two 5.5KW three-phase 380v
Brush disk power	Four 2.2KW three-phase 380v
Lift servo motor power:	2 units 1KW
Displacement motor power:	0.75 KW
Working air pressure	0.4-0.6 MPa
Machine weight:	2700kg
Dimensions (L*W*H)	2510*1860*2170mm

Built-In Optional Kits
Grade		Standard		Upgraded		Advanced
Controls		Digital		Digital		Touch-Screen PLC
Pressure Source		Hand Weight Block		Pneumatic Weight Block Manual		Pneumatic Press Integrated with PLC
Slurry Supply System		-		Manual		Digital, Manual
Cylinder Bar Drive System		-		Manual		Integrated with PLC
Conditioning Ring Drive System		-		Manual		Integrated with PLC
Machine Enclosure		-		Framed by Aluminum Alloy		Framed by Metal Plate
*NOTE: the optional kits based on the production requirements, making samples can confirm if they are necessary.

SAMPLE DEMONSTRATION (SINGLE PLATE)



Patent

About the Company

Ponda is a high-tech enterprise specializing in all kinds of high precision grinding equipment, polishing equipment and itssupporting products and consumable materials
We have a production workshop and testing equipment, assembly workers and mechanical design engineers45 people

Delivery & Packing

Packing Details  : Packing, 1 pcs/carton.


FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.
Q2: Does Ponda charge for making samples?
A: No, it's free to make samples.
Q3: Is Ponda trader or manufacturer?
A: We are manufacturer, certified National High-Tech Enterprise.
Q4: How long does it take machine to deliver?
A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we provide oversea service and online tutorial.
Q6: How many type of machine does Ponda manufacture?
A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries.