3D and 2.5D Surface Mirror Polishing Machines Suitable for Various Materials

• After-sales Service: 12months
• Warranty: 12months
• Type: Surface Grinding Machine
• Processing Object: Flat Workpieces
• Abrasives: Grinding Wheel
• Controlling Mode: PLC
• Model NO.: FD-420
• Automatic Grade: Semiautomatic
• Cylindrical Grinder Type: Surface Grinding Machine
• Precision: High Precision
• Certification: ISO 9001
• Condition: New
• Power Source: Electricity
• Disc(Wheel) Type: Grinding Disc
• Variable Speed: with Variable Speed
• Material: Metal and Non-Metal
• Disc Diameter: Φ1200 mm
• Service: Oversea Setup & After-Sale Avalaible
• Class: Single Plate
• Pressure Source: Pneumatic or Weight Block
• Abrasive: Slurry
• Transport Package: Wood Crate
• Trademark: PONDA
• Origin: China
• Production Capacity: 500 Unit/Year

Product Description

Why Ponda?
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ceramics, glass, industrial sapphire, plastics, and any other composites.

Products Show

Working principle:
The grinding is a precision grinding and polishing equipment. The grinding and polishing products are placed on the grinding disc. The grinding disc rotates against the clock, and the grinding disc drives the workpiece to rotate
The workpiece is pressed, and the workpiece and the grinding disc are subjected to relative running friction to achieve the purpose of grinding and polishing.
Grinding disc dressing mechanism adopts oil pressure suspended guide rail, and the guide rail moves back and forth to realize the repairing action when repairing disc. The repairing knife is made of diamond material To the desired flatness and roughness effect.
peculiarity:
PLC program control, touch screen operation interface.
Marble repair disk system guide pedestal.

Type of equipment

Double-sided grinding (polishing) machine            Single-side grinding (polishing) machine                              Reducing machine

Application field

Single Plate Lapping & Polishing	Metal And Alloy Ceramic Oxide Carbide Glass Plastic Nature Stone	Sealing	valve and sealing ring(liquid, oil, gas)
		Semiconductor	LED substrate(Al2O3, Si, SiC) wafer substrate(Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, ZnO, AlN)
		Plastic	PE, E/VAC, SBS, SBR, NBR, SR, BR, PR
		Phone Frame(flat)	back plate
		PCB	adhesive, coating, circuit
		Optics(flat)	optical lens, optical reflector, scintillator cube, holographic glass, HUD glass, screen glass
		Radar	oxide coating plate
		Gemstone	jade, sapphire, agate, etc.
		Others	graphite block, gauge block, micrometer gauge, diamond, friction plate, knife, bearing, metal components, and any other precise hardware.
*NOTE: lapping can only remove slight thickness of workpiece. If need ultra thinning (≤100μm), thinner machine are needed.

·  The removal efficiency of grinding is small, and if the workpiece allowance is ≥100μm, a thinning machine needs to be configured. (Except softer materials)
·  This grinding machine is suitable for grinding and polishing of large workpieces.
SPECIFICATION 

Conventional parameter
Parameter/Model	FD-1003LWR	FD-1200X	FD-1600X	FD-2000X
Outside diameter of grinding disc	φ1000mm	φ1200mm	φ1600mm	Φ2000mm
Maximum machining size	φ300mm	Φ600mm	Φ1000mm	Φ1200mm
Main motor power	3KW	11KW	15KW	22KW
Power source	Three-phase 380V	Three-phase 380V	Three-phase 380V	Three-phase 380V
Grinding disc	optional	optional	optional	optional
Grinding fluid	customizable	customizable	customizable	customizable
Correction ring	Outer diameter 530 Inner diameter 480	_ _	_ _	_ _
Plate repairing machine	optional	Taping tray	Taping tray	Taping tray
Grinding speed	0—50rpm	0—50rpm	0—40rpm	0—40rpm
Timing range	99 hours and 59 minutes	99 hours and 59 minutes	99 hours and 59 minutes	99 hours and 59 minutes
Work station	3 groups	3 groups	3 groups	3 groups
Gross weight of equipment	≈1600kg	≈2800kg	≈3200kg	≈4500kg
Overall dimension	Length 1700x width 1300x height 1450mm	Length 2200x width 2000x height 1550mm	Length 2450x width 2050x height 1550mm	Length 1700x width 1300x height 1450mm

Built-In Optional Kits
Grade		Standard		Upgraded		Advanced
Controls		Digital		Digital		Touch-Screen PLC
Pressure Source		Hand Weight Block		Pneumatic Weight Block Manual		Pneumatic Press Integrated with PLC
Slurry Supply System		-		Manual		Digital, Manual
Cylinder Bar Drive System		-		Manual		Integrated with PLC
Conditioning Ring Drive System		-		Manual		Integrated with PLC
Machine Enclosure		-		Framed by Aluminum Alloy		Framed by Metal Plate
*NOTE: the optional kits based on the production requirements, making samples can confirm if they are necessary.

SAMPLE DEMONSTRATION (SINGLE PLATE)




Patent
About the company

Wooden case packing

FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.
Q2: Does Ponda charge for making samples?
A: No, it's free to make samples.
Q3: Is Ponda trader or manufacturer?
A: We are manufacturer, certified National High-Tech Enterprise.
Q4: How long does it take machine to deliver?
A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we provide oversea service and online tutorial.
Q6: How many type of machine does Ponda manufacture?
A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries.