Why Ponda?
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, wafer substrate, ceramics, glass, industrial sapphire, plastics, and any other composites.
Main uses:
The equipment is mainly used for grinding and polishing the upper and lower parallel end faces of sapphire substrate, aluminum sheet, ceramic sheet, optical glass, quartz crystal, other semiconductor materials and other hard brittle materials of non-metal and metal thin precision parts.
Products Show
equipment advantages:
Innovation is the basic concept of design, the equipment in the design of the careful analysis and comparison of similar equipment at home and abroad, the structure, control and functional characteristics, comprehensive, summarized and adopted the successful experience of many users and reasonable suggestions. Efforts to improve the technical content of the equipment, operating accuracy and running stability.
the special function of the equipment:
the equipment can set and store 30 sets of different process parameters (pressure, speed, time, number of turns) for the user to choose.
production accuracy:
flatness, parallelism up to 0.001mm
Equipment configuration:
Advanced Siemens PLC program controller is used to control the action of the whole machine with a high degree of automation, and the matched Siemens Smart 700 large screen touch screen interface displays the current state of the whole machine, realizes man-machine dialogue, and the operation is clear at a glance.
The use of variable frequency speed regulation and full gear transmission, so that the whole machine work stable start, stable operation, especially at low speed operation, to overcome the upper and lower grinding disk movement, crawling phenomenon.
The pneumatic actuator produced by ADEC and the pneumatic control component produced by SMC are used to realize the stepless pressure adjustment of the grinding disc in four stages: light pressure, medium pressure, high pressure and fine grinding, providing better grinding efficiency and a wider selection of grinding processes for the grinding workpiece.
The big gear ring can be lifted and lowered, and the lifting position can be adjusted. The height of the sun wheel can also be adjusted by periodically increasing or decreasing the number of gaskets.
Equipped with automatic lubrication equipment to lubricate the gears.
Equipped with master cylinder end locking mechanism, can conveniently and safely lock the upper grinding disc.
SPECIFICATION
| Standard Specification |
| Machine Model |
FD6B |
FD9B |
FD13-6B |
| Lower Plate Diameter |
Φ386 mm / 15 inches |
Φ640 mm / 25 inches |
Φ973 mm / 38 inches |
| Upper Plate Diameter |
Φ386 mm / 15 inches |
Φ640 mm / 25 inches |
Φ973 mm / 38 inches |
| Star Wheel Parameter |
DP 12, Z=66, A=20° |
DP 12, Z=108, A=20° |
DP 19.3, Z=152, A=20° |
| Conditioning Ring Parameter |
DP 12, Z=66, A=20° |
DP 12, Z=108, A=20° |
DP 19.3, Z=152, A=20° |
| Max. Workpiece Diameter |
Φ120 mm |
Φ180 mm |
Φ290 mm |
| Process Thickness |
0.2mm≤N≤20mm |
0.2mm≤N≤25mm |
0.2mm≤N≤30mm |
| Number of Station |
3≤N≤5 |
3≤N≤5 |
3≤N≤5 |
| Plate Rotate Speed |
0-60 rpm |
0-60 rpm |
0-50 rpm |
| Total Weight |
600 kg |
2000 kg |
3200 kg |
| Total Floor Space |
700×950 mm |
1350x960 mm |
1700×1380 mm |
| Built-In Optional Kits |
| Grade |
Standard |
Advanced |
| Slurry Supply System |
- |
Integrated with PLC |
| Facing and Grooving System |
- |
Integrated with PLC |
| Machine Enclosure |
- |
Framed by Metal Plate |
| *NOTE: the optional kits based on the production requirements, making samples can confirm if they are necessary. |
SAMPLE DEMONSTRATION (DOUBLE PLATE)
About the Company
Factory front desk
Ponda is a high-tech enterprise specializing in all kinds of high precision grinding equipment, polishing equipment and its
supporting products and consumable materials
Production and assembly shop
We have a production workshop and testing equipment, assembly workers and mechanical design engineers
45 people
Patent
FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.
Q2: Does Ponda charge for making samples?
A: No, it's free to make samples.
Q3: Is Ponda trader or manufacturer?
A: We are manufacturer, certified National High-Tech Enterprise.
Q4: How long does it take machine to deliver?
A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we provide oversea service and online tutorial.
Q6: How many type of machine does Ponda manufacture?
A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries.
Audited Supplier 
){kind=link}
){kind=link}