• High Precision Double-Sided Grinding and Polishing Machine for Ceramic Processes
  • High Precision Double-Sided Grinding and Polishing Machine for Ceramic Processes
  • High Precision Double-Sided Grinding and Polishing Machine for Ceramic Processes
  • High Precision Double-Sided Grinding and Polishing Machine for Ceramic Processes
  • High Precision Double-Sided Grinding and Polishing Machine for Ceramic Processes
  • High Precision Double-Sided Grinding and Polishing Machine for Ceramic Processes

High Precision Double-Sided Grinding and Polishing Machine for Ceramic Processes

After-sales Service: 12months
Warranty: 12months
Type: Surface Grinding Machine
Processing Object: Flat Workpieces
Abrasives: Grinding Wheel
Controlling Mode: PLC
Samples:
US$ 0/Piece 1 Piece(Min.Order)
| Request Sample
Customization:
Manufacturer/Factory & Trading Company

360° Virtual Tour

Diamond Member Since 2021

Suppliers with verified business licenses

Guangdong, China
Cooperated with Fortune 500
This supplier has Cooperated with Fortune 500 companies
Years of Export Experience
The export experience of the supplier is more than 10 years
Experienced Team
The supplier has 15 foreign trading staff(s) and 13 staff(s) with over 6 years of overseas trading experience
R&D Capabilities
The supplier has 10 R&D engineers, you can check the Audit Report for more information
to see all verified strength labels (26)

Basic Info.

Model NO.
FD -6B
Automatic Grade
Semiautomatic
Cylindrical Grinder Type
Surface Grinding Machine
Precision
High Precision
Certification
ISO 9001
Condition
New
Power Source
Electricity
Disc(Wheel) Type
Grinding Disc
Material
Metal
Variable Speed
with Variable Speed
Application
Grinding Industry
Disc Diameter
965mm
Service
Oversea Setup & After-Sale Avalaible
Class
Double Plate
Process Station
3-5
Pressure Source
Pneumatic
Plate Material
Metal and Non-Metal
Abrasive
Lapping Slurry
Transport Package
Wood Crate
Trademark
PONDA
Origin
China
Production Capacity
500 Unit/Year

Product Description

Why Ponda?
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, wafer substrate, ceramics, glass, industrial sapphire, plastics, and any other composites.

Main uses:
The equipment is mainly used for precision grinding of sapphire substrate, tungsten steel blade, ceramic blade and other hard and brittle materials.
Products Show
High Precision Double-Sided Grinding and Polishing Machine for Ceramic Processes
Characteristic point:
1. The upper and lower grinding discs of this series of grinding machines can be repaired automatically.
2. Using four motors to drive synchronously, the speed range is wider, the motion accuracy is higher, the response speed is faster, can adapt to the requirements of different grinding materials and grinding process, and achieve soft start, soft stop, speed stability, small impact.
3. The shaving machine is driven by servo motor, which can ensure the sliding of the hydraulic suspended guide rail more smoothly, and the plane dressing effect is not good.
4. The control system adopts DSP, Web-Link, color terminal and other advanced technology, the system response speed is faster, more accurate, and has remote monitoring, remote maintenance functions;
5. This series of grinding machine has grating thickness control system, the thickness tolerance of the product after processing can be controlled within the range of ±0.002mm.


APPLICATION
Process Industry by Substance Industry by Applicability
Double
Plate
Lapping
& Polishing
Metal And Alloy
Ceramic
Oxide
Carbide
Glass
Plastic
Nature Stone
Sealing valve and sealing ring(liquid, oil, gas)
Semiconductor LED substrate(Al2O3, Si, SiC)
wafer substrate(Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, ZnO, AlN)
Plastic PE, E/VAC, SBS, SBR, NBR, SR, BR, PR
Optics(flat) optical lens, optical reflector, scintillator cube, holographic glass, HUD glass, screen glass
Gemstone jade, sapphire, agate, etc.
Others graphite block, gauge block, micrometer gauge, diamond, friction plate, knife, bearing, metal components, and any other precise hardware.
*NOTE: lapping can only remove slight thickness of workpiece. If need ultra thinning(≤100μm), thinner machine are needed.

SPECIFICATION
Standard Specification
Machine Model Φ965xΦ385x45 Gear ring lifting height 35mm
Main motor Y132M-4 7.5KW Planetary wheel specification DP12Z = 152α =20°
Lower grinding disc speed 0-50RPM Auxiliary motor Y90L-4 1.5KW
Number of planet wheels placed n
3≤N≤6
Master cylinder Φ125x450 mm
Sand pump motor AB-100  250W Product grinding parallelism 0.002 mm
Number of planetary wheels 6 Disk repair machine 200W
Grinding workpiece thickness b 0.2 mm or less b 20 mm or less Lifting cylinder Φ80x250 mm
Equipment dimensions 1700x1350x2650 (L x W x H) Grinding workpiece ideal specification Φ 200 mm
End lock cylinder 32x15 mm Equipment quality 3000kg
*NOTE: the optional kits based on the production requirements, making samples can confirm if they are necessary.

SAMPLE DEMONSTRATION (DOUBLE PLATE)
High Precision Double-Sided Grinding and Polishing Machine for Ceramic Processes

About the Company
High Precision Double-Sided Grinding and Polishing Machine for Ceramic Processes
High Precision Double-Sided Grinding and Polishing Machine for Ceramic Processes

Factory front desk
Ponda is a high-tech enterprise specializing in all kinds of high precision grinding equipment, polishing equipment and its
supporting products and consumable materials

High Precision Double-Sided Grinding and Polishing Machine for Ceramic Processes
High Precision Double-Sided Grinding and Polishing Machine for Ceramic Processes
Production and assembly shop
We have a production workshop and testing equipment, assembly workers and mechanical design engineers
45 people

patent
High Precision Double-Sided Grinding and Polishing Machine for Ceramic Processes
Delivery & Packing
Packing Details  : Packing, 1 pcs/carton.
High Precision Double-Sided Grinding and Polishing Machine for Ceramic Processes
High Precision Double-Sided Grinding and Polishing Machine for Ceramic Processes
High Precision Double-Sided Grinding and Polishing Machine for Ceramic Processes


FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.
Q2: Does Ponda charge for making samples?
A: No, it's free to make samples.
Q3: Is Ponda trader or manufacturer?
A: We are manufacturer, certified National High-Tech Enterprise.
Q4: How long does it take machine to deliver?
A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we provide oversea service and online tutorial.
Q6: How many type of machine does Ponda manufacture?
A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries.

Send your message to this supplier

*From:
*To:
*Message:

Enter between 20 to 4,000 characters.

This is not what you are looking for? Post a Sourcing Request Now

You Might Also Like

Diamond Member Since 2021

Suppliers with verified business licenses

Manufacturer/Factory & Trading Company
Registered Capital
1.48 Million USD
Plant Area
11500 square meters