Why Ponda?
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, wafer substrate, ceramics, glass, industrial sapphire, plastics, and any other composites.
Products Show
High precision grinding machine features:
1. The upper and lower grinding disks of this series of grinding machines can be repaired automatically.
2. Using four motors to run synchronously [Microsoft user 1], the speed change range is wider, the motion accuracy is higher, the response speed is faster, can adapt to the requirements of different grinding materials and grinding process, soft start, soft stop, speed stability, small impact.
3. The shaving machine is driven by servomotor, which can ensure the sliding of the hydraulic suspended guide rail is more stable and the plane dressing effect is better.
4. DSP, web-link, color terminal and other advanced technologies are adopted in the control system. The response speed of the system is faster and more accurate, and it has remote monitoring and remote maintenance functions.
5, the use of advanced Siemens PLC program controller, control the action of the machine, high degree of automation, and matched by Siemens Smart 700 large screen touch screen interface, display the current state of the machine, man-machine dialogue, operation at a glance.
6, the use of frequency control and full gear drive, so that the whole machine work when starting stable, stable operation, especially at low speed, to overcome the upper and lower grinding disk movement, crawling phenomenon.
APPLICATION
| Process |
Industry by Substance |
Industry by Applicability |
Double
Plate
Lapping
& Polishing |
Metal And Alloy
Ceramic
Oxide
Carbide
Glass
Plastic
Nature Stone |
Sealing |
valve and sealing ring(liquid, oil, gas) |
| Semiconductor |
LED substrate(Al2O3, Si, SiC)
wafer substrate(Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, ZnO, AlN) |
| Plastic |
PE, E/VAC, SBS, SBR, NBR, SR, BR, PR |
| Optics(flat) |
optical lens, optical reflector, scintillator cube, holographic glass, HUD glass, screen glass |
| Gemstone |
jade, sapphire, agate, etc. |
| Others |
graphite block, gauge block, micrometer gauge, diamond, friction plate, knife, bearing, metal components, and any other precise hardware. |
| *NOTE: lapping can only remove slight thickness of workpiece. If need ultra thinning(≤100μm), thinner machine are needed. |
SPECIFICATION
| Standard Specification |
| Machine Model |
FD6B |
FD9B |
FD13-6B |
| Lower Plate Diameter |
Φ386 mm / 15 inches |
Φ640 mm / 25 inches |
Φ973 mm / 38 inches |
| Upper Plate Diameter |
Φ386 mm / 15 inches |
Φ640 mm / 25 inches |
Φ973 mm / 38 inches |
| Star Wheel Parameter |
DP 12, Z=66, A=20° |
DP 12, Z=108, A=20° |
DP 19.3, Z=152, A=20° |
| Conditioning Ring Parameter |
DP 12, Z=66, A=20° |
DP 12, Z=108, A=20° |
DP 19.3, Z=152, A=20° |
| Max. Workpiece Diameter |
Φ120 mm |
Φ180 mm |
Φ290 mm |
| Process Thickness |
0.2mm≤N≤20mm |
0.2mm≤N≤25mm |
0.2mm≤N≤30mm |
| Number of Station |
3≤N≤5 |
3≤N≤5 |
3≤N≤5 |
| Plate Rotate Speed |
0-60 rpm |
0-60 rpm |
0-50 rpm |
| Total Weight |
600 kg |
2000 kg |
3200 kg |
| Total Floor Space |
700×950 mm |
1350x960 mm |
1700×1380 mm |
| Built-In Optional Kits |
| Grade |
Standard |
Advanced |
| Slurry Supply System |
- |
Integrated with PLC |
| Facing and Grooving System |
- |
Integrated with PLC |
| Machine Enclosure |
- |
Framed by Metal Plate |
| *NOTE: the optional kits based on the production requirements, making samples can confirm if they are necessary. |
SAMPLE DEMONSTRATION (DOUBLE PLATE)
About the Company
Factory front desk
Ponda is a high-tech enterprise specializing in all kinds of high precision grinding equipment, polishing equipment and its
supporting products and consumable materials
Production and assembly shop
We have a production workshop and testing equipment, assembly workers and mechanical design engineers
45 people
patent
Delivery & Packing
Packing Details : Packing, 1 pcs/carton.
FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.
Q2: Does Ponda charge for making samples?
A: No, it's free to make samples.
Q3: Is Ponda trader or manufacturer?
A: We are manufacturer, certified National High-Tech Enterprise.
Q4: How long does it take machine to deliver?
A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we provide oversea service and online tutorial.
Q6: How many type of machine does Ponda manufacture?
A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries.
High precision grinding machine features:
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