Supply Single Crystal Silicon Wafer Polishing Processing Equipment

Product Details
Customization: Available
After-sales Service: 12months
Warranty: 12months
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  • Supply Single Crystal Silicon Wafer Polishing Processing Equipment
  • Supply Single Crystal Silicon Wafer Polishing Processing Equipment
  • Supply Single Crystal Silicon Wafer Polishing Processing Equipment
  • Supply Single Crystal Silicon Wafer Polishing Processing Equipment
  • Supply Single Crystal Silicon Wafer Polishing Processing Equipment
  • Supply Single Crystal Silicon Wafer Polishing Processing Equipment
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Basic Info.

Model NO.
FD-4603P
Type
Surface Grinding Machine, Lapping Machine
Processing Object
Flat Workpieces
Abrasives
Grinding Wheel
Controlling Mode
PLC
Automatic Grade
Semiautomatic
Cylindrical Grinder Type
Surface Grinding Machine
Precision
High Precision
Certification
ISO 9001
Condition
New
Power Source
Electricity
Disc(Wheel) Type
Grinding Disc
Variable Speed
with Variable Speed
Application
Grinding Industry
Material
Metal and Non-Metal
Disc Diameter
Φ460 mm
Service
Oversea Setup & After-Sale Avalaible
Class
Single Plate
Process Station
3
Pressure Source
Pneumatic or Weight Block
Plate Material
Metal & Non-Metal
Abrasive
Slurry
Weight
1000kg
Transport Package
Wood Crate
Trademark
PONDA
Origin
China
Production Capacity
500 Unit/Year

Product Description

Why Ponda?
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ceramics, glass, industrial sapphire, plastics, and any other composites.

Scope of application:
Widely used in LED sapphire substrate, optical glass wafers, quartz wafers, silicon wafers, sheets, stainless steel, light joint and other materials such as single-side polishing.

Products Show
Supply Single Crystal Silicon Wafer Polishing Processing EquipmentHigh precision polishing machine features:
1, frequency conversion control, soft start, soft stop, small impact, reduce workpiece damage.
2, using the timing function to control the time, processing products can be pre-set on the panel time and speed, working time to set time, the machine automatically stops working, can better control the size of the product.
3, polishing machine parts pressure using pressure weight block pressure, polishing workpiece surface brightness, no scratch, no scratch, no material grain, no pitting, no edge collapse, high flatness characteristics. After polishing, the workpiece surface roughness can reach Ra0.002.
4, the use of interval automatic liquid spraying device, can be freely set the liquid spraying interval time, grinding liquid can be evenly sprayed on the disc, to achieve the stability of the workpiece. Reduce the polishing time, save the cost of consumables, but also meet the requirements of the environment.
5, the use of imported bearings, motor, to ensure the stability and life of the equipment, to ensure the precision requirements of the workpiece.


APPLICATION
Process Industry by Substance Industry by Applicability
Single
Plate
Lapping
& Polishing
Metal And Alloy
Ceramic
Oxide
Carbide
Glass
Plastic
Nature Stone
Sealing valve and sealing ring(liquid, oil, gas)
Semiconductor LED substrate(Al2O3, Si, SiC)
wafer substrate(Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, ZnO, AlN)
Plastic PE, E/VAC, SBS, SBR, NBR, SR, BR, PR
Phone Frame(flat) back plate
PCB adhesive, coating, circuit
Optics(flat) optical lens, optical reflector, scintillator cube, holographic glass, HUD glass, screen glass
Radar oxide coating plate
Gemstone jade, sapphire, agate, etc.
Others graphite block, gauge block, micrometer gauge, diamond, friction plate, knife, bearing, metal components, and any other precise hardware.
*NOTE: lapping can only remove slight thickness of workpiece. If need ultra thinning (≤100μm), thinner machine are needed.


SPECIFICATION
 
Standard Specification
Machine Model FD3803 FD4603 FD6103 FD9104
Plate Diameter Φ380 mm / 15 inches Φ460mm / 18 inches Φ610mm / 24 inches Φ910mm / 36 inches
Max. Workpiece Diameter
(without conditioning ring)
Φ180 mm Φ220 mm Φ270 mm Φ420 mm
Conditioning Ring Diameter Φ180 mm Φ220 mm Φ270 mm Φ420 mm
Number of Station 3 3 3 4
Plate Rotate Speed 0-140 rpm 0-140 rpm 0-120 rpm 0-90 rpm
Facing & Grooving Speed
(Not include in Polishing)
0-120 mm/m 0-120 mm/m 0-120 mm/m 0-120 mm/m
Total Weight 450 kg 780 kg 1000 kg 1600 kg
Total Floor Space 670×940 mm 1030×730 mm 1920×840 mm 2100×1300 mm
Built-In Optional Kits
Grade Standard Upgraded Advanced
Controls Digital Digital Touch-Screen PLC
Pressure Source Hand Weight Block Pneumatic Weight Block
Manual
Pneumatic Press
Integrated with PLC
Slurry Supply System - Manual Digital, Manual
Cylinder Bar Drive System - Manual Integrated with PLC
Conditioning Ring Drive System - Manual Integrated with PLC
Machine Enclosure - Framed by Aluminum Alloy Framed by Metal Plate
*NOTE: the optional kits based on the production requirements, making samples can confirm if they are necessary.





SAMPLE DEMONSTRATION (SINGLE PLATE)
Supply Single Crystal Silicon Wafer Polishing Processing Equipment
Supply Single Crystal Silicon Wafer Polishing Processing Equipment


Patent
Supply Single Crystal Silicon Wafer Polishing Processing Equipment

About the Company
Supply Single Crystal Silicon Wafer Polishing Processing Equipment
Supply Single Crystal Silicon Wafer Polishing Processing Equipment

Factory front desk
Ponda is a high-tech enterprise specializing in all kinds of high precision grinding equipment, polishing equipment and its
supporting products and consumable materials

Supply Single Crystal Silicon Wafer Polishing Processing Equipment
Supply Single Crystal Silicon Wafer Polishing Processing Equipment
Production and assembly shop
We have a production workshop and testing equipment, assembly workers and mechanical design engineers
45 people

Delivery & Packing
Packing Details : Packing, 1 pcs/carton.

Supply Single Crystal Silicon Wafer Polishing Processing Equipment


FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.
Q2: Does Ponda charge for making samples?
A: No, it's free to make samples.
Q3: Is Ponda trader or manufacturer?
A: We are manufacturer, certified National High-Tech Enterprise.
Q4: How long does it take machine to deliver?
A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we provide oversea service and online tutorial.
Q6: How many type of machine does Ponda manufacture?
A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries.

 

 

 

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