Customization: | Available |
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After-sales Service: | 12months |
Warranty: | 12months |
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Process | Industry by Substance | Industry by Applicability | |
Double Plate Lapping & Polishing |
Metal And Alloy Ceramic Oxide Carbide Glass Plastic Nature Stone |
Sealing | valve and sealing ring(liquid, oil, gas) |
Semiconductor | LED substrate(Al2O3, Si, SiC) wafer substrate(Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, ZnO, AlN) |
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Plastic | PE, E/VAC, SBS, SBR, NBR, SR, BR, PR | ||
Optics(flat) | optical lens, optical reflector, scintillator cube, holographic glass, HUD glass, screen glass | ||
Gemstone | jade, sapphire, agate, etc. | ||
Others | graphite block, gauge block, micrometer gauge, diamond, friction plate, knife, bearing, metal components, and any other precise hardware. | ||
*NOTE: lapping can only remove slight thickness of workpiece. If need ultra thinning(≤100μm), thinner machine are needed. |
Standard Specification | |||||
Grinding disc size | Φ965xΦ385x45 | ||||
Gear ring lifting height | 35mm | ||||
Main motor | Y132M-4 7.5KW | ||||
Planetary wheel size | DP12 Z=152 α=20° | ||||
Lower grinding disc speed | 0-50RPM | ||||
Auxiliary motor | Y90L-4 1.5KW | ||||
Number of planetary wheels placed n | 3≤N≤6 | ||||
Master cylinder | Φ125x450 mm | ||||
Sand pump motor | AB-100 250W | ||||
Grinding workpiece thickness b | 0.2mm ≤ b ≤20mm | ||||
Lifting cylinder | Φ80x250 mm | ||||
The overall dimensions of the equipment are | 1700x1350x2650mm | ||||
Ideal size of grinding workpiece | Φ125 | ||||
The weight of the equipment is | 3000kg | ||||
Flatness of grinding disc | 0.008 | ||||
Built-In Optional Kits | |||||
Grade | Standard | Advanced | |||
Slurry Supply System | - | Integrated with PLC | |||
Facing and Grooving System | - | Integrated with PLC | |||
Machine Enclosure | - | Framed by Metal Plate | |||
*NOTE: the optional kits based on the production requirements, making samples can confirm if they are necessary. |