Ponda Supplies High Precision Surface Grinding Machine for Ceramic Mirror Polishing

• Customization: Available
• After-sales Service: 12months
• Warranty: 12months
• Model NO.: 9104
• Type: Surface Grinding Machine
• Processing Object: Flat Workpieces
• Abrasives: Grinding Wheel
• Controlling Mode: PLC
• Automatic Grade: Semiautomatic
• Cylindrical Grinder Type: Surface Grinding Machine
• Precision: High Precision
• Certification: ISO 9001
• Condition: New
• Power Source: Electricity
• Variable Speed: with Variable Speed
• Object: Metal&Nonmetal
• Application: Grinding Industry
• Disc(Wheel) Type: Buffing Pads
• Material: Metal and Non-Metal
• Disc Diameter: Φ 910mm
• Service: Oversea Setup & After-Sale Avalaible
• Class: Single Plate
• Process Station: 3
• Pressure Source: Pneumatic or Weight Block
• Plate Material: Metal & Non-Metal
• Abrasive: Slurry
• Transport Package: Wood Crate
• Specification: 750*700*700mm
• Trademark: PONDA
• Origin: China
• Production Capacity: 500 Unit/Year

Product Description

Why Ponda?
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ceramics, glass, industrial sapphire, plastics, and any other composites.

Products Show
Applicable to ceramic, sapphire, various crystal materials, aluminum alloy, stainless steel and other metal and non-metallic materials grinding, polishing.

Wafer Lapping & CMP Series
 Wafer lapping & CMP series is specially advanced version of the regular with lifting structure, professionalized in wafer lapping and CMP. The high-end series newly consists of infrared temperature sensor, plate cooling system and vacuum system, and allows user to operate each station individually thru GUI control panel. Besides the added functions, the upgraded mechanical parts such as motors,  bearings and low-CTE materials have ability to attain higher performance than the regular.

When to process lapping and CMP
  As when the wafer made of inflexible materials like SiC and sapphire(Al2O3) is too tough against abrasive especially of fine grinding, the lapping becomes competent for removal of thickness and the spiral grooves.         CMP comes after lapping and fine grinding confidently. The purpose of polishing guarantees declined rate of wafer fragmentation when transporting because it greatly strengthens toughness by stress relief, also to provide convenience for subsequent fabrication because of increased roughness.

APPLICATION 

Process	Industry by Substance	Industry by Applicability
High Speed Grinding & Thinning	Metal And Alloy Ceramic Oxide Carbide Glass Plastic Nature Stone	Sealing	sealing ring(liquid, oil, gas)
		Semiconductor	substrate(Al2O3, Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, ZnO, AlN) used in Wafer, LED., etc
		Plastic	Hard Plastic
		Optics(flat)	optical lens, optical reflector, holographic glass, HUD glass, screen glass
		Gemstone	jade, sapphire, agate, etc.
		Others	gauge block, micrometer gauge, friction plate, metal components, and any other precise hardware.
*NOTE: spiral stripe appears after high speed grinding and thinning. To dispel it, lap or polish are needed.

SPECIFICATION 

Standard Specification
Machine Model	FD7104XA		FD9104XA
Plate Diameter	Φ700*250*12MM		Φ910*250*12MM
Max. Workpiece Diameter (without conditioning ring)	Φ305 mm		Φ400 mm
Conditioning Ring Diameter	Φ305 mm		Φ400 mm
Drive cylinder	4		4
Plate Rotate Speed	5-90rpm		5-90 rpm
Rotating speed of working disk	5-40RPM		5-40RPM
Main motor power	7.5KW/three-phase (physics)380V		7.5KW/three-phase (physics)380V
Drive motor power	0.4kw		0.4kw
Facing machine power	0.4kw		0.4kw
Total Weight	2000 kg		2500 kg
Total Floor Space	1050×1650X2300 mm		1200X1800X2300mm

SAMPLE DEMONSTRATION (SINGLE PLATE)



Patent

About the Company

Ponda is a high-tech enterprise specializing in all kinds of high precision grinding equipment, polishing equipment and itssupporting products and consumable materials
We have a production workshop and testing equipment, assembly workers and mechanical design engineers45 people

Delivery and packing
Packing Instructions: Packing, 1 / wooden box.

FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.
Q2: Does Ponda charge for making samples?
A: No, it's free to make samples.
Q3: Is Ponda trader or manufacturer?
A: We are manufacturer, certified National High-Tech Enterprise.
Q4: How long does it take machine to deliver?
A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we provide oversea service and online tutorial.
Q6: How many type of machine does Ponda manufacture?
A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries.