• CNC High Precision Ceramic Mobile Phone Back Cover Sweeping Machine Plane Polishing Machine
  • CNC High Precision Ceramic Mobile Phone Back Cover Sweeping Machine Plane Polishing Machine
  • CNC High Precision Ceramic Mobile Phone Back Cover Sweeping Machine Plane Polishing Machine
  • CNC High Precision Ceramic Mobile Phone Back Cover Sweeping Machine Plane Polishing Machine
  • CNC High Precision Ceramic Mobile Phone Back Cover Sweeping Machine Plane Polishing Machine
  • CNC High Precision Ceramic Mobile Phone Back Cover Sweeping Machine Plane Polishing Machine

CNC High Precision Ceramic Mobile Phone Back Cover Sweeping Machine Plane Polishing Machine

After-sales Service: 12months
Warranty: 12months
Type: Surface Grinding Machine, Lapping Machine
Processing Object: Flat Workpieces
Abrasives: Grinding Wheel
Controlling Mode: Pcl
Samples:
US$ 0/Piece 1 Piece(Min.Order)
| Request Sample
Customization:
Manufacturer/Factory & Trading Company

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Diamond Member Since 2021

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Guangdong, China
Cooperated with Fortune 500
This supplier has Cooperated with Fortune 500 companies
Years of Export Experience
The export experience of the supplier is more than 10 years
Experienced Team
The supplier has 15 foreign trading staff(s) and 13 staff(s) with over 6 years of overseas trading experience
R&D Capabilities
The supplier has 10 R&D engineers, you can check the Audit Report for more information
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Basic Info.

Model NO.
FD-420LP
Automatic Grade
Semiautomatic
Cylindrical Grinder Type
Surface Grinding Machine
Precision
High Precision
Certification
ISO 9001
Condition
New
Power Source
Electricity
Disc(Wheel) Type
Grinding Disc
Variable Speed
with Variable Speed
Application
Mobile Phone Back Shell Glass, Ceramic, etc
Material
Metal and Non-Metal
Working Style
Polish
Service
Oversea Setup & After-Sale Avalaible
Class
Single Plate
Process Station
3
Pressure Source
Pneumatic or Weight Block
Plate Material
Metal & Non-Metal
Abrasive
Slurry
Weight
1000kg
Transport Package
Wood Crate
Trademark
PONDA
Origin
China
Production Capacity
500 Unit/Year

Product Description

Why Ponda?
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ceramics, glass, industrial sapphire, plastics, and any other composites.

Products Show
CNC High Precision Ceramic Mobile Phone Back Cover Sweeping Machine Plane Polishing Machine
Polishing machine advantages:
1. The rotary qing disk can ensure the uniformity and symmetry of the sweeping products, effectively reduce scratches and repair scratches.
2.The upper grinding disc adopts intermediate water supply to give full play to the cutting force of grinding powder, improve processing efficiency and reduce the loss of carpet and brush.
3.A, B double mother structure, in A mother work at the same time a mother day loading and unloading, the machine does not stop to work effectively improve the efficiency, compared to the general cleaning machine capacity up to 2-3 times.
4.The hanging plate can be accurately polished for 2.5D, 3D and key hole by carpet or brush, multi-purpose (with computer set frequency conversion).
5.Lower plate (A·B plate) adopts multi-position adjustable vacuum adsorption, equipped with direct air automatic adsorption and automatic drainage system, easier to operate.
6. Choose what clothes pressure regulating system, in the production of different products only need to set the pressure parameters of the words, the computer self-test pressure value, self-regulation pressure.
7. Effectively control the pressure. Ensure the stability and unity of the product, save the staff constantly adjust the pressure trouble, easier to operate.
8. Select high-end configuration and strong functionality. A, B disk port set parameters independently, the same equipment processing different two kinds of products, a multi-purpose machine, strong practicability.


APPLICATION
Single
Plate
Lapping
& Polishing
Metal And Alloy
Ceramic
Oxide
Carbide
Glass
Plastic
Nature Stone
Sealing valve and sealing ring(liquid, oil, gas)
Semiconductor LED substrate(Al2O3, Si, SiC)
wafer substrate(Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, ZnO, AlN)
Plastic PE, E/VAC, SBS, SBR, NBR, SR, BR, PR
Phone Frame(flat) back plate
PCB adhesive, coating, circuit
Optics(flat) optical lens, optical reflector, scintillator cube, holographic glass, HUD glass, screen glass
Radar oxide coating plate
Gemstone jade, sapphire, agate, etc.
Others graphite block, gauge block, micrometer gauge, diamond, friction plate, knife, bearing, metal components, and any other precise hardware.
*NOTE: lapping can only remove slight thickness of workpiece. If need ultra thinning (≤100μm), thinner machine are needed.

SPECIFICATION 
Equipment parameters:
Workpiece disc diameter Φ420mm
Number of work plates 10 (2 positions)
Brush disc diameter Φ460
Number of brush trays 10
Workpiece disk speed 0-60RPM
Brush disc speed   0-300RPM
Lift servo motor power 2 sets 1KW
Displacement motor power  0.75KW
Working air pressure 0.4-0.6MPa
The machine weighs 2700kg
Dimensions (L*W*H) 2510*1860*2170mm
Built-In Optional Kits
Grade Standard Upgraded Advanced
Controls Digital Digital Touch-Screen PLC
Pressure Source Hand Weight Block Pneumatic Weight Block
Manual
Pneumatic Press
Integrated with PLC
Slurry Supply System - Manual Digital, Manual
Cylinder Bar Drive System - Manual Integrated with PLC
Conditioning Ring Drive System - Manual Integrated with PLC
Machine Enclosure - Framed by Aluminum Alloy Framed by Metal Plate
*NOTE: the optional kits based on the production requirements, making samples can confirm if they are necessary.

SAMPLE DEMONSTRATION (SINGLE PLATE)
CNC High Precision Ceramic Mobile Phone Back Cover Sweeping Machine Plane Polishing Machine
CNC High Precision Ceramic Mobile Phone Back Cover Sweeping Machine Plane Polishing Machine

Patent
CNC High Precision Ceramic Mobile Phone Back Cover Sweeping Machine Plane Polishing Machine

About the Company

CNC High Precision Ceramic Mobile Phone Back Cover Sweeping Machine Plane Polishing Machine

Ponda is a high-tech enterprise specializing in all kinds of high precision grinding equipment, polishing equipment and itssupporting products and consumable materials
We have a production workshop and testing equipment, assembly workers and mechanical design engineers45 people

Delivery & Packing
Packing Details  : Packing, 1 PC/wooden box
CNC High Precision Ceramic Mobile Phone Back Cover Sweeping Machine Plane Polishing Machine

CNC High Precision Ceramic Mobile Phone Back Cover Sweeping Machine Plane Polishing Machine
FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.
Q2: Does Ponda charge for making samples?
A: No, it's free to make samples.
Q3: Is Ponda trader or manufacturer?
A: We are manufacturer, certified National High-Tech Enterprise.
Q4: How long does it take machine to deliver?
A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we provide oversea service and online tutorial.
Q6: How many type of machine does Ponda manufacture?
A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries.

 

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Diamond Member Since 2021

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Manufacturer/Factory & Trading Company
Registered Capital
1.48 Million USD
Plant Area
11500 square meters