Shenzhen Pangda Laboratory High Precision Silicon Wafer Grinding and Polishing Machine

• After-sales Service: 12months
• Warranty: 12months
• Type: Surface Grinding Machine, Surface Grinding Machine
• Processing Object: Flat Workpieces, Shenzhen Pangda Laboratory High Precision Silicon
• Abrasives: Grinding Wheel, Grinding Wheel
• Controlling Mode: PLC, CNC
• Model NO.: 380
• Automatic Grade: Semiautomatic
• Cylindrical Grinder Type: Surface Grinding Machine
• Precision: High Precision, High Precision
• Certification: ISO 9001, ISO 9001
• Condition: New, New
• After-Sales Service: Engineers Available to Service Machinery Overseas
• Service: Oversea Setup & After-Sale Avalaible
• Class: Grinding
• Process Station: 1
• Abrasive: Recyclable Water & Grinding Wheel
• Workpiece Accuracy Control(Parallelism): 1um
• Power of Grinding Wheel Motor: 5.5kw
• Transport Package: Wood Crate
• Trademark: PONDA
• Origin: China
• Production Capacity: 500 Unit/Year

Product Description

Why Ponda?
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ceramics, glass, industrial sapphire, plastics, and any other composites.
Products Show
Working principle:
1. The grinding machine is a precision grinding and polishing equipment, the grinding and polishing materials are placed on the grinding disc, the grinding disc rotates against the clock, the correction wheel drives the workpiece to rotate, the gravity pressure on the workpiece, the workpiece and the grinding disc for relative running friction, to achieve the purpose of grinding and polishing.
2. The dressing mechanism of the grinding disc adopts the hydraulic suspension guide rail to move back and forth, and the diamond trimming knife trims the grinding surface of the grinding disc precisely to obtain the ideal plane effect.

Special points:
1. Usually, the traditional way of polishing plate is to use electroplate wheel to trim, which is not ideal. The error will be tens of microns or even hundreds of microns, through the dressing machine, grinding disc flatness can reach ±0.002mm. The flatness of the workpiece after processing can reach ±0.0005mm (φ50mm).
2. A series of grinding machine parts are pressurized by pressing the weight block.

APPLICATION

Process	Industry by Substance	Industry by Applicability
High Speed Grinding & Thinning	Metal And Alloy Ceramic Oxide Carbide Glass Plastic Nature Stone	Sealing	sealing ring(liquid, oil, gas)
		Semiconductor	substrate(Al2O3, Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, ZnO, AlN) used in Wafer, LED., etc
		Plastic	Hard Plastic
		Optics(flat)	optical lens, optical reflector, holographic glass, HUD glass, screen glass
		Gemstone	jade, sapphire, agate, etc.
		Others	gauge block, micrometer gauge, friction plate, metal components, and any other precise hardware.
*NOTE: spiral stripe appears after high speed grinding and thinning. To dispel it, lap or polish are needed.

SPECIFICATION

Standard Specification
Machine Model	FD170T		FD220T	FD320T		FD450T
Station Diameter	Φ150 mm / 6 inches		Φ220 mm / 8 inches	Φ320 mm / 12 inches		Φ460 mm / 18 inches
Max. Workpiece Dimension	Φ150×30 mm		Φ220×50 mm	Φ320×50 mm		Φ460×50 mm
Process Thickness	50μm≤N		75μm≤N	95μm≤N		120μm≤N
Grating Resolution	0.5 μm		0.5 μm	0.5 μm		0.5 μm
Number of Station	1		1	1		1
Wheel Rotate Speed	0-3000 rpm		0-3000 rpm	0-3000 rpm		0-3000 rpm
Station Rotate Speed	0-300 rpm		0-300 rpm	0-300 rpm		0-300 rpm
Total Weight	650 kg		850 kg	900 kg		920 kg
Total Floor Space	1200×550 mm		1150×1200 mm	1150×1200 mm		1150×1200 mm
Built-In Optional Kits
Grade		Standard			Advanced
Slurry Recycle System		-			Integrated with PLC
Dressing System		-			Integrated with PLC
Station Fixing		Mechanical Fixture			Pneumatic Vacuum Fixing
Spindle		Mechanical			Pneumatic
*NOTE: the optional kits based on the production requirements, making samples can confirm if they are necessary.

SAMPLE DEMONSTRATION (THINNING)


Patent

About the Company

Ponda is a high-tech enterprise specializing in all kinds of high precision grinding equipment, polishing equipment and itssupporting products and consumable materials
We have a production workshop and testing equipment, assembly workers and mechanical design engineers45 people

Delivery & Packing

Packing Details  : Packing, 1 pcs/carton.

FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.
Q2: Does Ponda charge for making samples?
A: No, it's free to make samples.
Q3: Is Ponda trader or manufacturer?
A: We are manufacturer, certified National High-Tech Enterprise.
Q4: How long does it take machine to deliver?
A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we provide oversea service and online tutorial.
Q6: How many type of machine does Ponda manufacture?
A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries.