China Silicon Wafer High Precision Surface Grinding Machine

Product Details
Customization: Available
After-sales Service: 12months
Warranty: 12months
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  • China Silicon Wafer High Precision Surface Grinding Machine
  • China Silicon Wafer High Precision Surface Grinding Machine
  • China Silicon Wafer High Precision Surface Grinding Machine
  • China Silicon Wafer High Precision Surface Grinding Machine
  • China Silicon Wafer High Precision Surface Grinding Machine
  • China Silicon Wafer High Precision Surface Grinding Machine
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Basic Info.

Model NO.
610
Type
Surface Grinding Machine, Lapping Machine
Processing Object
Flat Workpieces
Abrasives
Grinding Wheel
Controlling Mode
PLC
Automatic Grade
Semiautomatic
Cylindrical Grinder Type
Surface Grinding Machine
Precision
High Precision
Certification
ISO 9001
Condition
New
Power Source
Electricity
Disc(Wheel) Type
Grinding Disc
Variable Speed
with Variable Speed
Application
Grinding Industry
Material
Metal and Non-Metal
Disc Diameter
Φ910 mm
Service
Oversea Setup & After-Sale Avalaible
Class
Single Plate
Process Station
3
Pressure Source
Pneumatic or Weight Block
Plate Material
Metal & Non-Metal
Abrasive
Slurry
Weight
1000kg
Transport Package
Wood Crate
Trademark
PONDA
Origin
China
Production Capacity
500 Unit/Year

Product Description

Why Ponda?
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ceramics, glass, industrial sapphire, plastics, and any other composites.

Mainly applicable:
Widely used in LED sapphire substrate, optical glass wafers, quartz wafers, silicon wafers, sheets, molds, light guide plate, light plate joint valve, hydraulic tight, stainless steel, and other materials of single-side grinding, polishing.
Products Show

China Silicon Wafer High Precision Surface Grinding MachineEquipment features:
1. Grinding disc flatness can reach ±0.01mm; The flatness of the workpiece with a diameter of 50mm can reach 1/4 wavelength.
2. The grinding parts can be pressurized by cylinder, and the pressure can be adjusted;
3. Series grinding machine adopts PLC program control, touch screen operation panel, grinding disk rotation and timing and grinding time can be directly input on the touch screen, speed adjustable, easy to operate
4. Grinding disc adopts water-cooled circulation system, the temperature can be controlled at low temperature, error ±1ºC to solve the problem of heat generated in the grinding process and the workpiece deformation.
5. The pressurized gas has the function of stopping gas protection and locking, which is safe.
6. The equipment is equipped with three work stations (including three sets of weight pressing and self-locking systems), which can simultaneously carry out polishing and grinding processing of three groups of products.
7. Grinding liquid (or coolant) circulation filling system.

APPLICATION
Single
Plate
Lapping
& Polishing
Metal And Alloy
Ceramic
Oxide
Carbide
Glass
Plastic
Nature Stone
Sealing valve and sealing ring(liquid, oil, gas)
Semiconductor LED substrate(Al2O3, Si, SiC)
wafer substrate(Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, ZnO, AlN)
Plastic PE, E/VAC, SBS, SBR, NBR, SR, BR, PR
Phone Frame(flat) back plate
PCB adhesive, coating, circuit
Optics(flat) optical lens, optical reflector, scintillator cube, holographic glass, HUD glass, screen glass
Radar oxide coating plate
Gemstone jade, sapphire, agate, etc.
Others graphite block, gauge block, micrometer gauge, diamond, friction plate, knife, bearing, metal components, and any other precise hardware.
*NOTE: lapping can only remove slight thickness of workpiece. If need ultra thinning (≤100μm), thinner machine are needed.


SPECIFICATION 
Standard Specification
Machine Model FD3803 FD4603 FD6103 FD9104
Plate Diameter Φ380 mm / 15 inches Φ460mm / 18 inches Φ610mm / 24 inches Φ910mm / 36 inches
Max. Workpiece Diameter
(without conditioning ring)
Φ180 mm Φ220 mm Φ270 mm Φ420 mm
Conditioning Ring Diameter Φ180 mm Φ220 mm Φ270 mm Φ420 mm
Number of Station 3 3 3 4
Plate Rotate Speed 0-140 rpm 0-140 rpm 0-120 rpm 0-90 rpm
Facing & Grooving Speed
(Not include in Polishing)
0-120 mm/m 0-120 mm/m 0-120 mm/m 0-120 mm/m
Total Weight 450 kg 780 kg 1000 kg 1600 kg
Total Floor Space 670×940 mm 1030×730 mm 1920×840 mm 2100×1300 mm
Built-In Optional Kits
Grade Standard Upgraded Advanced
Controls Digital Digital Touch-Screen PLC
Pressure Source Hand Weight Block Pneumatic Weight Block
Manual
Pneumatic Press
Integrated with PLC
Slurry Supply System - Manual Digital, Manual
Cylinder Bar Drive System - Manual Integrated with PLC
Conditioning Ring Drive System - Manual Integrated with PLC
Machine Enclosure - Framed by Aluminum Alloy Framed by Metal Plate
*NOTE: the optional kits based on the production requirements, making samples can confirm if they are necessary.


SAMPLE DEMONSTRATION (SINGLE PLATE)
China Silicon Wafer High Precision Surface Grinding Machine
China Silicon Wafer High Precision Surface Grinding Machine

About the Company
China Silicon Wafer High Precision Surface Grinding Machine
China Silicon Wafer High Precision Surface Grinding Machine

Factory front desk
Ponda is a high-tech enterprise specializing in all kinds of high precision grinding equipment, polishing equipment and its
supporting products and consumable materials

China Silicon Wafer High Precision Surface Grinding Machine
China Silicon Wafer High Precision Surface Grinding Machine
Production and assembly shop
We have a production workshop and testing equipment, assembly workers and mechanical design engineers
45 people

Patent
China Silicon Wafer High Precision Surface Grinding Machine

FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.
Q2: Does Ponda charge for making samples?
A: No, it's free to make samples.
Q3: Is Ponda trader or manufacturer?
A: We are manufacturer, certified National High-Tech Enterprise.
Q4: How long does it take machine to deliver?
A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we provide oversea service and online tutorial.
Q6: How many type of machine does Ponda manufacture?
A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries.

 

 

 

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