| Customization: | Available |
|---|---|
| After-sales Service: | Response Within 4 Hours, Reach The Scene Within 48 |
| Warranty: | Response Within 4 Hours, Reach The Scene Within 48 |
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Wafer polishing machines are essential tools in the semiconductor industry. Here are the characteristics, performance, and parameters of wafer polishing machines:
Characteristics:
• High precision: They are designed to achieve extremely smooth and flat wafer surfaces with minimal surface roughness.
• Reliability: Built with durable materials and advanced technology to ensure consistent performance over long periods.
• Versatility: Capable of handling different wafer sizes and materials.
• User-friendly: Equipped with intuitive interfaces and easy-to-operate controls.
Performance:
• Excellent polishing quality: Delivers uniform thickness and surface finish across the entire wafer.
• High throughput: Can process multiple wafers in a short time, increasing production efficiency.
• Stable operation: Minimizes vibrations and fluctuations for accurate polishing.
• Low defect rate: Reduces the occurrence of scratches, pits, and other defects on the wafer surface.
Parameters:
• Polishing speed: Determines how quickly the wafer is polished.
• Pressure control: Allows for precise adjustment of the polishing pressure to achieve the desired surface quality.
• Wafer size compatibility: Specifies the range of wafer diameters that can be processed.
• Power consumption: Indicates the amount of electrical power required for operation.
• Machine dimensions: Gives the physical size of the polishing machine for installation and space planning.
| TERM | PRAMETER |
| Applicable Wafer Size | 2/4/6-inch 4/6/8-inch |
| G.Wheel Diameter | Medium 205 mm |
| G. Wheel R. Speed | 500- 3000 min-1 |
| G. Wheel Motor Power | 5.5kW |
| Max. Travserse Rate | 10 mm/s |
| In-Feed Resolution | 0.1μm/s |
| Feed ing Motor Power | 0.4 kW |
| No. of Worktable | 2 |
| Worktable Rotat. Speed | 0-400 min-1 |
| Thick. Inspect. Accuracy | 0.5μm |
| CCD Position. Accuracy | 2.5μm |
| Chamfering Roundness | ≤10μm |
| Chamfering Angularity | ±0.05° |
| Diameter Control | ≤15μm |
| External Dimension | 1200×1100×2100 |
| Total Weight | 2350kg |
| Wafer | G.Amount | Ne of Wafer | Dia. Before Grind ing | Dia. After Grinding | Roundness Varia tion |
| Sapphire 4-inch | 0.01 mm | 1 | 99.632 | 99.613 | 6 |
| 2 | 99.61 | 99.599 | 7 | ||
| 3 | 99.6 | 99.589 | 7 | ||
| 4 | 99.592 | 99.579 | 4 | ||
| 5 | 99.58 | 99.571 | 4 |
Shenzhen Ponda Grinding Technology Co., Ltd. Was founded in 2007, is located in the Gongming Shangcun Yuanshan Industrial Zone B, is a professional engaged in a variety of high precision grinding equipment, polishing equipment and supporting products and consumption of materials of high-tech enterprises. The company integrates research and development, design, manufacturing, sales and after-sales service. Its products are widely used in optical glass lenses, mobile phone parts, LED sapphire, molds, parts of various communication electronic products, flat metal parts and various hardware industries. Customer base throughout the country and Europe, the United States, Japan and other regions. Its representatives include Huawei, CLP Group; America's Apple, Japan's Dashin, Panasonic; Germany Botu; Taiwan Foxconn and many other well-known Chinese and foreign enterprises. Ponda heretofore supplied more than 60, 000 process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; The substances of metal, SiC wafer, ceramics, glass, industrial sapphire, plastics, and any other composites.
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