Fd-6103p Optical Glass Wafer Polishing Machine

• After-sales Service: 12months
• Warranty: 12months
• Type: Surface Grinding Machine
• Processing Object: Flat Workpieces
• Abrasives: Grinding Wheel
• Controlling Mode: PLC
• Model NO.: FD- 610
• Automatic Grade: Semiautomatic
• Cylindrical Grinder Type: Surface Grinding Machine
• Precision: High Precision
• Certification: ISO 9001
• Condition: New
• Power Source: Electricity
• Disc(Wheel) Type: Grinding Disc
• Working Style: Grain
• Variable Speed: with Variable Speed
• Application: Grinding Industry
• Disc Diameter: Φ610mm
• Service: Oversea Setup & After-Sale Avalaible
• Class: Single Plate
• Process Station: 3
• Pressure Source: Pneumatic or Weight Block
• Plate Material: Metal & Non-Metal
• Abrasive: Slurry
• Transport Package: Wood Crate
• Specification: 1200*1800*2300mm
• Trademark: PONDA
• Origin: China
• Production Capacity: 500 Unit/Year

Product Description

Why Ponda?
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ceramics, glass, industrial sapphire, plastics, and any other composites.

Products Show

High precision grinding machine (with water cooled shaving machine) Equipment features:
1, frequency conversion control, soft start, soft stop, small impact, reduce workpiece damage.
2. The series of grinding machine adopts PLC program control, touch screen operation panel, grinding disk rotation and timing and grinding time can be directly input on the touch screen, the speed is adjustable, easy to operate.
3, the use of imported bearings, motors, to ensure the stability and life of the equipment, to ensure the precision requirements of the workpiece.
4, grinding machine workpiece pressure using weight weight pressure, polishing workpiece surface brightness, no scratch, no scratch, no grain, no pitting, no collapsing edge, high flatness characteristics. After polishing the workpiece surface roughness can reach Ra0.0002; Flatness can be controlled within the range of ±0.002mm.
5. The grinding disc adopts water-cooled circulation system, the temperature can be controlled at low temperature, the error is ±1ºC to solve the problem of heat generated in the grinding process to deform the workpiece.

6, the gravity execution cylinder has a protective locking function (that is, it can maintain the original state in the state of power outage)
7. The equipment is equipped with three stations (including three sets of weight pressing and self-locking systems), which can simultaneously carry out polishing and grinding processing of three groups of products.
8. Grinding liquid (or coolant) circulation filling system;

APPLICATION

Process	Industry by Substance	Industry by Applicability
Single Plate Lapping & Polishing	Metal And Alloy Ceramic Oxide Carbide Glass Plastic Nature Stone	Sealing	valve and sealing ring(liquid, oil, gas)
		Semiconductor	LED substrate(Al2O3, Si, SiC) wafer substrate(Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, ZnO, AlN)
		Plastic	PE, E/VAC, SBS, SBR, NBR, SR, BR, PR
		Phone Frame(flat)	back plate
		PCB	adhesive, coating, circuit
		Optics(flat)	optical lens, optical reflector, scintillator cube, holographic glass, HUD glass, screen glass
		Radar	oxide coating plate
		Gemstone	jade, sapphire, agate, etc.
		Others	graphite block, gauge block, micrometer gauge, diamond, friction plate, knife, bearing, metal components, and any other precise hardware.
*NOTE: lapping can only remove slight thickness of workpiece. If need ultra thinning (≤100μm), thinner machine are needed.

SPECIFICATION 

Standard Specification
Machine Model	FD3803		FD4603		FD6103		FD9104
Plate Diameter	Φ380 mm / 15 inches		Φ460mm / 18 inches		Φ610mm / 24 inches		Φ910mm / 36 inches
Max. Workpiece Diameter (without conditioning ring)	Φ180 mm		Φ220 mm		Φ270 mm		Φ420 mm
Conditioning Ring Diameter	Φ180 mm		Φ220 mm		Φ270 mm		Φ420 mm
Number of Station	3		3		3		4
Plate Rotate Speed	0-140 rpm		0-140 rpm		0-120 rpm		0-90 rpm
Facing & Grooving Speed (Not include in Polishing)	0-120 mm/m		0-120 mm/m		0-120 mm/m		0-120 mm/m
Total Weight	450 kg		780 kg		1000 kg		1600 kg
Total Floor Space	670×940 mm		1030×730 mm		1920×840 mm		2100×1300 mm
*NOTE: the optional kits based on the production requirements, making samples can confirm if they are necessary.

SAMPLE DEMONSTRATION (SINGLE PLATE)




Patent

About the Company

Ponda is a high-tech enterprise specializing in all kinds of high precision grinding equipment, polishing equipment and its
supporting products and consumable materials.
We have a production workshop and testing equipment, assembly workers and mechanical design engineers 45 people

Delivery & Packing
Packing Details  : Packing, 1 pcs/Wooden box.

FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.
Q2: Does Ponda charge for making samples?
A: No, it's free to make samples.
Q3: Is Ponda trader or manufacturer?
A: We are manufacturer, certified National High-Tech Enterprise.
Q4: How long does it take machine to deliver?
A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we provide oversea service and online tutorial.
Q6: How many type of machine does Ponda manufacture?
A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries.