2023 High Precision Wafer Thinning Machine

Product Details
Customization: Available
After-sales Service: 12months
Warranty: 12months
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  • 2023 High Precision Wafer Thinning Machine
  • 2023 High Precision Wafer Thinning Machine
  • 2023 High Precision Wafer Thinning Machine
  • 2023 High Precision Wafer Thinning Machine
  • 2023 High Precision Wafer Thinning Machine
  • 2023 High Precision Wafer Thinning Machine
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Basic Info.

Model NO.
220
Type
Surface Grinding Machine, Surface Grinding Machine
Processing Object
Flat Workpieces
Abrasives
Grinding Wheel
Controlling Mode
PLC
Automatic Grade
Semiautomatic
Cylindrical Grinder Type
Surface Grinding Machine
Precision
High Precision
Certification
ISO 9001
Condition
New
Power Source
Electricity
Disc(Wheel) Type
Grinding Disc
Variable Speed
with Variable Speed
Application
Semiconductor Industry
Working Style
Reduction
Service
Oversea Setup & After-Sale Avalaible
Class
Thinner
Process Station
1
Abrasive
Recyclable Water & Grinding Wheel
Wheel Rotate Speed
0-3000 Rpm
Workpiece Accuracy Control(Parallelism)
1um
Power of Grinding Wheel Motor
5.5kw
Transport Package
Wood Crate
Trademark
PONDA
Origin
China
Production Capacity
500 Unit/Year

Product Description

Why Ponda?
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ceramics, glass, industrial sapphire, plastics, and any other composites.
Products Show
2023 High Precision Wafer Thinning Machine

APPLICATION
Process Industry by Substance Industry by Applicability
High
Speed
Grinding
& Thinning
Metal And Alloy
Ceramic
Oxide
Carbide
Glass
Plastic
Nature Stone
Sealing sealing ring(liquid, oil, gas)
Semiconductor substrate(Al2O3, Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, ZnO, AlN) used in Wafer, LED., etc
Plastic Hard Plastic
Optics(flat) optical lens, optical reflector, holographic glass, HUD glass, screen glass
Gemstone jade, sapphire, agate, etc.
Others gauge block, micrometer gauge, friction plate, metal components, and any other precise hardware.
*NOTE: spiral stripe appears after high speed grinding and thinning. To dispel it, lap or polish are needed.


SPECIFICATION
Standard Specification
Machine Model FD170T FD220T FD320T FD450T
Station Diameter Φ150 mm / 6 inches Φ220 mm / 8 inches Φ320 mm / 12 inches Φ460 mm / 18 inches
Max. Workpiece Dimension Φ150×30 mm Φ220×50 mm Φ320×50 mm Φ460×50 mm
Process Thickness 50μm≤N 75μm≤N 95μm≤N 120μm≤N
Grating Resolution 0.5 μm 0.5 μm 0.5 μm 0.5 μm
Number of Station 1 1 1 1
Wheel Rotate Speed 0-3000 rpm 0-3000 rpm 0-3000 rpm 0-3000 rpm
Station Rotate Speed 0-300 rpm 0-300 rpm 0-300 rpm 0-300 rpm
Total Weight 650 kg 850 kg 900 kg 920 kg
Total Floor Space 1200×550 mm 1150×1200 mm 1150×1200 mm 1150×1200 mm
Built-In Optional Kits
Grade Standard Advanced
Slurry Recycle System - Integrated with PLC
Dressing System - Integrated with PLC
Station Fixing Mechanical Fixture Pneumatic Vacuum Fixing
Spindle Mechanical Pneumatic
*NOTE: the optional kits based on the production requirements, making samples can confirm if they are necessary.


SAMPLE DEMONSTRATION (THINNING)
2023 High Precision Wafer Thinning Machine

2023 High Precision Wafer Thinning Machine
Patent
2023 High Precision Wafer Thinning Machine

About the Company

2023 High Precision Wafer Thinning Machine

Ponda is a high-tech enterprise specializing in all kinds of high precision grinding equipment, polishing equipment and itssupporting products and consumable materials
We have a production workshop and testing equipment, assembly workers and mechanical design engineers45 people

Delivery & Packing
Packing Details  : Packing, 1 pcs/carton.
2023 High Precision Wafer Thinning Machine

FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.

Q2: Does Ponda charge for making samples?
A: No, it's free to make samples.
Q3: Is Ponda trader or manufacturer?
A: We are manufacturer, certified National High-Tech Enterprise.
Q4: How long does it take machine to deliver?
A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we provide oversea service and online tutorial.
Q6: How many type of machine does Ponda manufacture?
A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries. 

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