• Suitable for High-Precision Thinning Machines for Crystal Materials Such as Silicon Wafers and Gallium Arsenide
  • Suitable for High-Precision Thinning Machines for Crystal Materials Such as Silicon Wafers and Gallium Arsenide
  • Suitable for High-Precision Thinning Machines for Crystal Materials Such as Silicon Wafers and Gallium Arsenide
  • Suitable for High-Precision Thinning Machines for Crystal Materials Such as Silicon Wafers and Gallium Arsenide
  • Suitable for High-Precision Thinning Machines for Crystal Materials Such as Silicon Wafers and Gallium Arsenide
  • Suitable for High-Precision Thinning Machines for Crystal Materials Such as Silicon Wafers and Gallium Arsenide

Suitable for High-Precision Thinning Machines for Crystal Materials Such as Silicon Wafers and Gallium Arsenide

After-sales Service: 12months
Warranty: 12months
Type: Surface Grinding Machine, Surface Grinding Machine
Processing Object: Flat Workpieces
Abrasives: Grinding Wheel
Controlling Mode: PLC
Samples:
US$ 0/Piece 1 Piece(Min.Order)
| Request Sample
Customization:
Manufacturer/Factory & Trading Company

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Guangdong, China
Cooperated with Fortune 500
This supplier has Cooperated with Fortune 500 companies
Years of Export Experience
The export experience of the supplier is more than 10 years
Experienced Team
The supplier has 15 foreign trading staff(s) and 13 staff(s) with over 6 years of overseas trading experience
R&D Capabilities
The supplier has 10 R&D engineers, you can check the Audit Report for more information
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Basic Info.

Model NO.
FD-300
Automatic Grade
Semiautomatic
Cylindrical Grinder Type
Surface Grinding Machine
Precision
High Precision
Certification
ISO 9001
Condition
New
Power Source
Electricity
Disc(Wheel) Type
Grinding Disc
Variable Speed
with Variable Speed
Application
Semiconductor Industry
Service
Oversea Setup & After-Sale Avalaible
Class
Thinner
Process Station
1
Abrasive
Recyclable Water & Grinding Wheel
Wheel Rotate Speed
0-3000 Rpm
Workpiece Accuracy Control(Parallelism)
1um
Power of Grinding Wheel Motor
5.5kw
Transport Package
Wood Crate
Trademark
PONDA
Origin
China
Production Capacity
500 Unit/Year

Product Description

Why Ponda?
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ceramics, glass, industrial sapphire, plastics, and any other composites.
Scope of application:
This equipment is mainly used for thinning of silicon wafer, gallium arsenide, silicon carbide ceramics, zirconia ceramics, sapphire and other substrate materials.
Vertical cutting grinding.

Products Show
Suitable for High-Precision Thinning Machines for Crystal Materials Such as Silicon Wafers and Gallium Arsenide

Equipment structure:
The equipment is mainly composed of frame, air spindle, porous ceramic suction cup (suitable for various types of tension rings), vacuum spindle deceleration motor, static pressure air suspension electric spindle, diamond grinding wheel,
Screw guide module, full closed loop servo control system, cutting fluid circulation system, etc.
Equipment characteristics
1. The vacuum spindle is made of 603 stainless steel material, which is not easily affected by thermal expansion and leads to the precision of grinding size, and the bearing is made of AFK brand.
2. Vacuum suction cups are divided into microporous ceramic suction cups and special stainless steel gas slots, which can be selected according to product requirements.
3. The vacuum spindle is driven by precision reducer and servo motor.
4. The rotor of the static pressure gas suspension spindle adopts zirconia ceramic, which completely avoids the heat transmitted from the motor to cause the gas film gap to be too large after the expansion of the air float rotor and reduces the rigidity of the spindle. The equipment using the spindle has high precision and good stability.
5. Screw guide module adopts high precision and high preloading type.
6. Full closed-loop grating control system: In order to ensure the servo motor to the precision of the grinding wheel feed monitoring and repair, with the cooperation of this system, the product processing accuracy can be within 0.002mm.
7. Grinding fluid circulation system: The grinding fluid in the production process continues to cool the workpiece, grinding wheel and electric spindle through the circulation system, and the grinding fluid can also improve the self-sharpness of the grinding wheel.
8. Note: The equipment can be optional contact online detection system, online size measurement system using Marposs and other brands of contact online measuring instrument, the resolution can reach 0.1um, the actual control size accuracy can reach 0.5um.


 APPLICATION
Process Industry by Substance Industry by Applicability
High
Speed
Grinding
& Thinning
Metal And Alloy
Ceramic
Oxide
Carbide
Glass
Plastic
Nature Stone
Sealing sealing ring(liquid, oil, gas)
Semiconductor substrate(Al2O3, Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, ZnO, AlN) used in Wafer, LED., etc
Plastic Hard Plastic
Optics(flat) optical lens, optical reflector, holographic glass, HUD glass, screen glass
Gemstone jade, sapphire, agate, etc.
Others gauge block, micrometer gauge, friction plate, metal components, and any other precise hardware.
*NOTE: spiral stripe appears after high speed grinding and thinning. To dispel it, lap or polish are needed.


SPECIFICATION
Technical parameter
Dimensions of vacuum sucker  Ø260mm, Ø305mm, Ø360mm
Suction cup speed (continuously adjustable)  0-300rpm/min
Suction cup motor power  1.5KW
Grating control system resolution  0.0001mm
Grinding wheel speed (adjustable)  0-3000rpm/min
Grinding wheel spindle power  11kw
Parallelism after product thinning  ±0.002mm(Φ100mm)
Thickness error after product thinning  ±0.002mm(Φ100mm)
Flatness after product thinning  ±0.003mm(Φ100mm)
Minimum product thinning thickness  ≥0.05mm/Φ100mm
weight  2350KG
Overall dimensions of equipment  1200*1100*2100mm
 
Built-In Optional Kits
Grade Standard Advanced
Slurry Recycle System - Integrated with PLC
Dressing System - Integrated with PLC
Station Fixing Mechanical Fixture Pneumatic Vacuum Fixing
Spindle Mechanical Pneumatic
*NOTE: the optional kits based on the production requirements, making samples can confirm if they are necessary.


SAMPLE DEMONSTRATION (THINNING)
Suitable for High-Precision Thinning Machines for Crystal Materials Such as Silicon Wafers and Gallium Arsenide

Suitable for High-Precision Thinning Machines for Crystal Materials Such as Silicon Wafers and Gallium Arsenide
Patent
Suitable for High-Precision Thinning Machines for Crystal Materials Such as Silicon Wafers and Gallium Arsenide

About the Company

Suitable for High-Precision Thinning Machines for Crystal Materials Such as Silicon Wafers and Gallium Arsenide

Ponda is a high-tech enterprise specializing in all kinds of high precision grinding equipment, polishing equipment and itssupporting products and consumable materials
We have a production workshop and testing equipment, assembly workers and mechanical design engineers45 people

Delivery & Packing
Packing Details  : Packing, 1 pcs/carton.

Suitable for High-Precision Thinning Machines for Crystal Materials Such as Silicon Wafers and Gallium Arsenide
FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.
Q2: Does Ponda charge for making samples?
A: No, it's free to make samples.
Q3: Is Ponda trader or manufacturer?
A: We are manufacturer, certified National High-Tech Enterprise.
Q4: How long does it take machine to deliver?
A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we provide oversea service and online tutorial.
Q6: How many type of machine does Ponda manufacture?
A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries.

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Diamond Member Since 2021

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Manufacturer/Factory & Trading Company
Registered Capital
1.48 Million USD
Plant Area
11500 square meters