| After-sales Service: | 12months |
|---|---|
| Warranty: | 12months |
| Type: | Surface Grinding Machine, Wafer Chamfering Machine |
| Processing Object: | Flat Workpieces |
| Abrasives: | Grinding Wheel |
| Controlling Mode: | PLC |
| Samples: |
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| Customization: |
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Audited Supplier The FDC wafer edge grinder is mainly used for edge chamfering of wafers. During the manufacturing process of chips, there may be issues with unevenness and sharpness at the edges, which may affect subsequent processing and use. Using a wafer edge rounding machine can round the edges of the wafer to make them more uniform and smooth, while removing sharp edges and reducing damage to subsequent processes and equipment.
The benefits of edge grinding (chamfering) mainly include the following three aspects.
1. Prevent wafer edge fragmentation. During the manufacturing and use of wafers, they are often hit by robotic arms, which can cause the edges of the wafer to crack and form stress concentrated areas.These stress concentrated areas will cause the wafer to continuously release polluting particles during use,This in turn affects the yield of the product.
2.Prevent the concentration of thermal stress. Wafers undergo numerous high-temperature processes during use, such as oxidation and diffusion, when the thermal stress generated in these processes exceeds that of the silicon lattice.When the strength is high, dislocation and stacking fault defects will occur, and grain edge rounding can avoid such defects.Produced at the crystal edge.
3.Increase the flatness of the epitaxial layer and photoresist layer at the edge of the wafer. In the epitaxial process, the growth rate of sharp corner areas is higher than that of flat areas, therefore, using ungrounded wafers is prone to protrusions at the edges. Similarly, when using a rotary coating machine to apply photoresist, the photoresist solution will also accumulate at the edges of the wafer, and these uneven edges will affect the accuracy of the mask focusing.
| TERM | PRAMETER |
| Applicable Wafer Size | 2/4/6-inch 4/6/8-inch |
| G.Wheel Diameter | Medium 205 mm |
| G. Wheel R. Speed | 500- 3000 min-1 |
| G. Wheel Motor Power | 1kW |
| Max. Travserse Rate | 10 mm/s |
| In-Feed Resolution | 0.5μm/s |
| Feed ing Motor Power | 0.4 kW |
| No. of Worktable | 2 |
| Worktable Rotat. Speed | 0-400 min-1 |
| Thick. Inspect. Accuracy | 0.5μm |
| CCD Position. Accuracy | 2.5μm |
| Chamfering Roundness | ≤10μm |
| Chamfering Angularity | ±0.05° |
| Diameter Control | ≤15μm |
| External Dimension | 2000×1150×1950 |
| Total Weight | 1000 kg |
| Wafer | G.Amount | Ne of Wafer | Dia. Before Grind ing | Dia. After Grinding | Roundness Varia tion |
| Sapphire 4-inch | 0.01 mm | 1 | 99.632 | 99.613 | 6 |
| 2 | 99.61 | 99.599 | 7 | ||
| 3 | 99.6 | 99.589 | 7 | ||
| 4 | 99.592 | 99.579 | 4 | ||
| 5 | 99.58 | 99.571 | 4 |
Shenzhen Ponda Grinding Technology Co., Ltd. Was founded in 2007, is located in the Gongming Shangcun Yuanshan Industrial Zone B, is a professional engaged in a variety of high precision grinding equipment, polishing equipment and supporting products and consumption of materials of high-tech enterprises. The company integrates research and development, design, manufacturing, sales and after-sales service. Its products are widely used in optical glass lenses, mobile phone parts, LED sapphire, molds, parts of various communication electronic products, flat metal parts and various hardware industries. Customer base throughout the country and Europe, the United States, Japan and other regions. Its representatives include Huawei, CLP Group; America's Apple, Japan's Dashin, Panasonic; Germany Botu; Taiwan Foxconn and many other well-known Chinese and foreign enterprises. Ponda heretofore supplied more than 60, 000 process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; The substances of metal, SiC wafer, ceramics, glass, industrial sapphire, plastics, and any other composites.
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