Fonda High Precision Equipment Plane Polishing Machine Single Plane Polishing Equipment Wafer Single Side Polishing Processing

• Customization: Available
• After-sales Service: 12months
• Warranty: 12months
• Model NO.: FD-610LX-3Q
• Processing Object: Flat Workpieces
• Abrasives: Grinding Wheel
• Controlling Mode: PLC
• Automatic Grade: Semiautomatic
• Cylindrical Grinder Type: Surface Grinding Machine
• Precision: High Precision
• Certification: ISO 9001
• Condition: New
• Sales Service: Engineers Available to Service Machinery Overseas
• Service: Oversea Setup & After-Sale Avalaible
• Class: Grinding
• Process Station: 1
• Abrasive: Recyclable Water & Grinding Wheel
• Workpiece Accuracy Control(Parallelism): 1um
• Power of Grinding Wheel Motor: 5.5kw
• Transport Package: Wood Crate
• Trademark: PONDA
• Origin: China
• Production Capacity: 500 Unit/Year

Product Description

Why Ponda?
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ceramics, glass, industrial sapphire, plastics, and any other composites.
ProductsW

Scope of application:
Widely used in LED sapphire substrate, all kinds of ceramic products, quartz wafers, silicon wafers, germanium wafers, molybdenum wafers, silicon carbide, lithium tantalate and other materials single-side polishing.



Equipment principle:
The polishing machine is a precision polishing equipment, the polished product is placed on the polishing disc, the polishing disc rotates against the clock, the workpiece rotates itself, the workpiece is pressed by the cylinder pressure, and the workpiece is relative rotating friction with the polishing disc to achieve the purpose of polishing.

 

Configuration and Advantages:
1. Automatic circulation liquid supply system is adopted.
2, the workpiece pressure using cylinder pressure, the pressure is adjustable; The cylinder has the function of preventing air loss to ensure personal and equipment safety.
3, using PLC+ touch screen control system, the rotation speed of the disc, air pressure and timing can be directly input on the control panel.
4, the equipment is set up a station (including a set of cylinder pressure), can be polishing 1 group of products at the same time.
5, with water cooling system, can cool the polishing liquid.
6, with the disc surface temperature measurement system, can be real-time temperature measurement of the disc surface, convenient temperature control, effectively prevent the temperature of the product caused by excessive damage.
7. The surface of the polished workpiece has the characteristics of high brightness, no scratch, no material grain, no pitting, no collapsing edge, etc.

APPLICATION

Process	Industry by Substance	Industry by Applicability
High Speed Grinding & Thinning	Metal And Alloy Ceramic Oxide Carbide Glass Plastic Nature Stone	Sealing	sealing ring(liquid, oil, gas)
		Semiconductor	substrate(Al2O3, Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, ZnO, AlN) used in Wafer, LED., etc
		Plastic	Hard Plastic
		Optics(flat)	optical lens, optical reflector, holographic glass, HUD glass, screen glass
		Gemstone	jade, sapphire, agate, etc.
		Others	gauge block, micrometer gauge, friction plate, metal components, and any other precise hardware.
*NOTE: spiral stripe appears after high speed grinding and thinning. To dispel it, lap or polish are needed.

SPECIFICATION

Standard Specification
Machine Model	FD170T		FD220T	FD320T		FD450T
Station Diameter	Φ150 mm / 6 inches		Φ220 mm / 8 inches	Φ320 mm / 12 inches		Φ460 mm / 18 inches
Max. Workpiece Dimension	Φ150×30 mm		Φ220×50 mm	Φ320×50 mm		Φ460×50 mm
Process Thickness	50μm≤N		75μm≤N	95μm≤N		120μm≤N
Grating Resolution	0.5 μm		0.5 μm	0.5 μm		0.5 μm
Number of Station	1		1	1		1
Wheel Rotate Speed	0-3000 rpm		0-3000 rpm	0-3000 rpm		0-3000 rpm
Station Rotate Speed	0-300 rpm		0-300 rpm	0-300 rpm		0-300 rpm
Total Weight	650 kg		850 kg	900 kg		920 kg
Total Floor Space	1200×550 mm		1150×1200 mm	1150×1200 mm		1150×1200 mm
Built-In Optional Kits
Grade		Standard			Advanced
Slurry Recycle System		-			Integrated with PLC
Dressing System		-			Integrated with PLC
Station Fixing		Mechanical Fixture			Pneumatic Vacuum Fixing
Spindle		Mechanical			Pneumatic
*NOTE: the optional kits based on the production requirements, making samples can confirm if they are necessary.

SAMPLE DEMONSTRATION (THINNING)


Patent

About the Company

Ponda is a high-tech enterprise specializing in all kinds of high precision grinding equipment, polishing equipment and itssupporting products and consumable materials
We have a production workshop and testing equipment, assembly workers and mechanical design engineers45 people

Delivery and packing
Packing Instructions: Packing, 1 / wooden box.

FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.
Q2: Does Ponda charge for making samples?
A: No, it's free to make samples.
Q3: Is Ponda trader or manufacturer?
A: We are manufacturer, certified National High-Tech Enterprise.
Q4: How long does it take machine to deliver?
A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we provide oversea service and online tutorial.
Q6: How many type of machine does Ponda manufacture?
A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries.