• China High Precision Plane Double Sided Grinding and Polishing Machine
  • China High Precision Plane Double Sided Grinding and Polishing Machine
  • China High Precision Plane Double Sided Grinding and Polishing Machine
  • China High Precision Plane Double Sided Grinding and Polishing Machine
  • China High Precision Plane Double Sided Grinding and Polishing Machine
  • China High Precision Plane Double Sided Grinding and Polishing Machine

China High Precision Plane Double Sided Grinding and Polishing Machine

After-sales Service: 12months
Warranty: 12months
Type: Surface Grinding Machine, Surface Grinding Machine
Processing Object: Flat Workpieces
Abrasives: Grinding Wheel
Controlling Mode: PLC
Samples:
US$ 0/Piece 1 Piece(Min.Order)
| Request Sample
Customization:
Manufacturer/Factory & Trading Company

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Diamond Member Since 2021

Suppliers with verified business licenses

Guangdong, China
Cooperated with Fortune 500
This supplier has Cooperated with Fortune 500 companies
Years of Export Experience
The export experience of the supplier is more than 10 years
Experienced Team
The supplier has 15 foreign trading staff(s) and 13 staff(s) with over 6 years of overseas trading experience
R&D Capabilities
The supplier has 10 R&D engineers, you can check the Audit Report for more information
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Basic Info.

Model NO.
FD-13-6B
Automatic Grade
Semiautomatic
Cylindrical Grinder Type
Surface Grinding Machine
Precision
High Precision
Certification
ISO 9001
Condition
New
Power Source
Electricity
Disc(Wheel) Type
Grinding Disc
Material
Metal
Variable Speed
with Variable Speed
Application
Grinding Industry
Service
Oversea Setup & After-Sale Avalaible
Class
Double Plate
Process Station
3-5
Pressure Source
Pneumatic
Plate Material
Metal and Non-Metal
Abrasive
Lapping Slurry
Transport Package
Wood Crate
Trademark
PONDA
Origin
China
Production Capacity
500 Unit/Year

Product Description

Why Ponda?
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, wafer substrate, ceramics, glass, industrial sapphire, plastics, and any other composites.
Main uses of the equipment:
The equipment is mainly used for grinding and polishing the upper and lower parallel end faces of sapphire substrate, silicon wafer, ceramic sheet, optical glass, quartz crystal, other semiconductor materials and other hard brittle materials of non-metal and metal thin precision parts.
Products Show
China High Precision Plane Double Sided Grinding and Polishing Machine
Main machine accuracy:
 
1. The end face of the downcast disc pulsates
  2. Toss the flatness of the optical disc up and down.
  3. The radial pulsation of the solar wheel is 0.06mm.
  4. Radial runout of gear ring is 0.12mm.

Machining accuracy:
 
1. The parallelism and flatness of the correction wheel after polishing are 0.0035mm.
  2. Workpiece flatness/parallelism 0.003mm/φ100mm.

Processing capacity
  1. Single socket size 8 pieces /φ75mm,5 pieces /φ100mm.
  2. The whole plate bearing size 48 pieces /φ75mm, 30 pieces /φ100mm.
Double motor and double frequency conversion drive; Wuxi Hengda high temperature variable frequency motor. The main motor (9KW/1440rpm) drives the upper and lower grinding disks and gear rings; Use the auxiliary motor (1.5KW/1440rpm) to drive the sun wheel. The secondary motor and the main motor are proportionally synchronized in speed regulation.
Equipped with automatic lubrication equipment for gear lubrication.
This equipment can set and store 30 sets of different process parameters (pressure, speed, time, turn number) for users to choose.
Equipped with the main cylinder end lock mechanism, can conveniently and safely lock the upper grinding disc.


APPLICATION
Process Industry by Substance Industry by Applicability
Double
Plate
Lapping
& Polishing
Metal And Alloy
Ceramic
Oxide
Carbide
Glass
Plastic
Nature Stone
Sealing valve and sealing ring(liquid, oil, gas)
Semiconductor LED substrate(Al2O3, Si, SiC)
wafer substrate(Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, ZnO, AlN)
Plastic PE, E/VAC, SBS, SBR, NBR, SR, BR, PR
Optics(flat) optical lens, optical reflector, scintillator cube, holographic glass, HUD glass, screen glass
Gemstone jade, sapphire, agate, etc.
Others graphite block, gauge block, micrometer gauge, diamond, friction plate, knife, bearing, metal components, and any other precise hardware.
*NOTE: lapping can only remove slight thickness of workpiece. If need ultra thinning(≤100μm), thinner machine are needed.

SPECIFICATION 
Standard Specification
Machine Model FD6B FD9B FD13-6B
Lower Plate Diameter Φ386 mm / 15 inches Φ640 mm / 25 inches Φ973 mm / 38 inches
Upper Plate Diameter Φ386 mm / 15 inches Φ640 mm / 25 inches Φ973 mm / 38 inches
Star Wheel Parameter DP 12, Z=66, A=20° DP 12, Z=108, A=20° DP 19.3, Z=152, A=20°
Conditioning Ring Parameter DP 12, Z=66, A=20° DP 12, Z=108, A=20° DP 19.3, Z=152, A=20°
Max. Workpiece Diameter Φ120 mm Φ180 mm Φ290 mm
Process Thickness 0.2mm≤N≤20mm 0.2mm≤N≤25mm 0.2mm≤N≤30mm
Number of Station 3≤N≤5 3≤N≤5 3≤N≤5
Plate Rotate Speed 0-60 rpm 0-60 rpm 0-50 rpm
Total Weight 600 kg 2000 kg 3200 kg
Total Floor Space 700×950 mm 1350x960 mm 1700×1380 mm
Built-In Optional Kits
Grade Standard Advanced
Slurry Supply System - Integrated with PLC
Facing and Grooving System - Integrated with PLC
Machine Enclosure - Framed by Metal Plate
*NOTE: the optional kits based on the production requirements, making samples can confirm if they are necessary.

SAMPLE DEMONSTRATION (DOUBLE PLATE)
China High Precision Plane Double Sided Grinding and Polishing Machine
Patent
China High Precision Plane Double Sided Grinding and Polishing Machine

About the Company

China High Precision Plane Double Sided Grinding and Polishing Machine

Ponda is a high-tech enterprise specializing in all kinds of high precision grinding equipment, polishing equipment and itssupporting products and consumable materials
We have a production workshop and testing equipment, assembly workers and mechanical design engineers45 people

Delivery & Packing
Packing Details  : Packing, 1 pcs/carton.
China High Precision Plane Double Sided Grinding and Polishing Machine

FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.
Q2: Does Ponda charge for making samples?
A: No, it's free to make samples.
Q3: Is Ponda trader or manufacturer?
A: We are manufacturer, certified National High-Tech Enterprise.
Q4: How long does it take machine to deliver?
A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we provide oversea service and online tutorial.
Q6: How many type of machine does Ponda manufacture?
A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries.

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Diamond Member Since 2021

Suppliers with verified business licenses

Manufacturer/Factory & Trading Company
Registered Capital
1.48 Million USD
Plant Area
11500 square meters