High Precision Cylindrical Grinding and Polishing Machine for All Kinds of Cylindrical Materials

• After-sales Service: 12months
• Warranty: 12months
• Type: Surface Grinding Machine
• Processing Object: Flat Workpieces
• Abrasives: Grinding Wheel
• Controlling Mode: Pcl
• Model NO.: FD-150LP
• Automatic Grade: Semiautomatic
• Cylindrical Grinder Type: Surface Grinding Machine
• Precision: High Precision
• Certification: ISO 9001
• Condition: New
• Power Source: Electricity
• Disc(Wheel) Type: Grinding Disc
• Variable Speed: with Variable Speed
• Application: Various Types of Fiber Core Cylinder
• Working Style: Cylindrical Grinding and Polishing
• Service: Oversea Setup & After-Sale Avalaible
• Process Station: 3-5
• Pressure Source: Pneumatic
• Plate Material: Metal and Non-Metal
• Abrasive: Lapping Slurry
• Transport Package: Wood Crate
• Trademark: PONDA
• Origin: China
• Production Capacity: 500 Unit/Year

Product Description

Why Ponda?
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, wafer substrate, ceramics, glass, industrial sapphire, plastics, and any other composites.

Main uses:
This machine is mainly used for grinding or polishing silicon wafer, quartz wafer, optical crystal, glass, sapphire on both sides.
Products Show

Cylindrical equipment features:
1, grinding work speed regulation: inverter to achieve speed regulation.
2, grinding working time and working pressure: according to the needs of the grinding workpiece to set grinding working time and working pressure, different workpieces and different materials need different time.
3, the lifting speed of the upper spindle can be adjusted arbitrarily; The upper spindle is equipped with a function to prevent the air from falling off to ensure personal and equipment safety.

Main uses:
Mainly used for all kinds of fiber core cylinder grinding and polishing, but also suitable for all kinds of metal, ceramics, crystal glass, quartz products and other materials cylinder grinding and polishing, after grinding cylindricity can be controlled within 0.0005mm.

APPLICATION

Process	Industry by Substance	Industry by Applicability
Double Plate Lapping & Polishing	Metal And Alloy Ceramic Oxide Carbide Glass Plastic Nature Stone	Sealing	valve and sealing ring(liquid, oil, gas)
		Semiconductor	LED substrate(Al2O3, Si, SiC) wafer substrate(Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, ZnO, AlN)
		Plastic	PE, E/VAC, SBS, SBR, NBR, SR, BR, PR
		Optics(flat)	optical lens, optical reflector, scintillator cube, holographic glass, HUD glass, screen glass
		Gemstone	jade, sapphire, agate, etc.
		Others	graphite block, gauge block, micrometer gauge, diamond, friction plate, knife, bearing, metal components, and any other precise hardware.
*NOTE: lapping can only remove slight thickness of workpiece. If need ultra thinning(≤100μm), thinner machine are needed.

SPECIFICATION 

Standard Specification
Grinding disc size			f300mm/f200mm
Main power supply			Three-phase 380V
Main motor power of lower spindle is			0.75KW
Lower spindle motor speed			0-95RPM
The main motor power of the upper plate is			0.4KW
Top plate main motor speed			0-95RPM
Timing range			99 minutes and 59 seconds
Work station			1
Total weight			700kg
Overall dimension			1160*910*1930mm
Built-In Optional Kits
Grade		Standard		Advanced
Slurry Supply System		-		Integrated with PLC
Facing and Grooving System		-		Integrated with PLC
Machine Enclosure		-		Framed by Metal Plate
*NOTE: the optional kits based on the production requirements, making samples can confirm if they are necessary.

SAMPLE DEMONSTRATION (DOUBLE PLATE)

About the Company

Production and assembly shop

We have a production workshop and testing equipment, assembly workers and mechanical design engineers
45 people
 

Delivery & Packing
Packing Details  : Packing, 1 pcs/carton.

FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.
Q2: Does Ponda charge for making samples?
A: No, it's free to make samples.
Q3: Is Ponda trader or manufacturer?
A: We are manufacturer, certified National High-Tech Enterprise.
Q4: How long does it take machine to deliver?
A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we provide oversea service and online tutorial.
Q6: How many type of machine does Ponda manufacture?
A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries.