Why Ponda?
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ceramics, glass, industrial sapphire, plastics, and any other composites.
Products Show
High precision transverse grinding machine equipment features:
1. The thickness of 150 wafer can be reduced to 0.08mm thick without breaking. And the parallelism and flatness can be controlled within the range of ±0.002mm.
2. High thinning efficiency, LED sapphire substrate grinding speed can be reduced by up to 48 microns per minute. Silicon wafers can be thinned up to 250 microns per minute.
3. Series grinding machine adopts CNC program control system, touch screen operation panel.
Principle of high precision transverse grinding machine equipment:
1. This series of transverse thinning grinding machine is full-automatic precision grinding equipment, which is rotated in the opposite direction by the vacuum sucker or electromagnetic sucker and the grinding wheel. The grinding wheel swings back and forth. The grinding resistance is small, the workpiece will not be damaged, and the grinding efficiency is high.
2. The equipment can automatically check the grinding torque, and automatically adjust the workpiece grinding speed, so as to prevent the workpiece from deformation and damage due to excessive pressure in the grinding process, and automatically compensate the grinding wheel wear thickness.
APPLICATION
Process |
Industry by Substance |
Industry by Applicability |
Single Plate Lapping & Polishing |
Metal And Alloy Ceramic Oxide Carbide Glass Plastic Nature Stone |
Sealing |
valve and sealing ring(liquid, oil, gas) |
Semiconductor |
LED substrate(Al2O3, Si, SiC) wafer substrate(Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, ZnO, AlN) |
Plastic |
PE, E/VAC, SBS, SBR, NBR, SR, BR, PR |
Phone Frame(flat) |
back plate |
PCB |
adhesive, coating, circuit |
Optics(flat) |
optical lens, optical reflector, scintillator cube, holographic glass, HUD glass, screen glass |
Radar |
oxide coating plate |
Gemstone |
jade, sapphire, agate, etc. |
Others |
graphite block, gauge block, micrometer gauge, diamond, friction plate, knife, bearing, metal components, and any other precise hardware. |
*NOTE: lapping can only remove slight thickness of workpiece. If need ultra thinning (≤100μm), thinner machine are needed. |
SPECIFICATION
Standard Specification |
Model number |
YM-150WH |
YM-180WH |
YM-200WH |
YM-230WH |
YM-300WH |
Diamond grinding wheel dimensions |
Diameter 150*H25 |
Diameter 180*H25 |
The diameter is 200*H30 |
The diameter is 230*H30 |
The diameter is 300*H30 |
Maximum size of workpiece |
Diameter 150mm |
Diameter 180mm |
Diameter 200mm |
Diameter 230mm |
Diameter 300mm |
Workpiece speed (adjustable) |
0---1000rpm |
0---1000rpm |
0---800rpm |
0---800rpm |
0---800rpm |
Grinding wheel speed (adjustable) |
0---2000rpm |
0---2000rpm |
0---1800rpm |
0---1800rpm |
0---1800rpm |
Motor power of grinding wheel |
1.5kw.380 V,3 phase. |
1.5kw.380 V,3 phase. |
2.2kw.380v,3 phases |
2.2kw.380v,3 phases |
2.2kw.380v,3 phases |
Sucker spindle motor power |
0.75kw.380v.3 phase |
0.75kw.380v.3 phase |
0.75kw.380v.3 phase |
0.75kw.380v.3 phase |
1.1kw.380v,3 phases |
Control accuracy (parallelism) |
1um(diameter 100mm) |
1um(diameter 100mm) |
1um(diameter 100mm) |
1um(diameter 100mm) |
1um(diameter 100mm) |
Overall dimension |
1200*550*1550 |
1200*550*1550 |
1350*600*1600 |
1350*600*1600 |
1500*700*1650 |
Built-In Optional Kits |
Grade |
Standard |
Advanced |
Slurry Recycle System |
- |
Integrated with PLC |
Dressing System |
- |
Integrated with PLC |
Station Fixing |
Mechanical Fixture |
Pneumatic Vacuum Fixing |
Spindle |
Mechanical |
Pneumatic |
*NOTE: the optional kits based on the production requirements, making samples can confirm if they are necessary. |
SAMPLE DEMONSTRATION (SINGLE PLATE)
Patent
Factory front desk
Ponda is a high-tech enterprise specializing in all kinds of high precision grinding equipment, polishing equipment and its
supporting products and consumable materials
Production and assembly shop
We have a production workshop and testing equipment, assembly workers and mechanical design engineers
45 people
Delivery & Packing
Packing Details : Packing, 1 pcs/carton.
FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.
Q2: Does Ponda charge for making samples?
A: No, it's free to make samples.
Q3: Is Ponda trader or manufacturer?
A: We are manufacturer, certified National High-Tech Enterprise.
Q4: How long does it take machine to deliver?
A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we provide oversea service and online tutorial.
Q6: How many type of machine does Ponda manufacture?
A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries.