• Wafer Thinning Ceramic Silicon Carbide Precision Thinning Machine
  • Wafer Thinning Ceramic Silicon Carbide Precision Thinning Machine
  • Wafer Thinning Ceramic Silicon Carbide Precision Thinning Machine
  • Wafer Thinning Ceramic Silicon Carbide Precision Thinning Machine
  • Wafer Thinning Ceramic Silicon Carbide Precision Thinning Machine
  • Wafer Thinning Ceramic Silicon Carbide Precision Thinning Machine

Wafer Thinning Ceramic Silicon Carbide Precision Thinning Machine

After-sales Service: 12months
Warranty: 12months
Type: Surface Grinding Machine
Processing Object: Flat Workpieces
Abrasives: Grinding Wheel
Controlling Mode: PLC
Samples:
US$ 0/Piece 1 Piece(Min.Order)
| Request Sample
Customization:
Manufacturer/Factory & Trading Company

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Diamond Member Since 2021

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Guangdong, China
Cooperated with Fortune 500
This supplier has Cooperated with Fortune 500 companies
Years of Export Experience
The export experience of the supplier is more than 10 years
Experienced Team
The supplier has 15 foreign trading staff(s) and 13 staff(s) with over 6 years of overseas trading experience
R&D Capabilities
The supplier has 10 R&D engineers, you can check the Audit Report for more information
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Basic Info.

Automatic Grade
Semiautomatic
Cylindrical Grinder Type
Surface Grinding Machine
Precision
High Precision
Certification
ISO 9001
Condition
New
Power Source
Electricity
Disc(Wheel) Type
Grinding Disc
Variable Speed
with Variable Speed
Application
Semiconductor Industry
Disc Diameter
220mm
Service
Oversea Setup & After-Sale Avalaible
Class
Thinner
Process Station
1
Abrasive
Recyclable Water & Grinding Wheel
Wheel Rotate Speed
0-3000 Rpm
Workpiece Accuracy Control(Parallelism)
1um
Power of Grinding Wheel Motor
5.5kw
Transport Package
Wood Crate
Trademark
PONDA
Origin
China
Production Capacity
500 Unit/Year

Product Description

Why Ponda?
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ceramics, glass, industrial sapphire, plastics, and any other composites.

Products Show
The equipment is mainly used for the thinning of silicon wafers, ceramics, germanium wafers, gallium arsenide, lithium niobate, quartz glass and other crystal materials.
Wafer Thinning Ceramic Silicon Carbide Precision Thinning Machine
This machine is mainly composed of vacuum sucker, sucker spindle, sucker drive mechanism, grinding wheel, grinding wheel and servo drive motor, grinding wheel feed mechanism, system full closed-loop control system, etc.
The diameter of the grinding wheel is 312mm, the grinding wheel adopts diamond grinding wheel, and the selection of the particle size of the grinding wheel is customized according to the requirements of the customer.
The grinding wheel spindle adopts precision rotating spindle, and the driving mode is frequency conversion speed regulation. The speed can be changed according to different process requirements by the drive mode supported by the PLC control system.

Control mode:
1, the machine adopts advanced international famous brand PLC and touch screen, high degree of automation, human-machine interface, simple operation at a glance.
2, the air pressure pressure detection sensor, when the air pressure is less than the minimum pressure required for normal processing set by the equipment, the equipment alarms to prevent the workpiece from sucking fast.
3, grinding wheel torque control, when the torque is higher than the equipment set by the normal processing of the torque generated by the equipment alarm, to prevent equipment abnormal or misoperation of the knife damage machine accessories.
4, grinding wheel current monitoring, when the cold grinding wheel is higher than the equipment set the maximum current generated by normal processing of the grinding wheel rebound, rebound distance can be adjusted to prevent the grinding wheel extrusion workpiece damage.
5, the automatic compensation of the grinding wheel loss, to prevent the consumption of the grinding wheel in the grinding product at the same time affecting the processing accuracy of the workpiece.
6, the equipment can be selected according to customer needs to install the grinding wheel online dressing function.
7, the equipment can be selected according to customer needs to install online thickness measurement function.
Wafer Thinning Ceramic Silicon Carbide Precision Thinning Machine
The machine adopts high precision screw and guide rail components, the driving mode is driven by servo fully closed ring control system, according to different materials of the workpiece and process requirements by PLC control mode and the corresponding change of screw speed, that is, the grinding wheel feed speed, the control feed accuracy is detected by high resolution grating ruler.



SPECIFICATION
Standard Specification
Machine Model FD170T FD220T FD320T FD450T
Station Diameter Φ150 mm / 6 inches Φ220 mm / 8 inches Φ320 mm / 12 inches Φ460 mm / 18 inches
Max. Workpiece Dimension Φ150×30 mm Φ220×50 mm Φ320×50 mm Φ460×50 mm
Process Thickness 50μm≤N 75μm≤N 95μm≤N 120μm≤N
Grating Resolution 0.5 μm 0.5 μm 0.5 μm 0.5 μm
Number of Station 1 1 1 1
Wheel Rotate Speed 0-3000 rpm 0-3000 rpm 0-3000 rpm 0-3000 rpm
Station Rotate Speed 0-300 rpm 0-300 rpm 0-300 rpm 0-300 rpm
Total Weight 650 kg 850 kg 900 kg 920 kg
Total Floor Space 1200×550 mm 1150×1200 mm 1150×1200 mm 1150×1200 mm
Built-In Optional Kits
Grade Standard Advanced
Slurry Recycle System - Integrated with PLC
Dressing System - Integrated with PLC
Station Fixing Mechanical Fixture Pneumatic Vacuum Fixing
Spindle Mechanical Pneumatic
*NOTE: the optional kits based on the production requirements, making samples can confirm if they are necessary.


SAMPLE DEMONSTRATION (THINNING)

Wafer Thinning Ceramic Silicon Carbide Precision Thinning Machine
Patent
Wafer Thinning Ceramic Silicon Carbide Precision Thinning Machine

About the Company

Wafer Thinning Ceramic Silicon Carbide Precision Thinning Machine

Ponda is a high-tech enterprise specializing in all kinds of high precision grinding equipment, polishing equipment and itssupporting products and consumable materials
We have a production workshop and testing equipment, assembly workers and mechanical design engineers45 people

Delivery & Packing
Packing Details  : Packing, 1 pcs/carton.
Wafer Thinning Ceramic Silicon Carbide Precision Thinning Machine

FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.

Q2: Does Ponda charge for making samples?
A: No, it's free to make samples.
Q3: Is Ponda trader or manufacturer?
A: We are manufacturer, certified National High-Tech Enterprise.
Q4: How long does it take machine to deliver?
A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we provide oversea service and online tutorial.
Q6: How many type of machine does Ponda manufacture?
A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries. 

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Diamond Member Since 2021

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Manufacturer/Factory & Trading Company
Registered Capital
1.48 Million USD
Plant Area
11500 square meters