• High Precision Double-Sided Grinding Machine for Silicon Carbide Wafer
  • High Precision Double-Sided Grinding Machine for Silicon Carbide Wafer
  • High Precision Double-Sided Grinding Machine for Silicon Carbide Wafer
  • High Precision Double-Sided Grinding Machine for Silicon Carbide Wafer
  • High Precision Double-Sided Grinding Machine for Silicon Carbide Wafer
  • High Precision Double-Sided Grinding Machine for Silicon Carbide Wafer

High Precision Double-Sided Grinding Machine for Silicon Carbide Wafer

After-sales Service: 12months
Warranty: 12months
Type: Surface Grinding Machine
Processing Object: Flat Workpieces
Abrasives: Grinding Wheel
Controlling Mode: PLC
Samples:
US$ 0/Piece 1 Piece(Min.Order)
| Request Sample
Customization:
Manufacturer/Factory & Trading Company

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Guangdong, China
Cooperated with Fortune 500
This supplier has Cooperated with Fortune 500 companies
Years of Export Experience
The export experience of the supplier is more than 10 years
Experienced Team
The supplier has 15 foreign trading staff(s) and 13 staff(s) with over 6 years of overseas trading experience
R&D Capabilities
The supplier has 10 R&D engineers, you can check the Audit Report for more information
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Basic Info.

Model NO.
FD-6105XS
Automatic Grade
Semiautomatic
Cylindrical Grinder Type
Surface Grinding Machine
Precision
High Precision
Certification
ISO 9001
Condition
New
Power Source
Electricity
Disc(Wheel) Type
Grinding Disc
Variable Speed
with Variable Speed
Material
Metal and Non-Metal
Service
Oversea Setup & After-Sale Avalaible
Class
Single Plate
Process Station
3
Pressure Source
Pneumatic or Weight Block
Abrasive
Slurry
Transport Package
Wood Crate
Trademark
PONDA
Origin
China
Production Capacity
500 Unit/Year

Product Description

Why Ponda?
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ceramics, glass, industrial sapphire, plastics, and any other composites.

Mainly applicable:
Widely used in LED sapphire substrate, optical glass wafers, quartz wafers, silicon wafers, sheets, molds, light guide plate, light plate joint valve, hydraulic tight, stainless steel, and other materials of single-side grinding, polishing.
Products Show
High Precision Double-Sided Grinding Machine for Silicon Carbide Wafer
This equipment is mainly used for silicon carbide, sapphire substrate, fine grinding ceramics, tungsten steel sheet, precision metal valve plate and other products of double-sided grinding.
How it works:
This series of grinding machine for ultra-high precision grinding equipment, the upper and lower grinding disk do opposite direction rotation, the workpiece between the upper and lower grinding disk to do both revolution and rotation star movement. The grinding resistance is small, the workpiece is not damaged, and the production efficiency of uniform grinding on both sides is high.

Features:
1. The upper and lower grinding disks of this series of grinding machines can be repaired by repairing disk machines.
2, the use of dual motor synchronous operation, variable speed range is wider, higher motion accuracy, faster response speed, can adapt to different grinding materials and grinding process requirements, to achieve soft start, soft stop, speed stability, small impact.
3. The shaving machine is driven by the decelerating motor, which can ensure the sliding of the hydraulic suspended guide rail is more stable and the plane dressing effect is better.
4, the use of imported PLC program controller, control the action of the whole machine, high degree of automation, display the current state of the whole machine, man-machine dialogue, operation at a glance.
5, the use of frequency conversion speed regulation, belt or chain drive, so that the whole machine starts smoothly, stable operation, especially at low speed operation, to overcome the upper and lower grinding disk movement, crawling phenomenon.
6, the use of pneumatic actuator and pneumatic control components supporting, to achieve grinding disc light pressure, medium pressure, high pressure, fine and other four stages of pressure stepless adjustment, for grinding workpiece to provide better grinding efficiency and a wider range of grinding process options.
7, the equipment can set and store 30 sets of different process parameters (pressure, speed, time) for the user to choose.


SPECIFICATION 
Standard Specification
Grinding disc specification Φ610xΦ235x30mm
Ring height 20mm
Main motor Y132M-4 3.7KW
Auxiliary machine Y90L-4 3.7KW
Planetary wheel specification DP12 Z=85 α=20°
Lower grinding disc speed 0-50RPM
Number of planetary wheels placed n 3≤N≤5
Air cylinder Φ100x350mm
Liquid supply system motor AB-100 250W
Grinding workpiece thickness b 0.2mm≤b ≤20mm
Ideal specification of grinding workpiece Φ 80 mm
Maximum size of grinding workpiece Φ 210 mm
Equipment quality 1800kg
Equipment size 1050x950x2450mm(L x W x H)
*NOTE: the optional kits based on the production requirements, making samples can confirm if they are necessary.

SAMPLE DEMONSTRATION (SINGLE PLATE)
High Precision Double-Sided Grinding Machine for Silicon Carbide Wafer
High Precision Double-Sided Grinding Machine for Silicon Carbide Wafer

About the Company

High Precision Double-Sided Grinding Machine for Silicon Carbide WaferPonda is a high-tech enterprise specializing in all kinds of high precision grinding equipment, polishing equipment and its
supporting products and consumable materials.

We have a production workshop and testing equipment, assembly workers and mechanical design engineers 45 people.

Patent
High Precision Double-Sided Grinding Machine for Silicon Carbide WaferWooden case packing
High Precision Double-Sided Grinding Machine for Silicon Carbide Wafer

FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.
Q2: Does Ponda charge for making samples?
A: No, it's free to make samples.
Q3: Is Ponda trader or manufacturer?
A: We are manufacturer, certified National High-Tech Enterprise.
Q4: How long does it take machine to deliver?
A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we provide oversea service and online tutorial.
Q6: How many type of machine does Ponda manufacture?
A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries.

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