Why Ponda?
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ceramics, glass, industrial sapphire, plastics, and any other composites.
Main uses:
The equipment is mainly used for high speed thinning of thin precision parts of hard brittle materials such as sapphire substrate, silicon wafer, ceramic sheet, optical glass, quartz crystal and other semiconductor materials.
Products Show
High precision grinding machine features:
1, frequency conversion control, soft start, soft stop, small impact, reduce workpiece damage.
2, using the timing function to control the time, processing products can be pre-set on the panel time and speed, working time to set time, the machine automatically stops working, can better control the size of the product.
3, grinding machine workpiece pressure using weight weight pressure, polishing workpiece surface brightness, no scratch, no scratch, no material grain, no pitting, no edge collapse, high flatness characteristics. After polishing, the workpiece surface roughness can reach Ra0.002.
4, the use of interval automatic liquid spraying device, can freely set the liquid spraying interval time, grinding liquid can be evenly sprayed on the grinding plate, to achieve the stability of the workpiece. Reduce grinding time, save the cost of consumables, but also meet the requirements of the environment.
5, the use of imported bearings, motor, to ensure the stability and life of the equipment, to ensure the precision requirements of the workpiece.
6, grinding disc flatness can reach ±0.002mm; The flatness of the workpiece with a diameter of 50mm can reach 1/4 wavelength. The flatness of the workpiece after processing can reach ±0.0005mm.
APPLICATION
| Process |
Industry by Substance |
Industry by Applicability |
High
Speed
Grinding
& Thinning |
Metal And Alloy
Ceramic
Oxide
Carbide
Glass
Plastic
Nature Stone |
Sealing |
sealing ring(liquid, oil, gas) |
| Semiconductor |
substrate(Al2O3, Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, ZnO, AlN) used in Wafer, LED., etc |
| Plastic |
Hard Plastic |
| Optics(flat) |
optical lens, optical reflector, holographic glass, HUD glass, screen glass |
| Gemstone |
jade, sapphire, agate, etc. |
| Others |
gauge block, micrometer gauge, friction plate, metal components, and any other precise hardware. |
| *NOTE: spiral stripe appears after high speed grinding and thinning. To dispel it, lap or polish are needed. |
SPECIFICATION
| Standard Specification |
| Machine Model |
FD170T |
FD220T |
FD320T |
FD450T |
| Station Diameter |
Φ150 mm / 6 inches |
Φ220 mm / 8 inches |
Φ320 mm / 12 inches |
Φ460 mm / 18 inches |
| Max. Workpiece Dimension |
Φ150×30 mm |
Φ220×50 mm |
Φ320×50 mm |
Φ460×50 mm |
| Process Thickness |
50μm≤N |
75μm≤N |
95μm≤N |
120μm≤N |
| Grating Resolution |
0.5 μm |
0.5 μm |
0.5 μm |
0.5 μm |
| Number of Station |
1 |
1 |
1 |
1 |
| Wheel Rotate Speed |
0-3000 rpm |
0-3000 rpm |
0-3000 rpm |
0-3000 rpm |
| Station Rotate Speed |
0-300 rpm |
0-300 rpm |
0-300 rpm |
0-300 rpm |
| Total Weight |
650 kg |
850 kg |
900 kg |
920 kg |
| Total Floor Space |
1200×550 mm |
1150×1200 mm |
1150×1200 mm |
1150×1200 mm |
| Built-In Optional Kits |
| Grade |
Standard |
Advanced |
| Slurry Recycle System |
- |
Integrated with PLC |
| Dressing System |
- |
Integrated with PLC |
| Station Fixing |
Mechanical Fixture |
Pneumatic Vacuum Fixing |
| Spindle |
Mechanical |
Pneumatic |
| *NOTE: the optional kits based on the production requirements, making samples can confirm if they are necessary. |
SAMPLE DEMONSTRATION (THINNING)
About the Company
Factory front desk
Ponda is a high-tech enterprise specializing in all kinds of high precision grinding equipment, polishing equipment and its
supporting products and consumable materials
Production and assembly shop
We have a production workshop and testing equipment, assembly workers and mechanical design engineers
45 people
Patent
FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.
Q2: Does Ponda charge for making samples?
A: No, it's free to make samples.
Q3: Is Ponda trader or manufacturer?
A: We are manufacturer, certified National High-Tech Enterprise.
Q4: How long does it take machine to deliver?
A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we provide oversea service and online tutorial.
Q6: How many type of machine does Ponda manufacture?
A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries.
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