• Professional Design Custom High-Quality Equipment Glass Wafer Surface Grinder
  • Professional Design Custom High-Quality Equipment Glass Wafer Surface Grinder
  • Professional Design Custom High-Quality Equipment Glass Wafer Surface Grinder
  • Professional Design Custom High-Quality Equipment Glass Wafer Surface Grinder
  • Professional Design Custom High-Quality Equipment Glass Wafer Surface Grinder
  • Professional Design Custom High-Quality Equipment Glass Wafer Surface Grinder

Professional Design Custom High-Quality Equipment Glass Wafer Surface Grinder

After-sales Service: 12months
Warranty: 12months
Type: Surface Grinding Machine, Lapping Machine
Processing Object: Flat Workpieces
Abrasives: Grinding Wheel
Controlling Mode: PLC
Samples:
US$ 0/Piece 1 Piece(Min.Order)
| Request Sample
Customization:
Manufacturer/Factory & Trading Company

360° Virtual Tour

Diamond Member Since 2021

Suppliers with verified business licenses

Guangdong, China
Cooperated with Fortune 500
This supplier has Cooperated with Fortune 500 companies
Years of Export Experience
The export experience of the supplier is more than 10 years
Experienced Team
The supplier has 15 foreign trading staff(s) and 13 staff(s) with over 6 years of overseas trading experience
R&D Capabilities
The supplier has 10 R&D engineers, you can check the Audit Report for more information
to see all verified strength labels (26)

Basic Info.

Model NO.
FD- 700A
Automatic Grade
Semiautomatic
Cylindrical Grinder Type
Surface Grinding Machine
Precision
High Precision
Certification
ISO 9001, ISO 9001
Condition
New
Power Source
Electricity
Disc(Wheel) Type
Grinding Disc
Working Style
Grain
Variable Speed
with Variable Speed
Application
Grinding Industry
Material
Metal and Non-Metal
Disc Diameter
Φ910mm
Service
Oversea Setup & After-Sale Avalaible
Class
Single Plate
Process Station
3
Pressure Source
Pneumatic or Weight Block
Plate Material
Metal & Non-Metal
Abrasive
Slurry
Transport Package
Wood Crate
Specification
1200*1800*2300mm
Trademark
PONDA
Origin
China
Production Capacity
500 Unit/Year

Product Description

Why Ponda?
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ceramics, glass, industrial sapphire, plastics, and any other composites.

Products Show
Professional Design Custom High-Quality Equipment Glass Wafer Surface Grinder
Principle and characteristics of equipment:
1. This equipment is a single-side precision polishing equipment, which adopts advanced mechanical structure and a variety of advanced control methods. It has high polishing efficiency and stable operation.
2. The whole machine adopts PLC+ touch screen control system, the equipment parameter setting and operation is simple and convenient, the system running stability is high.
3. The main motor adopts frequency conversion speed control to realize soft start and stop of the host, reduce the impact of equipment operation and reduce the damage of the workpiece.

4. The workpiece grinding pressure adopts the whole cylinder pressure mode, and realizes the closed-loop control of pressure through the electric proportional valve control, to ensure the high pressure accuracy and stability.
5. The upper pressure plate is actively driven by servomotor to ensure the uniformity of polishing processing at each station on the premise of ensuring the polishing speed of the product.
6. The cooling water cooling function is set on the disc and the pressure plate to ensure the maximum efficiency of the polishing liquid and reduce the deformation of the polishing plate.


APPLICATION
Process Industry by Substance Industry by Applicability
Single
Plate
Lapping
& Polishing
Metal And Alloy
Ceramic
Oxide
Carbide
Glass
Plastic
Nature Stone
Sealing valve and sealing ring(liquid, oil, gas)
Semiconductor LED substrate(Al2O3, Si, SiC)
wafer substrate(Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, ZnO, AlN)
Plastic PE, E/VAC, SBS, SBR, NBR, SR, BR, PR
Phone Frame(flat) back plate
PCB adhesive, coating, circuit
Optics(flat) optical lens, optical reflector, scintillator cube, holographic glass, HUD glass, screen glass
Radar oxide coating plate
Gemstone jade, sapphire, agate, etc.
Others graphite block, gauge block, micrometer gauge, diamond, friction plate, knife, bearing, metal components, and any other precise hardware.
*NOTE: lapping can only remove slight thickness of workpiece. If need ultra thinning (≤100μm), thinner machine are needed.


SPECIFICATION 
Standard Specification
Disc throwing specifications Ø 700 * 160 * 12.7 mm Disc diameter Ø 305 mm
Disc pressure 30~150kg Pressure mode Cylinder pressure
Working air pressure 0.4-0.6 MPa Workpiece disk speed 5·60rpm (max)
Grinding disc speed 0-120rpm Main motor power 7.5 KW / 380 v
Press plate motor power 0.4 KW / 380 vx4 Main motor speed 100rpm (max)
Number of equipment stations 4 Equipment dimensions 1200x1700x2300mm
Equipment weight 2300KG    
Built-In Optional Kits
Grade Standard Upgraded Advanced
Controls Digital Digital Touch-Screen PLC
Pressure Source Hand Weight Block Pneumatic Weight Block
Manual
Pneumatic Press
Integrated with PLC
Slurry Supply System - Manual Digital, Manual
Cylinder Bar Drive System - Manual Integrated with PLC
Conditioning Ring Drive System - Manual Integrated with PLC
Machine Enclosure - Framed by Aluminum Alloy Framed by Metal Plate
*NOTE: the optional kits based on the production requirements, making samples can confirm if they are necessary.

SAMPLE DEMONSTRATION (SINGLE PLATE)
Professional Design Custom High-Quality Equipment Glass Wafer Surface Grinder
Professional Design Custom High-Quality Equipment Glass Wafer Surface Grinder


Patent
Professional Design Custom High-Quality Equipment Glass Wafer Surface Grinder
About the Company
Professional Design Custom High-Quality Equipment Glass Wafer Surface Grinder
Ponda is a high-tech enterprise specializing in all kinds of high precision grinding equipment, polishing equipment and itssupporting products and consumable materials.
We have a production workshop and testing equipment, assembly workers and mechanical design engineers45 people

Delivery & Packing
Packing Details  : Packing, 1 pcs/carton.

Professional Design Custom High-Quality Equipment Glass Wafer Surface Grinder


FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.
Q2: Does Ponda charge for making samples?
A: No, it's free to make samples.
Q3: Is Ponda trader or manufacturer?
A: We are manufacturer, certified National High-Tech Enterprise.
Q4: How long does it take machine to deliver?
A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we provide oversea service and online tutorial.
Q6: How many type of machine does Ponda manufacture?
A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries.

 

 

 

Send your message to this supplier

*From:
*To:
*Message:

Enter between 20 to 4,000 characters.

This is not what you are looking for? Post a Sourcing Request Now

You Might Also Like

Diamond Member Since 2021

Suppliers with verified business licenses

Manufacturer/Factory & Trading Company
Registered Capital
1.48 Million USD
Plant Area
11500 square meters