for Crystal Materials Such as Gallium Arsenide Semi-Automatic Thinning Machines

Product Description

Why Ponda?
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ceramics, glass, industrial sapphire, plastics, and any other composites.
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Pangda has a professional thinning machine that can rapidly reduce the size of silicon wafers, and the thickness can be reduced to 50um. After thinning, there are corresponding equipment for grinding and polishing processing, which can achieve the perfect mirror effect.

SPECIFICATION

Standard Specification
Model number	YM-150WH	YM-180WH	YM-200WH	YM-230WH	YM-300WH
Diamond grinding wheel dimensions	Diameter 150*H25	Diameter 180*H25	The diameter is 200*H30	The diameter is 230*H30	The diameter is 300*H30
Maximum size of workpiece	Diameter 150mm	Diameter 180mm	Diameter 200mm	Diameter 230mm	Diameter 300mm
Workpiece speed (adjustable)	0---1000rpm	0---1000rpm	0---800rpm	0---800rpm	0---800rpm
Grinding wheel speed (adjustable)	0---2000rpm	0---2000rpm	0---1800rpm	0---1800rpm	0---1800rpm
Motor power of grinding wheel	1.5kw.380 V,3 phase.	1.5kw.380 V,3 phase.	2.2kw.380v,3 phases	2.2kw.380v,3 phases	2.2kw.380v,3 phases
Sucker spindle motor power	0.75kw.380v.3 phase	0.75kw.380v.3 phase	0.75kw.380v.3 phase	0.75kw.380v.3 phase	1.1kw.380v,3 phases
Control accuracy (parallelism)	1um(diameter 100mm)	1um(diameter 100mm)	1um(diameter 100mm)	1um(diameter 100mm)	1um(diameter 100mm)
Overall dimension	1200*550*1550	1200*550*1550	1350*600*1600	1350*600*1600	1500*700*1650

Built-In Optional Kits
Grade		Standard			Advanced
Slurry Recycle System		-			Integrated with PLC
Dressing System		-			Integrated with PLC
Station Fixing		Mechanical Fixture			Pneumatic Vacuum Fixing
Spindle		Mechanical			Pneumatic
*NOTE: the optional kits based on the production requirements, making samples can confirm if they are necessary.

Chip for device

 

Scope of application:
Widely used in LED sapphire substrate, optical glass wafers, quartz wafers, silicon wafers, sheets, molds, light guides, light joint and other materials of single-side grinding, polishing.

SAMPLE DEMONSTRATION (THINNING)


Patent

About the Company

Ponda is a high-tech enterprise specializing in all kinds of high precision grinding equipment, polishing equipment and itssupporting products and consumable materials
We have a production workshop and testing equipment, assembly workers and mechanical design engineers45 people

Delivery & Packing

Packing Details  : Packing, 1 pcs/carton.


FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.
Q2: Does Ponda charge for making samples?
A: No, it's free to make samples.
Q3: Is Ponda trader or manufacturer?
A: We are manufacturer, certified National High-Tech Enterprise.
Q4: How long does it take machine to deliver?
A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we provide oversea service and online tutorial.
Q6: How many type of machine does Ponda manufacture?
A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries.