Ultra-Precision Double-Side Grinding and Polishing Equipment for Sapphire, Silicon Wafer

• Customization: Available
• After-sales Service: 12months
• Warranty: 12months
• Model NO.: 6BL
• Type: Surface Grinding Machine
• Processing Object: Flat Workpieces
• Abrasives: Grinding Wheel
• Controlling Mode: Pcl
• Automatic Grade: Semiautomatic
• Cylindrical Grinder Type: Surface Grinding Machine
• Precision: High Precision
• Certification: ISO 9001
• Condition: New
• Power Source: Electricity
• Disc(Wheel) Type: Grinding Disc
• Material: Metal
• Variable Speed: with Variable Speed
• Application: Grinding Industry
• Service: Oversea Setup & After-Sale Avalaible
• Class: Double Plate
• Process Station: 3-5
• Pressure Source: Pneumatic
• Plate Material: Metal and Non-Metal
• Abrasive: Lapping Slurry
• Transport Package: Wood Crate
• Trademark: PONDA
• Origin: China
• Production Capacity: 500 Unit/Year
• Package Size: 700.00cm * 950.00cm * 1950.00cm
• Package Gross Weight: 600.000kg

Product Description

Why Ponda?
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, wafer substrate, ceramics, glass, industrial sapphire, plastics, and any other composites.
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Main features of double-sided machine
1, the use of AC inverter motor drive, soft start, soft stop, stable and reliable.
2, grinding machine adopts four stages of pressure, that is, light pressure, medium pressure, heavy pressure, repair operation process
3, the column grinding machine adopts torsion operation, frequency conversion speed regulation, the motor speed and running time can be directly input on the control panel.
4, oil pressure lifting gear ring [Microsoft user 1], very stable.
5, the upper plate is separately set with a slow drop cylinder, not only effectively prevent the fragile workpiece from breaking, but also independent pressure control.

6, through the use of electronic preset counter, the number of grinding cycles, requirements can be accurately controlled.
7. Diamond dressing wheel can be used to repair the disc.
8. The large size design of the drive shaft enhances the rigidity of the shaft, thereby eliminating the jitter caused by insufficient rigidity.

This machine is mainly used for grinding or polishing silicon wafer, quartz wafer, optical crystal, glass, sapphire on both sides

SPECIFICATION 

Standard Specification
Machine Model	FD6B		FD9B		FD13-6B
Lower Plate Diameter	Φ386 mm / 15 inches		Φ640 mm / 25 inches		Φ973 mm / 38 inches
Upper Plate Diameter	Φ386 mm / 15 inches		Φ640 mm / 25 inches		Φ973 mm / 38 inches
Star Wheel Parameter	DP 12, Z=66, A=20°		DP 12, Z=108, A=20°		DP 19.3, Z=152, A=20°
Conditioning Ring Parameter	DP 12, Z=66, A=20°		DP 12, Z=108, A=20°		DP 19.3, Z=152, A=20°
Max. Workpiece Diameter	Φ120 mm		Φ180 mm		Φ290 mm
Process Thickness	0.2mm≤N≤20mm		0.2mm≤N≤25mm		0.2mm≤N≤30mm
Number of Station	3≤N≤5		3≤N≤5		3≤N≤5
Plate Rotate Speed	0-60 rpm		0-60 rpm		0-50 rpm
Total Weight	600 kg		2000 kg		3200 kg
Total Floor Space	700×950 mm		1550x960 mm		1700×1380 mm
Built-In Optional Kits
Grade		Standard		Advanced
Slurry Supply System		-		Integrated with PLC
Facing and Grooving System		-		Integrated with PLC
Machine Enclosure		-		Framed by Metal Plate
*NOTE: the optional kits based on the production requirements, making samples can confirm if they are necessary.

SAMPLE DEMONSTRATION (DOUBLE PLATE)

Patent

About the Company

Ponda is a high-tech enterprise specializing in all kinds of high precision grinding equipment, polishing equipment and itssupporting products and consumable materials
We have a production workshop and testing equipment, assembly workers and mechanical design engineers45 people

Delivery & Packing

Packing Details  : Packing, 1 pcs/carton.


FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.
Q2: Does Ponda charge for making samples?
A: No, it's free to make samples.
Q3: Is Ponda trader or manufacturer?
A: We are manufacturer, certified National High-Tech Enterprise.
Q4: How long does it take machine to deliver?
A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we provide oversea service and online tutorial.
Q6: How many type of machine does Ponda manufacture?
A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries.