Ponda Can Customize New CNC Silicon Wafer High Speed Thinning Machine

Product Description

Why Ponda?
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ceramics, glass, industrial sapphire, plastics, and any other composites.
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The thinning equipment is mainly used for high speed thinning of precision parts of non-metal and metal brittle and hard materials such as silicon wafer, ceramic, glass, quartz crystal, sapphire, other semiconductor materials. It is composed of a workpiece sucker, a sucker spindle and a drive assembly, a grinding wheel, a grinding wheel spindle and a drive assembly, a lead rail feed assembly and other auxiliary accessories.

The machine adopts high precision screw and guide rail components, the driving mode is servo drive, according to different materials of the workpiece and process requirements by the PLC controlled drive mode and the corresponding change of screw speed, that is, the grinding wheel feed speed, the speed is adjustable from 0.001-5mm/min, the control feed accuracy is detected by high resolution grating ruler.
This machine adopts advanced Taiwan brand PLC and touch screen, high degree of automation, man-machine dialogue, simple operation.

 

Suction cups can be divided into electromagnetic suction cups and vacuum suction cups according to customer process requirements. The size of suction cups can be customized according to customer needs, with a diameter of 320-600mm.
The driving mode of the sucker spindle is frequency conversion speed regulation, counterclockwise rotation, the speed of the sucker spindle is adjustable from 3-140 RPM, and the speed of the sucker can be changed according to different process requirements by the drive mode supported by the PLC control system.

SPECIFICATION

Model	FD-A150WH
Diamond grinding wheel dimensions	Diameter 150 × Thickness 25
Max Workpiece Machining Size	Diameter 170 mm
Workpiece Rotation Speed (Adjustable)	0-1000 rpm
Grinding Wheel Rotation Speed (Adjustable)	0-2000 rpm
Grinding Wheel Motor Power	1.5 kW, 380 V, 3-Phase
Suction Chuck Spindle Motor Power	0.75 kW, 380 V, 3-Phase
Control Accuracy (Parallelism)	1 μm (for 100 mm diameter workpiece)
Overall Dimension	1200 × 550 × 1550 mm
Weight	760kg

SAMPLE DEMONSTRATION (THINNING)


Patent

About the Company

Ponda is a high-tech enterprise specializing in all kinds of high precision grinding equipment, polishing equipment and itssupporting products and consumable materials
We have a production workshop and testing equipment, assembly workers and mechanical design engineers45 people

Delivery & Packing

Packing Details  : Packing, 1 pcs/carton.

FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.
Q2: Does Ponda charge for making samples?
A: No, it's free to make samples.
Q3: Is Ponda trader or manufacturer?
A: We are manufacturer, certified National High-Tech Enterprise.
Q4: How long does it take machine to deliver?
A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we provide oversea service and online tutorial.
Q6: How many type of machine does Ponda manufacture?
A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries.